Valens Semiconductor to Display a High-Performance Connectivity Solution for Next-Generation Single-Use Endoscopes at Medica 2024
Valens Semiconductor (NYSE: VLN) will unveil innovative connectivity solutions at Medica 2024, including a chip for advanced endoscopes based on the VA7000 chipset. This chip offers exceptional EMC reliability during electrosurgery, high-resolution video, and low power consumption, making it ideal for single-use endoscopy. The disposable endoscope market in the US is growing at a 17% CAGR and is expected to reach USD 7.32 billion by 2030. Valens will also display the VS6320 and VS3000 chipsets for USB3.2 and human-machine interface extensions. Valens' solutions will be showcased at the Israeli Pavilion, Hall 15, Stand #E30, from November 11-14.
Valens Semiconductor (NYSE: VLN) presenterà soluzioni innovative per la connettività a Medica 2024, tra cui un chip per endoscopi avanzati basato sul chipset VA7000. Questo chip offre un'eccezionale affidabilità EMC durante la chirurgia elettrosurgica, video ad alta risoluzione e un basso consumo energetico, rendendolo ideale per endoscopia monouso. Il mercato degli endoscopi monouso negli Stati Uniti sta crescendo a un tasso annuo composto (CAGR) del 17% e si prevede che raggiunga i 7,32 miliardi di USD entro il 2030. Valens mostrerà anche i chipset VS6320 e VS3000 per estensioni USB3.2 e interfacce uomo-macchina. Le soluzioni di Valens saranno esposte al Padiglione israeliano, Hall 15, Stand #E30, dal 11 al 14 novembre.
Valens Semiconductor (NYSE: VLN) presentará soluciones innovadoras de conectividad en Medica 2024, incluyendo un chip para endoscopios avanzados basado en el chipset VA7000. Este chip ofrece una confiabilidad EMC excepcional durante la electrocirugía, video de alta resolución y bajo consumo de energía, lo que lo hace ideal para endoscopios de un solo uso. El mercado de endoscopios desechables en EE. UU. está creciendo a una tasa compuesta anual (CAGR) del 17% y se espera que alcance los 7.32 mil millones de USD para 2030. Valens también exhibirá los chipsets VS6320 y VS3000 para extensiones USB3.2 y interfaces hombre-máquina. Las soluciones de Valens se mostrarán en el Pabellón israelí, Hall 15, Stand #E30, del 11 al 14 de noviembre.
발렌스 반도체 (NYSE: VLN)는 메디카 2024에서 VA7000 칩셋을 기반으로 한 고급 내시경용 칩을 포함한 혁신적인 연결 솔루션을 공개할 예정입니다. 이 칩은 전기 수술 중 뛰어난 EMC 신뢰성, 고해상도 비디오 및 낮은 전력 소모를 제공하여 단일 사용 내시경에 적합합니다. 미국의 일회용 내시경 시장은 연평균 성장률(CAGR) 17%로 성장하고 있으며, 2030년까지 73.2억 달러에 이를 것으로 예상됩니다. 발렌스는 또한 USB3.2 및 인간-기계 인터페이스 확장을 위한 VS6320 및 VS3000 칩셋을 전시할 것입니다. 발렌스의 솔루션은 이스라엘관, Hall 15, Stand #E30에서 11월 11일부터 14일까지 전시됩니다.
Valens Semiconductor (NYSE: VLN) présentera des solutions de connectivité innovantes à Medica 2024, y compris une puce pour des endoscopes avancés basée sur le chipset VA7000. Cette puce offre une fiabilité EMC exceptionnelle pendant la chirurgie électrochirurgicale, une vidéo haute résolution et une faible consommation d'énergie, ce qui la rend idéale pour l'endoscopie à usage unique. Le marché des endoscopes jetables aux États-Unis croît à un taux de croissance annuel composé (CAGR) de 17 % et devrait atteindre 7,32 milliards de dollars américains d'ici 2030. Valens présentera également les chipsets VS6320 et VS3000 pour des extensions USB3.2 et des interfaces homme-machine. Les solutions de Valens seront exposées au pavillon israélien, Hall 15, Stand #E30, du 11 au 14 novembre.
