New power management chips from TI maximize protection, density and efficiency for modern data centers
Texas Instruments (TXN) has unveiled new power-management chips for modern data centers, addressing increasing power demands driven by AI and high-performance computing. The company introduced the TPS1685, the industry's first 48V integrated hot-swap eFuse with power-path protection, capable of supporting power levels beyond 6kW.
TI also launched a new family of integrated GaN power stages (LMG3650R035, LMG3650R025, and LMG3650R070) in industry-standard TOLL packaging, achieving high efficiency (>98%) and power density (>100W/in3). These innovations are being showcased at APEC 2025, featuring implementations in notable products including Dell's 1.8kW server PSU, Vertiv's 5.5kW server PSU delivering up to 132kW per rack, and Greatwall's 8kW PSU.
Texas Instruments (TXN) ha presentato nuovi chip per la gestione dell'energia per i moderni data center, rispondendo alle crescenti esigenze energetiche dovute all'IA e al calcolo ad alte prestazioni. L'azienda ha introdotto il TPS1685, il primo eFuse hot-swap integrato a 48V del settore con protezione del percorso di alimentazione, in grado di supportare livelli di potenza superiori a 6kW.
TI ha anche lanciato una nuova famiglia di stadi di potenza GaN integrati (LMG3650R035, LMG3650R025 e LMG3650R070) in imballaggio TOLL standard del settore, ottenendo alta efficienza (>98%) e densità di potenza (>100W/in3). Queste innovazioni sono in mostra all'APEC 2025, con implementazioni in prodotti di rilievo tra cui l'unità di alimentazione del server da 1.8kW di Dell, l'unità di alimentazione del server da 5.5kW di Vertiv che fornisce fino a 132kW per rack, e l'unità di alimentazione da 8kW di Greatwall.
Texas Instruments (TXN) ha presentado nuevos chips de gestión de energía para centros de datos modernos, abordando las crecientes demandas de energía impulsadas por la IA y la computación de alto rendimiento. La compañía introdujo el TPS1685, el primer eFuse hot-swap integrado de 48V en la industria con protección de ruta de energía, capaz de soportar niveles de potencia superiores a 6kW.
TI también lanzó una nueva familia de etapas de potencia GaN integradas (LMG3650R035, LMG3650R025 y LMG3650R070) en empaques TOLL estándar de la industria, logrando alta eficiencia (>98%) y densidad de potencia (>100W/in3). Estas innovaciones se están exhibiendo en APEC 2025, con implementaciones en productos notables, incluyendo la unidad de alimentación de servidor de 1.8kW de Dell, la unidad de alimentación de servidor de 5.5kW de Vertiv que entrega hasta 132kW por rack, y la unidad de alimentación de 8kW de Greatwall.
텍사스 인스트루먼트(TXN)는 현대 데이터 센터를 위한 새로운 전력 관리 칩을 공개하며 AI와 고성능 컴퓨팅으로 인한 증가하는 전력 수요를 해결했습니다. 이 회사는 6kW 이상의 전력 수준을 지원할 수 있는 전력 경로 보호 기능이 있는 업계 최초의 48V 통합 핫스왑 eFuse인 TPS1685를 소개했습니다.
TI는 또한 업계 표준 TOLL 포장으로 고효율(>98%) 및 전력 밀도(>100W/in3)를 달성한 통합 GaN 전력 스테이지의 새로운 제품군(LMG3650R035, LMG3650R025 및 LMG3650R070)을 출시했습니다. 이러한 혁신은 APEC 2025에서 전시되며, Dell의 1.8kW 서버 PSU, Vertiv의 5.5kW 서버 PSU(랙당 최대 132kW 제공), Greatwall의 8kW PSU와 같은 주목할만한 제품에 구현되어 있습니다.
Texas Instruments (TXN) a dévoilé de nouvelles puces de gestion de l'énergie pour les centres de données modernes, répondant à l'augmentation des demandes énergétiques générées par l'IA et le calcul haute performance. L'entreprise a introduit le TPS1685, le premier eFuse hot-swap intégré de 48V de l'industrie avec protection du chemin d'alimentation, capable de supporter des niveaux de puissance supérieurs à 6kW.
