Welcome to our dedicated page for Tower Semiconductor news (Ticker: TSEM), a resource for investors and traders seeking the latest updates and insights on Tower Semiconductor stock.
Overview of Tower Semiconductor Ltd
Tower Semiconductor Ltd is a pure-play specialty foundry that designs and manufactures a wide array of integrated circuits based on its customers' specifications. With a strong focus on advanced specialty technologies, Tower Semiconductor provides cutting-edge analog and mixed-signal capabilities, including radio frequency (RF), high performance analog (HPA), integrated power management, CMOS image sensors, and a range of MEMS technologies. These offerings position the company at the forefront of the semiconductor manufacturing industry, enabling diverse markets such as consumer electronics, automotive, industrial, medical, aerospace, and defense to benefit from its unique expertise.
Advanced Semiconductor Manufacturing
The company operates high-tech manufacturing facilities using advanced process technologies across several geographies. Its facilities in Israel, the United States, and Japan serve as critical nodes in a global network that ensures multi-fab sourcing and capacity assurance. This global presence allows Tower Semiconductor to support hundreds of customers worldwide, offering both production scalability and innovative development processes.
Specialty Technologies and Design Enablement
At the core of Tower Semiconductor's operations lies its commitment to delivering state-of-the-art specialty technologies. The company's expertise in radio frequency circuits, high performance analog systems, and integrated power management solutions enables it to serve sectors that demand precision and reliability. In addition, Tower Semiconductor provides sophisticated design enablement tools that streamline the transition from concept to production, offering a quick and efficient path to design success. This integrated approach ensures that clients receive not only futuristic semiconductor devices but also the necessary support to optimize their design cycles.
Comprehensive Service Offerings
Tower Semiconductor augments its manufacturing capabilities with a complete suite of services designed to address the challenges inherent in semiconductor design and fabrication. Its transfer optimization and development process services (TOPS) assist IDM and fabless companies in expanding manufacturing capacity or establishing alternative sourcing channels. Such services emphasize the company's role as a strategic partner, providing in-depth technical support and quality assurance throughout the entire production cycle.
Market Position and Competitive Landscape
Positioned within a competitive and rapidly evolving semiconductor industry, Tower Semiconductor distinguishes itself through its focus on specialized technology solutions and robust global manufacturing infrastructure. Unlike more diversified semiconductor manufacturers, Tower Semiconductor has honed its expertise in analog and mixed-signal integrated circuits, making it a preferred partner in niche markets that demand high reliability and accuracy. By concentrating on advanced process nodes and specialty components, the company effectively meets the unique challenges of its dynamic customer base while continuously adapting to emerging technology trends.
Integration and Global Capabilities
The company’s operations are supported by a network of state-of-the-art fabrication facilities, which enhances its ability to deliver assured quality, multi-source fabrication, and unparalleled global capacity. These facilities, strategically located across several key regions, enable Tower Semiconductor to manage production risks and provide consistent deliverables regardless of varying market conditions. The effective integration of design and manufacturing creates a robust backbone that underpins the company’s reputation for technical excellence and operational reliability.
Conclusion
In summary, Tower Semiconductor Ltd exemplifies expertise in semiconductor manufacturing through its focus on advanced analog and mixed-signal integrated circuits and its comprehensive service model. The company’s blend of innovative technologies, high-performance manufacturing capabilities, and design-focused services allows it to serve an extensive portfolio of customers across diverse industries. With a clear commitment to quality, operational excellence, and technical innovation, Tower Semiconductor remains a significant participant in the global semiconductor landscape, providing both the products and expertise that empower modern electronic applications.
Tower Semiconductor (NASDAQ/TASE: TSEM) and Alcyon Photonics have announced a strategic collaboration to accelerate photonics integration development. The partnership combines Tower's high-volume Silicon Photonics (SiPho) manufacturing platform with Alcyon's advanced photonic design capabilities.
Key highlights of the collaboration include:
- Development of silicon-validated, high-performance photonic building blocks and circuits
- Alcyon's design techniques maintain channel drifts below 3 nm despite fabrication variations up to 30 nm
- Focus on CWDM solutions for data center networking in O band
- Advancement in coherent communications across C+L bands for enhanced bandwidth
The partnership aims to provide customers with consistent, high-yield results and accelerate the development cycle for next-generation optical applications in datacom, telecom, and sensing markets.
Tower Semiconductor (TSEM) has been honored with a Supplier Excellence Award from Northrop Grumman (NOC) for its outstanding performance in supporting national security technologies. The recognition was announced during Northrop Grumman's recent Supplier Excellence Awards Ceremony.
Ken Brown, VP of Enterprise Global Supply Chain at Northrop Grumman, highlighted Tower's contribution to delivering technologies that enhance national security for the U.S. and its allies. The partnership focuses on providing innovative and cost-effective military and security solutions.
Mike Scott, Sr. Director and General Manager of Tower's Aerospace & Defense Business Unit, expressed pride in receiving this recognition, emphasizing the company's dedication to delivering exceptional quality, reliability, and service to Aerospace & Defense customers through advanced technologies and manufacturing capabilities.
OpenLight and Tower Semiconductor (NASDAQ/TASE: TSEM) have successfully demonstrated a 400G/lane modulator on Tower's integrated silicon photonics platform PH18DA. The innovation achieved a better than 3.5db extinction ratio using PAM-4 modulation format at 0.6 volts peak-to-peak drive voltage.
