ST introduces new image sensors for industrial automation, security and retail applications
STMicroelectronics (NYSE: STM) introduced four new 5MP BrightSense CMOS image sensors (VD1943, VB1943, VD5943, VB5943) for industrial automation, security and retail applications on October 20, 2025. The family offers a unique hybrid global and rolling shutter architecture, 2.25 µm pixels, advanced 3D stacking, on-chip RGB-IR separation, and a 73% pixel-array-to-die ratio.
Devices are available for evaluation and sampling now, with mass production scheduled for February 2026. Die size is 5.76 mm by 4.46 mm and package size 10.3 mm by 8.9 mm. RGB-IR variants support multiple output patterns and independent exposure times for color and NIR imaging.
STMicroelectronics (NYSE: STM) ha annunciato quattro nuovi sensori CMOS BrightSense da 5MP (VD1943, VB1943, VD5943, VB5943) per automazione industriale, sicurezza e applicazioni nel commercio al dettaglio il 20 ottobre 2025. La famiglia offre una singolare architettura ibrida globale e rolling shutter, pixel da 2,25 µm, avanzato stacking 3D, separazione RGB-IR integrata sul chip e un rapporto pixel-array-to-die del 73%. I dispositivi sono disponibili per valutazione e campionamento ora, con produzione di massa prevista per febbraio 2026. La dimensione del die è 5,76 mm per 4,46 mm e la dimensione del package è 10,3 mm per 8,9 mm. Le varianti RGB-IR supportano molteplici schemi di uscita e tempi di esposizione indipendenti per l’imaging a colori e NIR.
STMicroelectronics (NYSE: STM) presentó cuatro nuevos sensores CMOS BrightSense de 5MP (VD1943, VB1943, VD5943, VB5943) para automatización industrial, seguridad y aplicaciones minoristas el 20 de octubre de 2025. La familia ofrece una arquitectura híbrida única de obturador global y rolling shutter, píxeles de 2,25 µm, apilamiento 3D avanzado, separación RGB-IR integrada en el chip y una relación de píxel-array a die del 73%. Los dispositivos están disponibles para evaluación y muestreo ahora, con producción en masa prevista para febrero de 2026. El tamaño del die es 5,76 mm por 4,46 mm y el tamaño del package es 10,3 mm por 8,9 mm. Las variantes RGB-IR admiten múltiples patrones de salida y tiempos de exposición independientes para imágenes en color y NIR.
STMicroelectronics (NYSE: STM) 은 산업 자동화, 보안 및 소매용 애플리케이션을 위해 새로운 5MP BrightSense CMOS 이미지 센서 4종(VD1943, VB1943, VD5943, VB5943)을 2025년 10월 20일 발표했다. 이 패밀리는 하이브리드 글로벌 및 롤링 셔터 아키텍처, 2.25 µm 픽셀, 고급 3D 적층, 칩 내부 RGB-IR 분리, 그리고 픽셀 배열 대 다이 비율 73%를 제공한다. 디바이스는 현재 평가 및 샘플링에 사용할 수 있으며, 2026년 2월 양산 예정. 다이 크기는 가로 5.76 mm, 세로 4.46 mm이고 패키지 크기는 10.3 mm × 8.9 mm이다. RGB-IR 변형은 여러 출력 패턴과 색상 및 NIR 이미징을 위한 독립 노출 시간을 지원한다.
STMicroelectronics (NYSE: STM) a présenté quatre nouveaux capteurs d'image CMOS BrightSense de 5 MP (VD1943, VB1943, VD5943, VB5943) destinés à l'automatisation industrielle, à la sécurité et aux applications de vente au détail, le 20 octobre 2025. La famille propose une architecture hybride globale et obturateur roulant unique, des pixels de 2,25 µm, un empilement 3D avancé, une séparation RGB-IR intégrée sur la puce et un ratio de pixel-array-to-die de 73 %. Les dispositifs sont disponibles dès maintenant pour évaluation et échantillonnage, avec une mise en production prévue pour février 2026. La taille du die est de 5,76 mm sur 4,46 mm et la taille du boîtier est de 10,3 mm sur 8,9 mm. Les variantes RGB-IR prennent en charge plusieurs schémas de sortie et des temps d’exposition indépendants pour l’imagerie couleur et NIR.