TI a également lancé une nouvelle famille de stades de puissance GaN intégrés (LMG3650R035, LMG3650R025 et LMG3650R070) dans un emballage TOLL standard de l'industrie, atteignant une haute efficacité (>98%) et une densité de puissance (>100W/in3). Ces innovations sont présentées à l'APEC 2025, avec des mises en œuvre dans des produits notables, y compris l'alimentation de serveur de 1,8 kW de Dell, l'alimentation de serveur de 5,5 kW de Vertiv fournissant jusqu'à 132 kW par rack, et l'alimentation de 8 kW de Greatwall.
Texas Instruments (TXN) hat neue Energieverwaltungs-Chips für moderne Rechenzentren vorgestellt, um den steigenden Energiebedarf, der durch KI und Hochleistungsrechnen verursacht wird, zu decken. Das Unternehmen stellte den TPS1685 vor, den ersten integrierten Hot-Swap-eFuse mit 48V und Strompfadschutz in der Branche, der in der Lage ist, Leistungsniveaus über 6kW zu unterstützen.
TI hat auch eine neue Familie von integrierten GaN-Leistungsstufen (LMG3650R035, LMG3650R025 und LMG3650R070) in branchenüblichen TOLL-Verpackungen auf den Markt gebracht, die eine hohe Effizienz (>98%) und Leistungsdichte (>100W/in3) erreichen. Diese Innovationen werden auf der APEC 2025 präsentiert, mit Implementierungen in bemerkenswerten Produkten, darunter Dells 1,8kW-Server-PSU, Vertivs 5,5kW-Server-PSU, die bis zu 132kW pro Rack liefern, und Greatwalls 8kW-PSU.
- New TPS1685 eFuse reduces solution size by 50% compared to existing controllers
- GaN power stages achieve high efficiency >98% and power density >100W/in3
- Major customer adoption: Dell, Vertiv, and Greatwall implementing TI solutions
- Products available for immediate purchase in preproduction quantities
- Products currently only available in preproduction quantities, not full production
Insights
Texas Instruments' new power management chips represent a strategic product expansion into the high-growth data center market, specifically targeting the increasing power demands driven by AI adoption. The introduction of the TPS1685 - the industry's first 48V integrated hot-swap eFuse with power-path protection - addresses a critical market need as data centers transition to 48V architectures to support power-hungry AI accelerators.
The new integrated GaN power stages (LMG3650R035, LMG3650R025, LMG3650R070) offer >98% efficiency and power densities exceeding 100W/in³ in industry-standard packaging, allowing customers to adopt GaN technology without complex redesigns. This approach reduces barriers to adoption while delivering the efficiency benefits of gallium nitride.
Particularly noteworthy is TI's demonstrated market traction, with Dell, Vertiv and Greatwall already implementing these solutions in high-power server designs. Dell's 1.8kW PSU achieving >96% system-level efficiency and Vertiv's solution delivering up to 132kW per rack validate the real-world performance of TI's technology.
As data centers expand their computational capabilities for AI workloads, power efficiency becomes increasingly critical. TI's innovations address both technical challenges (higher power density, improved efficiency) and business concerns (simplified design, industry-standard packaging) that data center operators face in scaling their infrastructure.
TI's launch of advanced power management chips positions the company to capitalize on the rapidly expanding data center market, particularly the segment driven by AI computing needs. This move aligns with TI's broader strategy of targeting high-value, high-margin semiconductor applications.
The timing is particularly strategic as data centers worldwide are upgrading infrastructure to handle AI workloads, creating demand for more efficient power solutions. TI's innovations specifically address the industry shift toward 48V power architectures needed for next-generation computing hardware.
The early adoption by major industry players like Dell, Vertiv, and Greatwall demonstrates immediate market validation and potential revenue streams. These design wins in high-power server applications could translate to recurring revenue as these systems enter volume production.