Valens Semiconductor (NYSE: VLN) wird auf der Medica 2024 innovative Verbindungslösungen vorstellen, darunter einen Chip für fortschrittliche Endoskope, der auf dem VA7000-Chipsatz basiert. Dieser Chip bietet außergewöhnliche EMC-Zuverlässigkeit während der Elektrochirurgie, hochauflösendes Video und einen niedrigen Energieverbrauch, was ihn ideal für Einweg-Endoskope macht. Der Markt für Einweg-Endoskope in den USA wächst mit einer jährlichen Wachstumsrate (CAGR) von 17 % und wird bis 2030 voraussichtlich 7,32 Milliarden USD erreichen. Valens wird auch die Chipsets VS6320 und VS3000 für USB3.2 und Mensch-Maschine-Schnittstellen zeigen. Die Lösungen von Valens werden im israelischen Pavillon, Halle 15, Stand #E30, vom 11. bis 14. November ausgestellt.
- Valens is entering a high-growth market with innovative endoscopy solutions.
- The VA7000 chipset offers exceptional EMC reliability and high-resolution video.
- The disposable endoscope market in the US is growing at a 17% CAGR.
- No concrete financial data or revenue projections were provided.
Insights
The VA7000 chipset represents a significant advancement in the single-use endoscope market, addressing key FDA concerns and market demands. The built-in electrosurgical noise canceller is a important differentiator, potentially making Valens a major player in a market projected to reach
The technology addresses several critical challenges in endoscopy:
- Enhanced EMC reliability during electrosurgery
- High-resolution and wide field-of-view video capabilities
- Small form factor and low power consumption optimized for disposable devices
With over 250 million endoscopies performed annually and growing regulatory pressure to transition to single-use devices, Valens' solution could capture significant market share by enabling the industry's transition to disposable endoscopes while maintaining high performance standards.
Valens' groundbreaking solution, the first on the market to include a built-in electrosurgical noise canceller, will be on display at MEDICA, marking Valens' entry into a new high-growth market
HOD HASHARON,
Based on the VA7000 chipset, the endoscopes offer a series of key benefits, including exceptional EMC reliability during electrosurgery, as well as high-resolution and wide field-of-view video, which will enhance the capabilities of medical professionals and improve patient outcomes. Further, with its small form factor and extremely low power consumption, the solution is optimized for high-performance single-use endoscopy – a growing segment within the endoscopy vertical.
At Medica 2024, Valens will showcase a live demonstration of the VA7000 chipset, with its built-in electrosurgical noise cancellers, enabling a cautery procedure with exceptional EMC reliability and no image loss.
More than 250 million endoscopies are performed every year globally. Due to the rigorous, costly, and time-consuming requirements of cleaning the endoscopes, the industry has been attempting to transition to a disposable model. This transition has been spurred by the FDA, which for years has been proclaiming the need for single-use endoscopes to enhance patient safety. The disposable endoscope market in the US is therefore growing at a
In addition to the VA7000 chipset, Valens will also display the VS6320 chipset for high-performance USB3.2 extension, as well as the VS3000 chipset for human-machine interface extension.
"Our participation in Medica 2024 marks the perfect opportunity for us to introduce our cutting-edge connectivity solutions to the medical industry," Moshe Doron, SVP, Business Development at Valens Semiconductor. "With its built-in electrosurgical noise canceler, the VA7000 will provide exceptional reliability and video quality for medical professionals. The advantages of the VA7000 chipset remove the major roadblock that had prevented the industry from transitioning to the long-desired disposable endoscope architecture. We are already seeing significant interest in this chip from our customers and partners, and we're excited about the spotlight that Medica will allow us to shine on our innovative technology."
Valens' solutions will be on display at Medica 2024 at the Israeli Pavilion, Hall 15, Stand #E30, from November 11-14.
About Valens Semiconductor
Valens Semiconductor (NYSE: VLN) is a leader in high-performance connectivity, enabling customers to transform the digital experiences of people worldwide. Valens' chipsets are integrated into countless devices from leading customers, powering state-of-the-art audio-video installations, next-generation videoconferencing, and enabling the evolution of ADAS and autonomous driving. Pushing the boundaries of connectivity, Valens sets the standard everywhere it operates, and its technology forms the basis for the leading industry standards such as HDBaseT® and MIPI A-PHY. For more information, visit https://www.valens.com/.
Forward-Looking Statements
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Press Contacts
Yoni Dayan
Head of Communications
Valens Semiconductor Ltd.
Yoni.dayan@valens.com
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Senior Vice President
Financial Profiles, Inc.
pburek@finprofiles.com
Investor Contacts
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Valens Semiconductor Ltd.
michal.benari@valens.com
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