ACM Research Announces Order for SAPS Evaluation Tool from Major Global Semiconductor Manufacturer
ACM Research, Inc. (ACMR) announced an order for its Ultra C SAPS frontside cleaning tool from a major global semiconductor manufacturer. This unit will be installed in the client's China-based development fab in Q1 2022. CEO Dr. David Wang highlighted the significance of this evaluation order, noting its potential to enhance the customer’s R&D capabilities and production processes. The SAPS technology provides uniform megasonic energy application for thorough cleaning without damaging devices.
- Received order for Ultra C SAPS frontside cleaning tool from a major semiconductor manufacturer.
- Potential for larger business opportunities with the client and others in the region.
- None.
FREMONT, Calif., Oct. 18, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced the receipt of an evaluation tool order for its Ultra C SAPS frontside cleaning tool from a major global semiconductor manufacturer. The tool is expected to be installed in the prospective customer’s China-based development fab in the first quarter of 2022.
“This order represents a great opportunity for ACM from a global semiconductor company with operations in China,” said Dr. David Wang, President and Chief Executive Officer of ACM Research. “The manufacturer chose to evaluate ACM’s SAPS technology to assess its ability to enhance the manufacturer’s R&D capability and production processes. We believe a successful evaluation of this tool could lead to larger business opportunities with this customer and other major customers in the region.”
ACM’s proprietary Space Alternated Phase Shift (SAPS) advanced wafer cleaning technology employs alternating phases of megasonic waves in the gap between a megasonic transducer and the wafer. Unlike the stationary megasonic transducers used in previous generations of megasonic wafer cleaning systems, SAPS technology moves or tilts the transducer while the wafer rotates, enabling megasonic energy to be delivered uniformly across all points on the wafer, even if the wafer is warped. SAPS is a faster process than conventional megasonic cleaning, does not experience material loss or create a rough wafer surface. SAPS achieves more thorough, comprehensive cleaning without damage to device features and has been demonstrated to 10nm and beyond.
About ACM Research, Inc.
ACM develops, manufactures and sells semiconductor process equipment for single-wafer or batch wet cleaning, electroplating, stress-free polishing and thermal processes, which are critical to advanced semiconductor device manufacturing and wafer-level packaging. The company is committed to delivering customized, high performance, cost-effective process solutions that semiconductor manufacturers can use in numerous manufacturing steps to improve productivity and product yield. For more information, visit www.acmrcsh.com.
SAPS, ULTRA C SAPS and the ACM logo are trademarks of ACM Research, Inc. All rights reserved.
| Media Contact: | Company Contacts: |
| Jillian Carapella | USA |
| Kiterocket | Sally-Ann Henry |
| +1 646.402.2408 | ACM Research, Inc. |
| jcarapella@kiterocket.com | +1 510.445.3700 |
| China | |
| Xi Wang | |
| ACM Research (Shanghai), Inc. | |
| +86 21 50808868 | |
| Korea | |
| YY Kim | |
| ACM Research (Korea), Inc. | |
| +821041415171 | |
| Taiwan | |
| David Chang | |
| +886 921999884 | |
| Singapore | |
| Adrian Ong | |
| +65 8813-1107 |
FAQ
What is the significance of ACMR's recent order for the Ultra C SAPS tool?
When will the Ultra C SAPS cleaning tool be installed?
What technology does ACMR's Ultra C SAPS tool use?
Which company placed the order for ACMR's cleaning tool?