The demonstration, built using OpenLight's IP on Tower's existing platform, supports next-generation optical communication architectures from 100G to 400G/lane. Operating across all four CWDM wavelengths, it enables a commercially viable path for DR8 and FR4 next-generation 3.2Tb solutions.
The technology offers significant advantages for datacom and AI applications, including small size, high bandwidth, low drive voltage, and volume manufacturability. The platform also supports heterogeneous integration of modulators, lasers, and optical amplifiers on a single, compact photonic integrated circuit (PIC).
OpenLight and Tower Semiconductor (NASDAQ/TASE: TSEM) have successfully demonstrated a 400G/lane modulator on Tower's PH18DA integrated silicon photonics platform. The demonstration achieved a better than 3.5db extinction ratio using PAM-4 modulation format at 0.6 volts peak-to-peak drive voltage.
Built using OpenLight's IP on Tower's existing platform, which already supports 100G and 200G/lane, this innovation enables a scalable solution for high-speed data transfer in cloud computing, AI and ML applications. Operating across all four CWDM wavelengths, it provides a commercially viable path for DR8 and FR4 next-generation 3.2Tb solutions.
The platform offers heterogeneous integration of 400G modulators, lasers, and optical amplifiers on a single, compact photonic integrated circuit (PIC), providing advantages in size, bandwidth, and low drive voltage while maintaining volume manufacturability.
Tower Semiconductor (NASDAQ/TASE: TSEM) and Innolight have expanded their collaboration to ramp up production of next-generation Silicon Photonics (SiPho) solutions for AI and data centers. The breakthrough technology reduces external optical components and halves the required number of lasers per module, streamlining optical module design and improving cost efficiency.
The partnership focuses on delivering solutions for:
- 100Gbps per lane (400G/800G)
- 200Gbps per lane (1.6T)
- Future 400Gbps per lane (3.2T) optical modules
Tower's new SiPho platform features industry-leading edge coupling efficiency and higher-performance modulators, enabling reduced complexity, improved system reliability, and enhanced supply chain robustness. The collaboration aims to meet the increasing demand for high-speed optical connectivity in AI-driven data centers and cloud infrastructure.
Tower Semiconductor (NASDAQ/TASE: TSEM) announced its participation in the 2025 Applied Power Electronics Conference (APEC) from March 17-19 in Atlanta, Georgia. The company will showcase its advanced power management technology platform, featuring its 300mm 65nm 3.3V-based BCD solution.
The presentation will highlight Tower's power management solutions targeting Automotive, AI, Mobile PMIC, and Data Center power delivery applications. The company's 0.18μm (200mm) and 65nm (300mm) Bipolar-CMOS-DMOS (BCD) platforms support various applications including driver ICs, battery management, and high-voltage gate drivers.
Dr. Mete Erturk, Sr. Director of Power Management Marketing, will present 'Tower Semiconductor's BCD Technology Foundry Offerings: From Automotive to Datacenter Power' on March 19, 2025, at 12:45 PM in room A312.
Tower Semiconductor (TSEM) reported Q4 2024 financial results with revenues of $387 million, showing 5% quarter-over-quarter and 10% year-over-year growth. Q4 net profit reached $55 million with $0.49 EPS. Full-year 2024 revenues totaled $1.44 billion with net profit of $208 million ($1.87 basic EPS).
The company completed its 6-inch fab consolidation, discontinuing legacy 150mm flows in Fab1 and transferring strategic flows to Fab2 200mm factory. For Q1 2025, Tower guides revenues of $358 million (±5%), projecting approximately 10% year-over-year growth. Management expects sequential quarter-over-quarter revenue growth throughout 2025, with acceleration in the second half, supported by increasing production shipments as capacity investments near final customer qualifications.
Tower Semiconductor (NASDAQ/TASE: TSEM) has announced it will release its fourth quarter and fiscal year 2024 earnings report on February 10, 2025. The company will host a conference call on the same day at 10:00 a.m. Eastern Time to discuss the financial results and provide guidance for the first quarter of 2025.
The earnings call will be accessible via webcast through Tower Semiconductor's Investor Relations website. Participants interested in joining the call must complete a pre-registration form to receive dial-in details and a unique PIN. The teleconference recording will remain available for replay for 90 days following the event.
Tower Semiconductor (NASDAQ/TASE: TSEM), a leading foundry specializing in high-value analog semiconductor solutions, has announced its participation in the 27th Annual Needham Growth Conference. The event will be held on January 14-15, 2025, at the Lotte New York Palace Hotel in New York.
The company will offer one-on-one meetings with investors during the conference. Interested investors can arrange meetings through either the conference organizers or by contacting Tower's investor relations team at towersemi@kcsa.com.
Tower Semiconductor (NASDAQ/TASE: TSEM) has announced its new 300mm 65nm 3.3V-based BCD Power management platform (PML), complementing its existing 5V-based offering currently in high-volume production in Japan and undergoing qualification in Albuquerque, New Mexico.
The platform features LDMOS devices with ultra-low on-resistance and best-in-class figure-of-merit, designed for high power efficiency in mobile devices, AI, and data center applications. The technology includes power devices with wide voltage range and 3.3V gate voltage capability, suitable for PMIC, Audio IC, and high-power voltage regulators for GPU and CPU applications.
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