Nordson Test & Inspection’s New SpinSAM™ AMI System Wins Prestigious Global Technology Award
Nordson Test & Inspection has received the 2024 Global Technology Award for its new SpinSAM Acoustic Microimaging (AMI) system in the Test Equipment category at SMTA International. The innovative system features high-throughput capabilities, scanning up to four 300mm wafers simultaneously at 41 wafers per hour. With four matched waterfall transducers, it completes full wafer scans in under six minutes.
The SpinSAM AMI system delivers superior sensitivity and precise defect detection for various semiconductor applications, including bonded wafers, Chip-on-Wafer, stacked wafers, MEMS, and over-molded wafers. The system's compact design and 100% inspection capability, along with targeted edge scanning, optimize data acquisition in defect-prone areas.
Nordson Test & Inspection ha ricevuto il Premio Globale per la Tecnologia 2024 per il suo nuovo SpinSAM Acoustic Microimaging (AMI) system nella categoria Attrezzature di Test durante il SMTA International. Il sistema innovativo presenta capacità di alto rendimento, eseguendo la scansione di fino a quattro wafer da 300mm simultaneamente a 41 wafer all'ora. Con quattro trasduttori a cascata abbinati, completa la scansione completa dei wafer in meno di sei minuti.
Il sistema SpinSAM AMI offre una sensibilità superiore e una precisa rilevazione dei difetti per varie applicazioni nei semiconduttori, inclusi wafer incollati, Chip-on-Wafer, wafer impilati, MEMS e wafer sovrastampati. Il design compatto del sistema e la capacità di ispezione al 100%, insieme alla scansione mirata dei bordi, ottimizzano l'acquisizione dei dati nelle aree soggette a difetti.
Nordson Test & Inspection ha recibido el Premio Global a la Tecnología 2024 por su nuevo SpinSAM Acoustic Microimaging (AMI) system en la categoría de Equipos de Prueba en el SMTA International. El sistema innovador cuenta con capacidades de alto rendimiento, escaneando hasta cuatro obleas de 300 mm simultáneamente a 41 obleas por hora. Con cuatro transductores de cascada emparejados, completa el escaneo completo de obleas en menos de seis minutos.
El sistema SpinSAM AMI proporciona sensibilidad superior y detección precisa de defectos para diversas aplicaciones en semiconductores, incluyendo obleas unidas, Chip-on-Wafer, obleas apiladas, MEMS y obleas sobre moldeadas. El diseño compacto del sistema y la capacidad de inspección del 100%, junto con la escaneado dirigido de bordes, optimizan la adquisición de datos en áreas propensas a defectos.
Nordson Test & Inspection는 SMTA International에서 테스트 장비 범주로 새로운 SpinSAM Acoustic Microimaging (AMI) system으로 2024 글로벌 기술상을 수상했습니다. 이 혁신적인 시스템은 300mm 웨이퍼를 최대 4개까지 동시에 스캔하며 시간당 41개의 웨이퍼를 처리할 수 있는 높은 처리량 기능을 갖추고 있습니다. 네 개의 일치하는 워터폴 트랜스듀서를 통해 6분 이내에 전체 웨이퍼 스캔을 완료합니다.
SpinSAM AMI 시스템은 결합된 웨이퍼, Chip-on-Wafer, 적층 웨이퍼, MEMS 및 오버몰딩된 웨이퍼를 포함한 다양한 반도체 응용 프로그램에 대해 뛰어난 감도와 정확한 결함 탐지를 제공합니다. 시스템의 컴팩트한 디자인과 100% 검사 능력, 타겟 가장자리 스캔은 결함 발생이 잦은 영역에서 데이터 수집을 최적화합니다.
Nordson Test & Inspection a reçu le Prix Mondial de la Technologie 2024 pour son nouveau SpinSAM Acoustic Microimaging (AMI) system dans la catégorie Equipements de Test lors du SMTA International. Ce système innovant possède des capacités de haute performance, scannant jusqu'à quatre wafers de 300mm simultanément à 41 wafers par heure. Avec quatre transducteurs à cascade appariés, il complète les scans de wafer en moins de six minutes.
