Synopsys Inc Stock Price, News & Analysis

Synopsys (NASDAQ: SNPS) and Ansys (NASDAQ: ANSS) provided an update on their pending acquisition's regulatory approval status. The companies have successfully obtained merger clearance in all jurisdictions except China, where they are in advanced discussions with the State Administration for Market Regulation (SAMR).

The companies emphasized that the merger approvals received so far were based on the transaction's merits and its expected benefits for stakeholders and future technology innovation. They continue to work collaboratively with Chinese regulators to secure the final necessary approval.

Synopsys and Samsung Foundry announced a strengthened collaboration to advance AI and multi-die design innovation. Key highlights include a successful HBM3 customer tape-out on Samsung's SF2 process using Synopsys 3DIC Compiler, reducing turnaround time by 10X. The partnership features new AI-driven digital and analog flows certified for Samsung's SF2P process, along with design technology co-optimization delivering superior power, performance, and area results. Synopsys is expanding its IP portfolio on Samsung's advanced nodes, including 224G, UCIe, MIPI, and LPDDR6 technologies. The collaboration achieved significant improvements in HBM routing time (reduced to 4 hours) and enhanced worst-case eye opening by 6%. The partnership encompasses comprehensive IP solutions across Samsung's process nodes from 14LPP/U to SF2P/A, supporting various applications in HPC, consumer electronics, mobile, IoT, and automotive markets.

Synopsys (SNPS) has achieved a significant PCIe 6.x interoperability milestone with Broadcom's PEX90000 series switch, demonstrated at PCI-SIG DevCon 2025. The collaboration showcases successful interoperability between Synopsys' PCIe 6.x IP solution and Broadcom's switch, operating at 64 GT/s. This achievement is crucial for next-generation AI infrastructures, as PCIe switches are essential for scaling modern AI workloads. Synopsys' PCIe 6.x IP solution includes PHY and controller components, and the company has completed over 100 PCIe 6.x IP implementations and 3,800 customer tapeouts across seven PCIe generations. The interoperability demonstration validates that future products integrating these solutions will work seamlessly within the ecosystem, reducing design risk and accelerating time-to-market for high-performance computing and AI data center systems.

Keysight Technologies and Synopsys have introduced an AI-powered RF design migration flow to accelerate the transition from TSMC's N6RF+ process to N4P technology. The solution integrates Keysight's RFPro for device parameterization and electromagnetic simulation with Synopsys' Custom Compiler and ASO.ai for analog design migration. This collaboration, built on TSMC's Analog Design Migration methodology, enables RF circuit designers to efficiently redesign passive devices and components while meeting advanced process rules. The integrated workflow leverages AI technologies to streamline the migration process, reduce time-to-market, and achieve optimal Power, Performance, and Area (PPA) metrics on TSMC's advanced nodes.

Synopsys (NASDAQ: SNPS) has suspended its financial guidance for Q3 FY2025 and full FY2025 following a letter from the Bureau of Industry and Security (BIS) of the U.S. Department of Commerce. The letter, received on May 29, 2025, after the company's Q2 FY2025 earnings announcement, outlines new export restrictions related to China. The company is currently evaluating how these restrictions might affect its business operations, financial results, and overall financial condition.

Synopsys (SNPS) reported strong Q2 FY2025 financial results with revenue of $1.604 billion, surpassing guidance. The company achieved GAAP EPS of $2.24 and non-GAAP EPS of $3.67. Net income reached $349.2 million on a GAAP basis and $572.7 million on a non-GAAP basis. Synopsys reaffirmed its full-year 2025 revenue guidance of $6.745-$6.805 billion and maintained non-GAAP operating margin targets. The company's growth is driven by AI, software-defined systems, and silicon proliferation trends. For Q3 FY2025, Synopsys expects revenue between $1.755-$1.785 billion and non-GAAP EPS of $3.82-$3.87. The company completed the sale of its Software Integrity business on September 30, 2024.

Synopsys (NASDAQ: SNPS) has scheduled its second quarter fiscal year 2025 earnings release for Wednesday, May 28, 2025, after market close. The company will host a conference call at 2:00 p.m. Pacific Time / 5:00 p.m. Eastern Time to discuss financial results and business outlook.

Financial information will be available on the investor website before the call. A live webcast will be accessible to participants, who should join at least 10 minutes before the start. A replay will be available until the announcement of Q3 FY2025 results.

Synopsys and Intel Foundry have announced a major collaboration on angstrom-scale chip designs for Intel 18A and 18A-P technologies. The partnership features production-ready EDA flows and the industry's broadest IP portfolio, optimized for Intel's advanced process nodes.

Key developments include:

• Production-ready digital and analog EDA flows for Intel 18A and 18A-P technologies
• Early design technology co-optimization for Intel 14A-E
• Enhanced multi-die design capabilities through Intel's EMIB-T packaging technology
• Broad IP portfolio supporting 224G Ethernet, PCIe 7.0, UCIe, USB4, and other technologies

Synopsys has joined the Intel Foundry Accelerator Design Services Alliance and the new Intel Foundry Accelerator Chiplet Alliance, strengthening their ecosystem partnership. The collaboration aims to accelerate the development of high-performance AI and HPC chip designs, leveraging Intel's PowerVia backside power delivery and RibbonFET Gate-all-around transistor architecture.

Synopsys (SNPS) has announced an expanded collaboration with TSMC to deliver advanced EDA and IP solutions for TSMC's cutting-edge processes. The partnership focuses on certified digital and analog flows for TSMC A16™ and N2P processes, powered by Synopsys.ai.

Key developments include early collaboration on TSMC A14 process, support for 3Dblox and TSMC's CoWoS® technologies enabling 5.5x reticle size packages, and a comprehensive IP portfolio offering the lowest power consumption on TSMC's N2/N2P processes. The collaboration features complete IP solutions for advanced standards like HBM4, 1.6T Ethernet, UCIe, PCIe 7.0, and UALink.

The partnership enhances 3DIC Compiler capabilities, supporting ultra-high-density interconnects and increased productivity for multi-die designs. The solution integrates multi-physics analysis and Ansys simulation technologies for comprehensive power, thermal, and signal integrity analysis.