Welcome to our dedicated page for Tower Semiconductor news (Ticker: TSEM), a resource for investors and traders seeking the latest updates and insights on Tower Semiconductor stock.
Tower Semiconductor Ltd (TSEM) is a global leader in specialty analog and mixed-signal semiconductor manufacturing. This page serves as the definitive source for official company announcements, financial updates, and technology developments. Investors and industry professionals will find timely updates on earnings reports, strategic partnerships, product innovations, and operational milestones.
Our curated collection features press releases covering quarterly financial results, manufacturing expansions, and technology partnerships across automotive, industrial, and consumer electronics sectors. Stay informed about TSEM's advancements in RF solutions, power management ICs, and CMOS image sensor technologies through verified primary sources.
Key updates include executive leadership changes, regulatory filings, and capacity expansion announcements from Tower Semiconductor's global fabrication facilities. Bookmark this page for direct access to critical information affecting the company's market position and semiconductor industry trends.
Tower Semiconductor (NASDAQ/TASE: TSEM) announced key technology presentations at IMS 2021 and the RFIC conference, showcasing innovations in 5G, satellite communications, and quantum computing. The highlighted papers emphasize breakthrough RF and millimeter-wave technologies, including low noise amplifiers and novel RF switch configurations. Tower will also participate in a virtual exhibitor talk on June 21, discussing their 5G solutions. For more details on presentations and scheduled sessions, visit the event website.
Tower Semiconductor (NASDAQ: TSEM) reported a record revenue of $347 million for Q1 2021, representing 21% organic growth and 16% total growth year-over-year. The company anticipates Q2 2021 revenue of $360 million, reflecting 26% year-over-year organic growth. Significant improvements were noted in gross profit ($70 million, up 33%), operating profit ($32 million, 2X year-over-year), and net profit ($28 million, $0.26 EPS). Tower's capacity expansion plan includes $150 million in purchase orders for manufacturing tools. Standard & Poor’s reaffirmed a stable credit rating of "ilAA-."
AIStorm and Tower Semiconductor have partnered to introduce AI-in-Imager technology, leveraging Tower's Hi-K VIA capacitor memory for real-time machine learning in edge imagers. This technology enables AI computation directly at the pixel level, reducing power consumption and costs associated with traditional digital systems. The AI edge market is projected to grow significantly, from $6.72 billion in 2022 to $66.3 billion by 2025. AIStorm's solutions aim for superior performance in various devices, including handsets and IoT, enhancing 'always-on' functionality.
Gpixel and Tower Semiconductor have launched the GTOF0503, an innovative indirect Time of Flight (iToF) sensor for 3D imaging, addressing a rapidly growing market estimated at ~$4 billion. This sensor features a resolution of 640 x 480 pixels, offering superior performance in depth sensing and distance measurement applications. With advanced capabilities such as integrated light control and high-speed interfaces, the GTOF0503 is designed for diverse sectors including robotics and automotive. The market for such sensors is projected to reach ~$8 billion by 2025, highlighting significant growth potential.
Tower Semiconductor (NASDAQ: TSEM) will release its Q1 2021 earnings on May 12, 2021. A conference call to discuss these results and Q2 guidance will follow at 10:00 a.m. ET.
The call will be accessible via webcast or by phone. Tower Semiconductor is a leading foundry specializing in high-value analog semiconductor solutions, operating facilities in Israel, the U.S., and Japan.
Tower Semiconductor announced its innovative galvanic capacitor technology integrated with its 0.18um power management platforms. This technology enables up to 12kV isolated gate driver and digital isolator ICs, targeting a $1 billion market in electrical vehicles, green power, and industrial sectors. Lead customers are already prototyping applications such as battery chargers and motor drivers. The new approach enhances safety and efficiency while reducing costs and size by integrating the isolator into the design, eliminating the need for extra components.
Tower Semiconductor (NASDAQ/TASE: TSEM) announced its participation in the 2021 SEMICON China conference from March 18-19 in Shanghai. Mrs. Yuna Cai will present on 'Advanced High Voltage Bulk & SOI Technologies for Smart Power Applications' on March 19, focusing on innovative solutions for the evolving 5G market. This presentation will showcase Tower's power management platform designed to meet both local and global specifications.
Tower Semiconductor (NASDAQ/TASE: TSEM) announced an upcoming webinar on March 24, 2021, titled "Automotive Excellence – From Design to Volume Production". The session will cover the company's automotive foundry program, focusing on analog technology platforms, design enablement, and a zero-defect quality methodology tailored for the automotive sector. Key presentations will be provided by senior executives, offering insights into Tower's capabilities in meeting the stringent requirements of the automotive industry.
Tower Semiconductor (NASDAQ: TSEM) reported strong financial results for Q4 2020, with revenues of $345 million, marking an 11% increase quarter over quarter and a 13% increase year over year. The company anticipates a 15% revenue growth for Q1 2021, driven by robust demand and a capacity expansion of 200mm and 300mm. Organic growth reached 20% q/q and 17% y/y. Net profit stood at $31 million, up from $15 million in the prior quarter. Tower highlights positive customer forecasts and expects sequential growth throughout 2021, positioning itself for a record revenue year.
Tower Semiconductor (NASDAQ/TASE: TSEM) announced its participation in the DARPA LUMOS program, focusing on creating an integrated-laser-on-silicon photonics process. This initiative, supported partially by DARPA, aims to enhance high-speed communications through a combination of III-V laser diodes and Tower's PH18 production silicon photonics platform.
The project targets improved laser density, reduced coupling losses, and simplified packaging, enabling the development of new products for commercial and defense applications.