STMicroelectronics (NYSE: STM) stellte am 20. Oktober 2025 vier neue 5MP BrightSense CMOS-Bildsensoren (VD1943, VB1943, VD5943, VB5943) für industrielle Automatisierung, Sicherheit und Einzelhandel vor. Die Familie bietet eine einzigartige hybride globale und Rolling-Shutter-Architektur, 2,25 µm Pixel, fortgeschrittenes 3D-Stapeln, integrierte RGB-IR-Trennung auf dem Chip und ein 73% Pixel-Array-to-Die-Verhältnis. Die Geräte sind jetzt zur Bewertung und Musterung verfügbar, mit Massenproduktion geplant für Februar 2026. Die Die-Größe beträgt 5,76 mm × 4,46 mm, die Gehäusegröße 10,3 mm × 8,9 mm. RGB-IR-Varianten unterstützen mehrere Ausgangsmuster und unabhängige Belichtungszeiten für Farb- und NIR-Aufnahmen.
STMicroelectronics (NYSE: STM) قدمت أربعة مستشعرات CMOS BrightSense جديدة بدقة 5MP (VD1943، VB1943، VD5943، VB5943) للتطبيقات الصناعية الآلية، الأمن وتطبيقات البيع بالتجزئة في 20 أكتوبر 2025. العائلة تقدم بنية فريدة هجينة للغالق العالمي والغطس المتواصل، بكسلات 2.25 ميكرومتر، تكديس ثلاثي الأبعاد Stacking 3D، وفصل RGB-IR المدمج على الرقاقة، ونسبة pixel-array-to-die 73%. الأجهزة متاحة الآن للتقييم والعينات، مع إنتاج بكميات كبيرة مخطط له في فبراير 2026. حجم الداي 5.76 مم × 4.46 مم وحجم الحزمة 10.3 مم × 8.9 مم. نسخ RGB-IR تدعم أنماط إخراج متعددة وفترات تعريض مستقلة للتصوير بالألوان وNIR.
STMicroelectronics (NYSE: STM) 于 2025 年 10 月 20 日推出四款新的 5MP BrightSense CMOS 图像传感器（VD1943、VB1943、VD5943、VB5943），用于工业自动化、安全和零售应用。该系列提供独特的 混合全局/滚动快门 架构、2.25 µm 像素、先进的 3D 堆叠、片上 RGB-IR 分离，以及 像素阵列到芯片的比率 73%。设备现已进入评估和取样阶段，量产计划在 2026 年 2 月。晶圆尺寸为 5.76 mm × 4.46 mm，封装尺寸为 10.3 mm × 8.9 mm。RGB-IR 变体支持多种输出模式，颜色和近红外成像的曝光时间可独立设置。
- Product family includes four 5MP sensors (VD1943, VB1943, VD5943, VB5943)
- Unique hybrid global/rolling shutter for motion-free video and low-noise imaging
- On-chip RGB-IR separation preserving full 5MP for color and NIR
- Mass production scheduled for February 2026
- Mass production begins in February 2026, delaying broad revenue contribution until 2026
Insights
ST launches four 5MP hybrid-shutter image sensors, targeting industrial automation, security, and retail with compact, high-performance designs.