While specific financial projections aren't provided, these products strengthen TI's position in the industrial and enterprise markets. The data center power management segment offers higher margins compared to consumer electronics, aligning with TI's focus on profitability. The integrated nature of these solutions (combining multiple functions in single chips) typically commands premium pricing while offering customers overall system cost reductions.
Investors should view this as reinforcing TI's competitive position in high-performance analog and power management - areas historically delivering strong returns for the company.
News highlights:
- The industry's first 48V integrated hot-swap eFuse with power-path protection streamlines data center design and enables designers to reach power levels beyond 6kW.
- New integrated gallium nitride (GaN) power stages combine TI GaN and a high-performance gate driver with advanced protection features in an industry-standard transistor outline leadless (TOLL) package.
For more information, see ti.com/TPS1685, ti.com/LMG3650R035 and ti.com/LMG3650R070.
"With data centers increasingly demanding more energy, powering the world's digital infrastructure begins with smarter, more efficient semiconductors," said Robert Taylor, general manager, Industrial Power Design Services. "While advanced chips drive AI's computational power, analog semiconductors are key to maximizing energy efficiency. Our latest power-management innovations are enabling data centers to reduce their environmental footprint while supporting the growing needs of our digital world."
Reach power levels beyond 6kW with intelligent system protection
As power demands surge, data center designers are shifting to 48V power architectures for enhanced efficiency and scalability to support components such as CPUs, graphics processing units and AI hardware accelerators. TI's 48V stackable integrated hot-swap eFuse with power-path protection empowers designers to tackle high-power (>6kW) processing needs with a scalable device that simplifies design and reduces solution size by half compared to existing hot-swap controllers in the market.
To learn more about designing with the TPS1685, read the technical article, "Powering Modern AI Data Centers with an Integrated 48V Hot-Swap eFuse Device."
Achieve higher efficiency with TI GaN in industry-standard packaging
In addition, TI introduced a new family of integrated GaN power stages. The LMG3650R035, LMG3650R070 and LMG3650R025 leverage the benefits of TI GaN in an industry-standard TOLL package, allowing designers to take advantage of TI GaN efficiency without costly and time-consuming redesigns.
The new power stages integrate a high-performance gate driver with a 650V GaN field-effect transistor (FET) while achieving high efficiency (>
To learn more about TI GaN power stages in industry-standard packaging, read the technical article, "Developing industry-standard power supplies with integrated TOLL-packaged GaN devices."
Reimagining power density and efficiency at APEC 2025
At APEC 2025, TI will showcase power solutions that enable designers to reimagine new levels of power density and efficiency, including:
- Dell's 1.8kW server power-supply unit (PSU) with TI GaN power stages: Dell's first high-efficiency 12V PSU design uses a TI integrated GaN power stage. The PSU features a GaN FET with built-in driver, protection and temperature reporting to achieve over
96% system-level efficiency. - Vertiv's 5.5kW server PSU: Part of Vertiv's PowerDirect Rack DC power system, the latest PSU from Vertiv is powered by TI GaN technology to deliver up to 132kW per rack.
- Greatwall's 8kW PSU: To help designers increase power density, Greatwall and TI co-developed an 8kW open-rack PSU using TI GaN technology and TI C2000™ real-time microcontrollers.
Throughout the show, TI power experts will lead 27 industry and technical sessions to address power-management design challenges. Visit TI in the Georgia World Congress Center, Booth No. 1213. The full schedule is available at ti.com/APEC.
Package, availability and pricing
- Preproduction quantities of the TPS1685, LMG3650R035, LMG3650R070 and LMG3650R025 are available for purchase now on TI.com.
- Multiple payment and shipping options are available.
- Evaluation modules are available for all three devices.
About Texas Instruments
Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, personal electronics, enterprise systems and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com.
Trademarks
C2000 is a trademark of Texas Instruments. All registered trademarks and other trademarks belong to their respective owners.
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SOURCE Texas Instruments
FAQ
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