Le système SpinSAM AMI offre une sensibilité supérieure et une détection précise des défauts pour diverses applications dans le domaine des semi-conducteurs, y compris les wafers collés, Chip-on-Wafer, wafers empilés, MEMS et wafers sous-moulés. La conception compacte du système et sa capacité d'inspection à 100%, associées à un scan ciblé sur les bords, optimisent l'acquisition de données dans les zones à risque de défaut.
Nordson Test & Inspection hat den 2024 Global Technology Award für sein neues SpinSAM Acoustic Microimaging (AMI) system in der Kategorie Testgeräte beim SMTA International erhalten. Das innovative System verfügt über Hochdurchsatzfähigkeiten und kann gleichzeitig bis zu vier 300mm-Wafer mit 41 Wafern pro Stunde scannen. Mit vier passenden Wasserfall-Transducern werden vollständige Wafer-Scans in weniger als sechs Minuten abgeschlossen.
Das SpinSAM AMI-System bietet überlegene Empfindlichkeit und präzise Fehlererkennung für verschiedene Halbleiteranwendungen, einschließlich gebondeter Wafer, Chip-on-Wafer, gestapelter Wafer, MEMS und übergossener Wafer. Das kompakte Design des Systems und die 100% Inspektionsfähigkeit, zusammen mit gezieltem Rand-Scanning, optimieren die Datenerfassung in fehleranfälligen Bereichen.
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SpinSAM AMI Inspection System by Nordson Test & Inspection. (Photo: Business Wire)
The new SpinSAM AMI system sets a new benchmark in the industry with its high throughput and superior sensitivity, enabling precise defect detection in wafer-based assemblies. Using an innovative spin-scanning method, the system scans up to four 300mm wafers simultaneously, achieving an impressive speed of 41 wafers per hour. This breakthrough scanning capability, combined with best-in-class defect capture and image quality, enhances both productivity and accuracy in semiconductor inspection. Designed for
Equipped with four matched waterfall transducers in a compact footprint, the SpinSAM AMI system is meticulously engineered to deliver full wafer scans in less than six minutes. This makes it an ideal solution for a wide range of semiconductor mid-end applications, including bonded wafers, Chip-on-Wafer, stacked wafers, MEMS, and over-molded wafers.
"The SpinSAM AMI system represents a significant advancement in wafer inspection technology, offering customers unmatched speed and precision to optimize their production processes,” said Ish Cooper, Vice President, Nordson Test & Inspection. "This award highlights our team’s expertise in designing and developing superior inspection solutions that meet the rigorous demands of the semiconductor industry. We are proud of this win, on the heels of our recent Best-of-the-West Finalist award from SEMI Association and Semiconductor Digest.”
Since 2005, the prestigious Global Technology Awards have recognized the absolute best new innovations in the printed circuit assembly and packaging industries. It brings together the global SMT and advanced packaging industry in a celebration of the companies and people that are achieving the highest standards and driving our industry forward. For more information, visit www.globalsmt.net.
For more information, visit www.nordson.com.
About Nordson TEST & INSPECTION
Nordson TEST & INSPECTION offers its SMT & Semiconductor customers a robust product portfolio, including Acoustic, Optical and both Manual and Automated X-ray Inspection systems, X-ray Component Counting systems and Semiconductor measurement sensors. Nordson TEST & INSPECTION is uniquely positioned to serve its customers with best-in-class precision technologies, passionate sales and support teams, global reach, and unmatched consultative applications expertise.
About Nordson
Nordson Corporation (Nasdaq: NDSN) is an innovative precision technology company that leverages a scalable growth framework through an entrepreneurial, division-led organization to deliver top tier growth with leading margins and returns. The Company’s direct sales model and applications expertise serves global customers through a wide variety of critical applications. Its diverse end market exposure includes consumer non-durable, medical, electronics and industrial end markets. Founded in 1954 and headquartered in
View source version on businesswire.com: https://www.businesswire.com/news/home/20241030258248/en/
For additional information, contact:
Carla Furanna
Nordson Test & Inspection
952-820-5837
Source: Nordson Test & Inspection
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