Tower Semiconductor Announces First Quarter 2021 Financial Results and Conference Call
Tower Semiconductor (NASDAQ: TSEM) will release its Q1 2021 earnings on May 12, 2021. A conference call to discuss these results and Q2 guidance will follow at 10:00 a.m. ET.
The call will be accessible via webcast or by phone. Tower Semiconductor is a leading foundry specializing in high-value analog semiconductor solutions, operating facilities in Israel, the U.S., and Japan.
- Tower Semiconductor is a leader in high value analog semiconductor solutions.
- The upcoming earnings release and guidance may provide insights into future performance.
- None.
MIGDAL HAEMEK, Israel – April 21, 2021 – Tower Semiconductor (NASDAQ/ TASE: TSEM), the leading foundry of high value analog semiconductor solutions, will issue its first quarter 2021 earnings release on Wednesday, May 12, 2021. The Company will hold a conference call to discuss its first quarter 2021 financial results and second quarter 2021 guidance on Wednesday, May 12, 2021, at 10:00 a.m. Eastern Time (09:00 a.m. Central, 08:00 a.m. Mountain, 07:00 a.m. Pacific and 05:00 p.m. Israel time).
This call will be webcasted and can be accessed through the Investor Relations section on Tower Semiconductor’s website at https://ir.towersemi.com/ or can also be accessed by calling the following numbers: U.S. Toll Free: 1-888-642-5032; Israel: 03-918-0609; International: +972-3-918-0609. The teleconference will be available for replay for 90 days.
About Tower Semiconductor
Tower Semiconductor Ltd. (NASDAQ: TSEM, TASE: TSEM), the leading foundry of high value analog semiconductor solutions, provides technology and manufacturing platforms for integrated circuits (ICs) in growing markets such as consumer, industrial, automotive, mobile, infrastructure, medical and aerospace and defense. Tower Semiconductor focuses on creating positive and sustainable impact on the world through long term partnerships and its advanced and innovative analog technology offering, comprised of a broad range of customizable process platforms such as SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS image sensor, non-imaging sensors, integrated power management (BCD and 700V), and MEMS. Tower Semiconductor also provides world-class design enablement for a quick and accurate design cycle as well as Transfer Optimization and development Process Services (TOPS) to IDMs and fabless companies. To provide multi-fab sourcing and extended capacity for its customers, Tower Semiconductor operates two manufacturing facilities in Israel (150mm and 200mm), two in the U.S. (200mm) and three facilities in Japan (two 200mm and one 300mm) through TPSCo. For more information, please visit: www.towersemi.com.
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Contact Information:
Tower Semiconductor Investor Relations
Noit Levy, SVP Investor Relations
noitle@towersemi.com
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