SkyWater Florida and BRIDG Complete Phase One of Government-Funded IBAS Interposer Technology Development Program
SkyWater Technology (NASDAQ: SKYT) and BRIDG have successfully completed phase one of a DOD-funded Industrial Base Analysis and Sustainment program, establishing a domestic silicon interposer fabrication capability. This milestone supports the development of advanced electronic systems using silicon interposers, which enhance performance in heterogeneous integration applications. Elements from this phase will be applied in subsequent program phases to incorporate additional technologies. SkyWater aims to assist both government and commercial customers with interposer design and fabrication.
- Completion of phase one of DOD-funded IBAS program highlights SkyWater's commitment to domestic silicon interposer manufacturing.
- Development of advanced electronic systems boosts potential demand for SkyWater's technology solutions.
- Collaboration with BRIDG and imec strengthens relationships within the semiconductor and microelectronics sector.
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Establishes capability to support bridge interposer fabrication to strengthen national security for critical emerging technologies
The IBAS program’s goal is to establish a comprehensive domestic silicon interposer manufacturing capability, supporting several advanced electronic systems. Silicon interposers are used to integrate semiconductor devices into a highly compact and power efficient format, providing increased performance and capability. Versatile and compact, silicon interposers are quickly becoming one of the most popular choices for advanced packaging.
“Completing phase one of this IBAS program is a major milestone for BRIDG and its ecosystem of partners who are establishing capabilities to manufacture domestic, reliable, next-generation microelectronic systems utilizing advanced packaging solutions in an open foundry,” said Dr.
Elements of the phase one bridge interposer capability will also be used in subsequent phases of the silicon interposer development program, where through-silicon vias (TSV) and RF-enabling materials and devices will be incorporated. The technology is available to both government and commercial customers.
“We are excited to have the first phase of the development program complete.
About BRIDG:
BRIDG is a not-for-profit, public-private partnership specializing in digital, RF, and photonics silicon interposer technology development coupled with advanced packaging capabilities. As an ITAR-certified and
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