Welcome to our dedicated page for Taiwan Semi news (Ticker: TSM), a resource for investors and traders seeking the latest updates and insights on Taiwan Semi stock.
Taiwan Semiconductor Manufacturing Company (TSMC) is the world's leading dedicated semiconductor foundry, powering global technology innovation through advanced chip manufacturing. This page serves as a comprehensive resource for official announcements, strategic developments, and operational updates directly impacting the semiconductor ecosystem.
Access curated TSMC news including quarterly earnings disclosures, manufacturing technology breakthroughs, and supply chain initiatives. Investors and industry professionals will find timely updates on capacity expansions, R&D milestones, and partnership announcements that shape the global semiconductor landscape.
Our news collection features verified information on TSMC's cutting-edge process nodes, sustainability initiatives, and market positioning. Content spans production updates for next-generation chips, geopolitical developments affecting semiconductor trade, and technological collaborations with leading fabless design firms.
Bookmark this page for streamlined access to TSMC's evolving role in enabling artificial intelligence, 5G infrastructure, and high-performance computing through semiconductor innovation. Check regularly for updates that matter to stakeholders in the technology value chain.
TSMC recently presented its latest technological advancements at the 2023 North America Technology Symposium in Santa Clara, California. The company detailed progress in its 2nm technology and introduced enhanced members of its 3nm technology family, including N3P, N3X, and N3AE. The N3P process aims for production in late 2024, promising a 5-10% power reduction and improved chip density. The N3X variant targets high-performance computing and will enter production in 2025, while N3AE focuses on automotive applications. TSMC's 2nm technology is progressing well, targeting production by 2025. Additionally, the symposium highlighted innovations in advanced packaging and silicon stacking technologies.
TSMC filed its 2022 annual report on Form 20-F with the U.S. Securities and Exchange Commission. The report showcases TSMC's status as the global leader in dedicated semiconductor foundry services, highlighting its deployment of 288 process technologies and the manufacturing of 12,698 products for 532 customers in 2022. The annual report is accessible online, with hard copies available upon request. TSMC, founded in 1987, supports a broad ecosystem with leading technology solutions and is a committed corporate citizen globally. For more details, visit www.tsmc.com.
TSMC has launched the Open Innovation Platform 3DFabric Alliance at the 2022 OIP Ecosystem Forum in Taiwan, marking its sixth alliance aimed at fostering 3D IC ecosystem collaboration. The platform offers partners early access to TSMC’s 3DFabric technologies, enhancing the development of semiconductor design and packaging. Collaborators include AMD, Amazon AWS, and NVIDIA, aiming to accelerate innovations in high-performance computing and mobile applications. TSMC aims to provide comprehensive solutions through its OIP for faster time-to-market and revenue generation.
TSMC (NYSE: TSM) unveiled its latest innovations at the 2022 North America Technology Symposium in Santa Clara, California. The event highlighted the introduction of the N2 technology and FinFlex™ for advanced chip design. N2 promises a 10-15% speed boost or 25-30% power reduction, entering production in 2025. Additionally, TSMC showcased its expanding Ultra-Low Power platform with N6e for IoT devices. The 3DFabric™ solutions were also featured, including the first SoIC-based CPU. These advancements underscore TSMC's commitment to leading the semiconductor industry.
TSMC has submitted its 2021 annual report on Form 20-F to the U.S. Securities and Exchange Commission. The report highlights TSMC's leadership in the semiconductor foundry industry, showcasing 291 distinct process technologies and 12,302 manufactured products for 535 customers in 2021. The company remains the first foundry to achieve 5-nanometer production capabilities. Interested parties can access the report online and request hard copies via email.
TSMC (NYSE: TSM) announced a significant partnership with DENSO, who will acquire a minority stake in Japan Advanced Semiconductor Manufacturing, Inc. (JASM) for US$0.35 billion, securing over 10% equity. The JASM fab, scheduled for construction in 2022, aims to ramp up production capacity to 55,000 12-inch wafers monthly by late 2024, with an estimated total investment of US$8.6 billion. This collaboration is expected to bolster semiconductor supply in the automotive sector, directly creating approximately 1,700 high-tech jobs in Japan.
TSMC has honored 11 partners with the 2021 OIP Partner of the Year awards during its OIP Ecosystem Forum. These awards recognize excellence in semiconductor design enablement, highlighting collaborative efforts that promote innovation. TSMC's Open Innovation Platform aims to reduce design barriers and accelerate implementation in the semiconductor community. This initiative has been pivotal in enabling next-generation designs, bringing together creative thinking from global partners. TSMC continues to lead with 281 process technologies and the latest advancements in semiconductor manufacturing.
TSMC (NYSE: TSM) is showcasing innovations in advanced logic technology and packaging at its 2021 Technology Symposium held online from June 1-2. Key highlights include the introduction of N6RF for enhanced 5G performance, N5A for automotive applications, and advancements in the 3DFabric technology. TSMC also confirms risk production of the N4 technology by Q3 2021 and anticipates N3 to begin volume production in H2 2022, promising significant performance and efficiency improvements. Over 5,000 participants are registered, underscoring TSMC's strong industry presence.
