Renesas Expands Satellite Communications Portfolio with Industry’s First Commercial Dual-Beam Active Beamforming IC Lineup
Renesas Electronics Corporation (TSE:6723) has launched the F61xx series of dual-beam active beamforming ICs, designed for phased array antennas used in Satcom, radar, and communications. The new products include the F6121, F6122, and F6123 ICs, offering best-in-class power consumption and flexibility for signal processing. These devices enable low-latency connectivity and are expected to enhance next-generation applications, with production starting in 2022. They address challenges like thermal management and affordability, marking a significant advancement in satellite communication technology.
- Introduction of three new ICs (F6121, F6122, F6123) enhances product portfolio.
- Best-in-class power consumption and noise figure improve system performance.
- Dual-beam capability allows for simultaneous multi-satellite operation.
- Designed-in by major satcom solution providers indicates strong market demand.
- Production ramps for 2022 may lead to increased revenue opportunities.
- None.
- F6121 for Ku-band Satcom
- F6122 for Ka-band Satcom and
- F6123 for Ku-band radar and line-of-sight communications
Featuring best-in-class power consumption, noise figure, compact size and ease of integration, these new ICs are a critical enabler of next-generation, low-latency electronically steered antennas for in-flight connectivity (IFC), maritime, satcom-on-the-move, and low earth orbit (LEO) ground terminals.
The new F61xx Rx devices are the first commercial products to feature dual-beam capability for make-before-break or simultaneous multi-satellite, multi-orbit operation over the full Ku and Ka Satcom bands. The F61xx offers OEMs the flexibility of LNA selection and placement for improved noise figure and system G/T performance. Taking advantage of these features, the ICs have already been designed-in by major satcom solution providers and OEMs for half- and full-duplex systems, with anticipated production ramps starting in 2022.
“Our customers face three main challenges as they migrate from mechanical antennas to electronically steered antennas: Thermal management, physical integration and affordability,” said Naveen Yanduru, Vice President of RF Communications Product Division at Renesas. “The new dual-beam F61xx devices deliver the cost-effective, power-efficient, low noise and compact size combination the industry needs for next-generation low-latency Satcom, radar and communications systems that will connect more people in more places.”
About the New Satcom Beamforming ICs
The second generation of F61xx dual-beam beamforming ICs address the thermal, integration, and cost challenges designers face as they transition from bulky mechanically steered antennas to the lower weight and leaner profile active electronically scanned array antennas (AESAs). The new devices deliver reduced power consumption, increased on-chip beam-state memory, and dual-beam operation (configurable for single beam with 40 percent power savings), as well as highly improved RF performance. They complement the well-established sub-6 GHz RFIC portfolio and the recent 5G mmWave product lines.
The Satcom beamformer ICs are also part of Renesas’ new Winning Combination for a Ku-Band Satcom Communications System, which also includes the company’s power management and timing products. Renesas offers over 250 Winning Combinations featuring complementary analog, power, timing devices and embedded processing to provide an easy-to-use architecture, simplify the design process and significantly reduce design risk for customers in a wide variety of applications. For more on this and additional Renesas solutions, go to renesas.com/win.
Key Features of the F61xx devices Include:
- Flexibility to support dual/single-beam, full/half-duplex, single/dual-polarization and 1D and 2D array architectures with best-in-class power consumption and cascaded noise figure performance
-
Highly compact footprint with <
4% panel area utilization on Ku λ/2 grid and relaxed pitch FC-BGA package for reduced integration complexity and improved RF isolation - Fast and flexible digital interface with on-chip beam-state memory for low latency antenna beam switching in under 100ns
Availability
The F6121 Rx BFIC along with the F6921 LNA and F6521 Tx BFIC are released to production, and available now to support half-duplex and full-duplex antenna designs for Ku-band LEO and GEO ground terminals. The F6121, F6122, and F6123 ICs are available now and shipping to customers designing Satcom and radar systems for 2022 deployments. More information about the F61xx beamforming ICs is available at renesas.com/satcom.
About Renesas RF Communications Division
With more than 370 million devices shipped in the last decade, RFD plays a key role in the ongoing communications revolution. Globally known for our unique SNR and linearity enhancing innovations, we are proud of our status as trusted partners to the biggest players in cellular infrastructure, satellite communications, and other industrial applications.
About
(Remarks). All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners
View source version on businesswire.com: https://www.businesswire.com/news/home/20211116005537/en/
Media Contacts:
+ 1-408-887-4308
don.parkman.xh@renesas.com
Source:
FAQ
What are the new products launched by Renesas Electronics?
How do the F61xx ICs benefit satellite communications?
When will the F61xx devices be available for production?
What applications can utilize the new F61xx ICs?
What is the significance of the dual-beam capability in the F61xx series?
