Renesas Expands 5G mmWave Beamformer Portfolio With Industry-Leading Transmitter Output Power Capability
Renesas Electronics Corporation has expanded its 5G beamformer IC family with the introduction of two new dual-polarization mmWave devices, F5288 and F5268. These chipsets are designed for 2x2 antenna architecture and operate efficiently at n257, n258, and 261 bands. Notably, they offer the highest Tx output power capability in silicon, exceeding 15.5dBm linear output power per channel. Their advanced technologies, such as Dynamic Array Power, enhance flexibility and efficiency, making them suitable for various wireless applications including fixed wireless access and base stations.
- Introduction of F5288 and F5268 ICs, enhancing 5G capabilities.
- Highest Tx output power capability in silicon, over 15.5dBm per channel.
- Dynamic Array Power technology allows for efficient scaling of output power.
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Third-Generation Beamformer ICs Enable High-Efficiency and Low-Cost Phased Array Radios with
Third-Generation 5G mmWave Beamformers with
The new F5288 and F5268 ICs feature a unique
“Adequate signal range – or lack thereof – remains the biggest challenge as the industry shifts to 5G mmWave technologies for both urban and suburban mobile and fixed wireless networks,” said Naveen Yanduru, Vice President of RF Communications Product Division at Renesas. “Renesas’ new beamformer ICs are a game changer for this evolving market, offering small, integrated beamforming solutions with high output power that enable communications customers to implement cost-effective basestation and FWA designs for long-range wireless applications.”
About the F5288 and F5268 5G mmWave Beamforming ICs
Renesas’ third-generation mmWave beamformer ICs address all the beamforming capabilities required by 5G systems while achieving the highest linear RF output power in any silicon technology with high efficiency.
The ICs’ dual-polarization 8-channel architecture provides a highly symmetric and very low loss antenna routing network to improve overall antenna efficiency and reduce board costs. The exposed die package allows for more efficient thermal management at the board with improved heat dissipation through the back of the IC. In addition, Renesas designed the package pinmap to simplify board design and reduce design risks. Lower complexity PCB design with minimum layer counts results in reduced board costs and faster time to market.
The F5288 and F5268 ICs also feature several of Renesas’ state-of-the-art technologies to enhance array-level performance.
Additional features include
- 26.5GHz – 29.5GHz (F5288) and 24.25GHz – 27.5GHz (F5268) operation
- Advanced temperature compensation techniques to minimize RF performance degradation with varying temperatures
- State-of-the-art phase and gain control including 360° phase control range with true 6-bit resolution and up to 31.5dB gain control with 0.5dB steps
- Improved Rx linearity modes to provide additional flexibility for the receiver lineup
- Rx noise figures as low as ~4.5dB at room temperature and under 5.5dB at temperatures up to 95°C
To further simplify system design, customers can leverage Renesas’ new Base Station Antenna Front End Winning Combination, which features the new F5288 and F5268 beamformer ICs along with the company’s F5728 up/down converters, 8V97003 wideband mmWave synthesizer, and a variety of Renesas PMIC devices. Renesas offers over 250 Winning Combinations featuring complementary analog, power, timing devices, and embedded processing to provide an easy-to-use architecture, simplify the design process, and significantly reduce design risk for customers in a wide variety of applications. For more on this and additional Renesas solutions, go to renesas.com/win.
Availability
The F5288 and F5268 beamformer ICs and evaluation systems are available now. More information is available at renesas.com/5G.
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