Welcome to our dedicated page for Taiwan Semi news (Ticker: TSM), a resource for investors and traders seeking the latest updates and insights on Taiwan Semi stock.
Taiwan Semiconductor Manufacturing Company Limited (TSMC) is a leading name in the semiconductor industry, renowned as the world's largest dedicated chip foundry with a dominant market share of nearly 60%. Founded in 1987 through a joint venture involving Philips, the government of Taiwan, and private investors, TSMC has grown to become a pivotal player in the global technology sphere.
As a pioneer in the pure-play foundry business model, TSMC offers top-notch semiconductor manufacturing and design services. The company has consistently demonstrated its prowess in advanced process technologies, enabling high-quality and reliable chip production. TSMC's extensive customer base includes industry giants such as Apple, AMD, and Nvidia, who leverage TSMC's cutting-edge technologies for their semiconductor designs.
TSMC employs more than 73,000 people and maintains a robust global presence with operations in Asia, Europe, and North America. The company is committed to innovation and excellence, reflected in its deployment of 288 distinct process technologies and the manufacture of 12,698 products for 532 customers in 2022 alone.
One of the significant recent developments is TSMC's collaboration with MediaTek. In September 2023, MediaTek announced the successful development of its first chip using TSMC's leading-edge 3nm technology. This milestone underscores the strategic partnership between the two companies, emphasizing TSMC's ability to provide high-performance, low-power solutions for global end devices. The new 3nm technology promises up to 18% speed improvement at the same power or 32% power reduction at the same speed compared to TSMC's N5 process, along with a 60% increase in logic density.
TSMC's commitment to advancing semiconductor technology aligns with its vision of improving lives through innovative products. The continuous shift towards a fabless business model and strategic alliances have positioned TSMC as a crucial enabler of the modern digital economy. With its headquarters in Hsinchu, Taiwan, TSMC remains a steadfast corporate citizen, contributing to technological advancements while maintaining strong financial health and operational efficiency.
Amkor Technology (Nasdaq: AMKR) and TSMC (TWSE: 2330, NYSE: TSM) have signed a memorandum of understanding to collaborate on advanced packaging and test capabilities in Arizona. Under the agreement, TSMC will contract turnkey advanced packaging and test services from Amkor's planned facility in Peoria, Arizona, supporting TSMC's customers using its advanced wafer fabrication facilities in Phoenix.
The collaboration aims to accelerate product cycle times and address customer needs for geographic flexibility in manufacturing. The companies will jointly define specific packaging technologies, including TSMC's Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS®). This partnership supports the development of a comprehensive semiconductor manufacturing ecosystem in the United States and enables seamless technology alignment for customers across a global manufacturing network.
TXOne Networks, a leader in Cyber-Physical Systems (CPS) security, has formed a strategic partnership with Applied Materials (AMAT), a renowned materials engineering solution provider in the semiconductor industry. This collaboration aims to enhance operational technology (OT) cybersecurity within the semiconductor supply chain. TXOne Networks' partnership with AMAT, which includes an investment from AMAT, is set to strengthen industry standards and innovation. Notable achievements include securing operations for over 3,600 organizations globally and contributing to key industry standards such as SEMI E187. Both companies see significant growth potential from this collaboration.
TXOne Networks is emerging as a leader in OT cybersecurity for the semiconductor manufacturing industry. The company focuses on providing advanced security solutions tailored to the unique demands of operational technology environments in semiconductor manufacturing. TXOne Networks emphasizes the need for robust cybersecurity measures to protect critical manufacturing processes and intellectual property against increasing cyber threats. The company collaborates with industry leaders to deliver innovative security products that ensure the safety and integrity of semiconductor production lines.
TSMC recently presented its latest technological advancements at the 2023 North America Technology Symposium in Santa Clara, California. The company detailed progress in its 2nm technology and introduced enhanced members of its 3nm technology family, including N3P, N3X, and N3AE. The N3P process aims for production in late 2024, promising a 5-10% power reduction and improved chip density. The N3X variant targets high-performance computing and will enter production in 2025, while N3AE focuses on automotive applications. TSMC's 2nm technology is progressing well, targeting production by 2025. Additionally, the symposium highlighted innovations in advanced packaging and silicon stacking technologies.
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