STMicroelectronics ships four new 5MP BrightSense sensors (VD1943, VB1943, VD5943, VB5943) that combine hybrid global/rolling shutter operation, 2.25µm pixels, advanced 3D stacking, and on-chip RGB‑IR separation. The devices aim to replace dual-chip architectures and reduce system complexity by offering both motion‑artifact‑free capture and low‑noise, high‑detail imaging in one product. The sensors are available for evaluation and sampling now, with mass production scheduled for
The business mechanism is straightforward: embed higher-function sensors earlier in product stacks to simplify camera modules and lower BOM and integration time. Key technical hooks are the hybrid shutter modes,
Concrete items to watch over the next 3–9 months include sampling feedback from pilot customers, evaluation-kit performance versus existing dual‑chip solutions, and the actual production ramp in
ST introduces new image sensors
for industrial automation, security and retail applications
- Four new 5MP image sensors allow customers to optimize image capture with high speed, high detail with a single, flexible product instead of two chips
- New device family is ideal for high-speed automated manufacturing processes and object tracking
- New sensors leverage market-leading technology for both global and rolling shutter modes, with a compact 2.25µm pixel with advanced 3D stacking, and on-chip RGB-IR separation
Geneva, Switzerland – October 20, 2025 — STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, introduces a new family of 5MP CMOS image sensors: VD1943, VB1943, VD5943, and VB5943. These advanced ST BrightSense sensors are designed to accelerate the development of innovative vision applications across industries, including advanced industrial automation with enhanced machine and robotic vision, next-generation security including biometric identification and traffic management, and smart retail applications such as inventory management and automated checkout. A longtime leader in optical sensing technology for consumer applications, ST continues to expand its offering for new applications with its industry-leading design, 3D stacking expertise and high-volume manufacturing for market-leading performance.
“Our new image sensors with hybrid global and rolling shutter modes allow our customers to optimize image capture, ensuring motion-artifact-free video capture and low-noise, high-detail imaging at the same time, making it ideal for high-speed automated manufacturing processes and object tracking. This architecture is unique on market today and provides unmatched flexibility, performance, and integration. We continue to broaden our portfolio of solutions for a wide range of industrial applications and want to bring the best of optical sensing technologies to both existing and new applications,” said Alexandre Balmefrezol, Executive Vice President and General Manager of STMicroelectronics’s Imaging Sub-Group.
"Industrial and security imaging are pushing sensor performance to new levels, enabling functions from identification to robotic guidance, gauging and advanced monitoring and inspection,” said Florian Domengie, PhD Principal Analyst Imaging at Yole Group. “By 2030, this image sensor market is projected to reach
*Source: Status of the CMOS Image Sensor Industry 2025 – 3D Imaging & Sensing 2025, Yole Group
Technical notes
The VD1943, VD5943, VB1943, and VB5943 sensors, part of the ST BrightSense portfolio, are ready for evaluation and sampling, with mass production scheduled to begin in February 2026. Detailed documentation, evaluation kits, and product samples, are available through the local ST sales representative or an authorized distributor.
| Product code | Chroma | Package |
| VD5943 | Monochrome | Sensor die |
| VB5943 | Monochrome | OBGA sensor |
| VD1943 | RGB-IR | Sensor die |
| VB1943 | RGB-IR | OBGA sensor |
Dual global and rolling shutter modes
The sensors provide hybrid global and rolling shutter modes, allowing developers to optimize image capture for specific application requirements. This functionality ensures motion-artifact-free video capture (global shutter) and low-noise, high-detail imaging (rolling shutter), making it ideal for high-speed object tracking and automated manufacturing processes.
Compact design with advanced pixel technology
Using 2.25 µm pixel technology and advanced 3D stacking, the sensors deliver high image quality in a smaller footprint. The die size is 5.76 mm by 4.46 mm, with a package size of 10.3 mm by 8.9 mm, and an industry-leading
On-chip RGB-IR separation
The RGB-IR variants of the sensors feature on-chip RGB-IR separation, eliminating the need for additional components and simplifying system design. This capability supports multiple output patterns, including 5MP RGB-NIR 4x4, 5MP RGB Bayer, 1.27MP NIR subsampling, and 5MP NIR smart upscale, with independent exposure times and instant output pattern switching. This integration reduces costs while maintaining full 5MP resolution for both color and infrared imaging.
Enhanced imaging performance
The sensors incorporate backside illumination (BSI) and capacitive deep trench isolation (CDTI) pixel technologies to enhance sensitivity and sharpness, particularly in low lighting conditions. Single-frame on-chip HDR improves detail visibility across bright and dark areas. These features enable high-quality imaging in challenging environments and support advanced machine vision and edge AI applications.
About STMicroelectronics
At ST, we are 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our
Further information can be found at www.st.com.
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Attachments
- P4728D -- Oct 20 2025 -- New BrightSense image sensors_FINAL FOR PUBLICATION
- ST BrightSense_vd1943-vd5943-product-illustration
FAQ
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