Welcome to our dedicated page for Taiwan Semi news (Ticker: TSM), a resource for investors and traders seeking the latest updates and insights on Taiwan Semi stock.
Taiwan Semiconductor Manufacturing Company (TSMC) is the world's leading dedicated semiconductor foundry, powering global technology innovation through advanced chip manufacturing. This page serves as a comprehensive resource for official announcements, strategic developments, and operational updates directly impacting the semiconductor ecosystem.
Access curated TSMC news including quarterly earnings disclosures, manufacturing technology breakthroughs, and supply chain initiatives. Investors and industry professionals will find timely updates on capacity expansions, R&D milestones, and partnership announcements that shape the global semiconductor landscape.
Our news collection features verified information on TSMC's cutting-edge process nodes, sustainability initiatives, and market positioning. Content spans production updates for next-generation chips, geopolitical developments affecting semiconductor trade, and technological collaborations with leading fabless design firms.
Bookmark this page for streamlined access to TSMC's evolving role in enabling artificial intelligence, 5G infrastructure, and high-performance computing through semiconductor innovation. Check regularly for updates that matter to stakeholders in the technology value chain.
TSMC (NYSE: TSM) has unveiled its next-generation A14 process technology at its North America Technology Symposium. The A14, scheduled for production in 2028, represents a significant advancement from the N2 process, offering up to 15% speed improvement at the same power, 30% power reduction at the same speed, and over 20% increase in logic density.
The company also announced several technological advances, including the evolution of TSMC NanoFlex™ to NanoFlex™ Pro and plans for 9.5 reticle size CoWoS production in 2027, enabling integration of 12 HBM stacks. The revolutionary System-on-Wafer (SoW-X) technology, promising 40X computing power compared to current CoWoS solutions, is scheduled for 2027 production.
Additional innovations include N4C RF technology for smartphones entering risk production in Q1 2026, N3A process for automotive applications, and N4e development for IoT applications.
TSMC (NYSE: TSM), the semiconductor manufacturing giant, has announced the filing of its 2024 annual report on Form 20-F with the U.S. Securities and Exchange Commission. The report has been made publicly accessible through TSMC's investor relations website. Interested parties can obtain hard copies of the report at no cost by submitting an email request to the company.
Amkor Technology (Nasdaq: AMKR) and TSMC (TWSE: 2330, NYSE: TSM) have signed a memorandum of understanding to collaborate on advanced packaging and test capabilities in Arizona. Under the agreement, TSMC will contract turnkey advanced packaging and test services from Amkor's planned facility in Peoria, Arizona, supporting TSMC's customers using its advanced wafer fabrication facilities in Phoenix.
The collaboration aims to accelerate product cycle times and address customer needs for geographic flexibility in manufacturing. The companies will jointly define specific packaging technologies, including TSMC's Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS®). This partnership supports the development of a comprehensive semiconductor manufacturing ecosystem in the United States and enables seamless technology alignment for customers across a global manufacturing network.
TXOne Networks, a leader in Cyber-Physical Systems (CPS) security, has formed a strategic partnership with Applied Materials (AMAT), a renowned materials engineering solution provider in the semiconductor industry. This collaboration aims to enhance operational technology (OT) cybersecurity within the semiconductor supply chain. TXOne Networks' partnership with AMAT, which includes an investment from AMAT, is set to strengthen industry standards and innovation. Notable achievements include securing operations for over 3,600 organizations globally and contributing to key industry standards such as SEMI E187. Both companies see significant growth potential from this collaboration.
TXOne Networks is emerging as a leader in OT cybersecurity for the semiconductor manufacturing industry. The company focuses on providing advanced security solutions tailored to the unique demands of operational technology environments in semiconductor manufacturing. TXOne Networks emphasizes the need for robust cybersecurity measures to protect critical manufacturing processes and intellectual property against increasing cyber threats. The company collaborates with industry leaders to deliver innovative security products that ensure the safety and integrity of semiconductor production lines.
