MediaTek's Dimensity 7300 Chips Level Up AI and Mobile Gaming for High-Tech Smartphones and Foldables

Rhea-AI Summary

MediaTek announced its new Dimensity 7300 and Dimensity 7300X chipsets, designed for high-tech smartphones and foldable devices. These 4nm chips feature octa-core CPUs with Arm Cortex-A78 and Cortex-A55 cores, achieving up to 25% lower power consumption compared to the Dimensity 7050. Enhanced with the Arm Mali-G615 GPU and MediaTek HyperEngine, they offer 20% faster FPS and 20% improved energy efficiency. The 7300X supports dual displays for foldables. They also provide upgraded photography capabilities with the MediaTek Imagiq 950, supporting 200MP cameras, 4K HDR video, and AI-enhanced computing. Key features include 5G UltraSave 3.0+ technology, tri-band Wi-Fi 6E, and dual 5G SIM support.

Positive

• 25% lower power consumption in the A78 cores compared to the Dimensity 7050.
• 20% faster FPS and 20% improved energy efficiency compared to competitor alternatives.
• Support for 200MP cameras and 4K HDR video with enhanced photography features.
• Enhanced AI task efficiency with MediaTek APU 655, delivering twice the performance of the Dimensity 7050.
• Support for dual displays on the Dimensity 7300X, catering to foldable devices.
• Tri-band Wi-Fi 6E for fast and reliable multi-gigabit wireless connectivity.
• Dual 5G SIM support with dual VoNR for greater user choice.
• 5G UltraSave 3.0+ technology provides 13-30% greater power efficiency in 5G sub-6GHz connectivity scenarios.

Negative

• No specific information on pricing or availability, which could impact investor confidence.
• Possible market saturation and competition from other chipset manufacturers may affect market share.

HSINCHU, May 29, 2024 /PRNewswire/ -- MediaTek today announced the Dimensity 7300 and the Dimensity 7300X, a pair of ultra-efficient 4nm chips for high-tech mobile offerings. Providing best-in-class power efficiency and excellent performance, the Dimensity 7300 chipsets enable effortless multitasking, superior photography, accelerated gaming, and AI-enhanced computing; additionally, the Dimensity 7300X is designed with flip-style foldable devices in mind, providing support for dual displays.

Both MediaTek Dimensity 7300 chipsets have an octa-core CPU consisting of 4X Arm Cortex-A78 cores operating at up to 2.5GHz paired with 4X Arm Cortex-A55 cores. The 4nm process provides up to 25% lower power consumption in the A78 cores compared to the Dimensity 7050. The CPU works together with the latest Arm Mali-G615 GPU and a suite of MediaTek HyperEngine optimizations to accelerate gaming experiences. In comparison to competitor alternatives, the Dimensity 7300 series offers 20% faster FPS and 20% improved energy efficiency. To further enhance gaming experiences, the new chips utilize smart resource optimization, optimize 5G and Wi-Fi game connections, and support Bluetooth LE Audio technology with Dual-Link True Wireless Stereo Audio.

"The MediaTek Dimensity 7300 chips will be important for integrating the latest AI enhancements and connectivity features so consumers can seamlessly stream and game," said Dr. Yenchi Lee, Deputy General Manager of MediaTek's Wireless Communications Business. "Furthermore, the Dimensity 7300X enables OEMs to develop innovative new form factors thanks to its dual display support."

The Dimensity 7300 chipsets also offer upgraded photography with the MediaTek Imagiq 950, featuring a premium-grade 12-bit HDR-ISP with support for a 200MP main camera. Enhanced with new hardware engines providing precise noise reduction (MCNR), face detection (HWFD), and video HDR, the Dimensity 7300 lets users capture stunning images and videos in any lighting. Additionally, live focus photo performance is up to 1.3X faster and photo remastering is up to 1.5X faster than the Dimensity 7050. Users can also record 4K HDR video with over 50% wider dynamic range compared to competitor solutions, bringing out more details in videos.

The MediaTek APU 655 significantly boosts AI task efficiency, delivering twice the performance of the Dimensity 7050. The Dimensity 7300 chips also accommodate new mixed precision data types to more efficiently utilize memory bandwidth and reduce memory requirements for larger AI models.

With MediaTek's MiraVision 955 built-in, the Dimensity 7300 SoCs support impressively detailed WFHD+ displays with 10-bit true color, along with support for global HDR standards, enhancing media streaming and playback. Additionally, the dedicated support for dual display flip phones on the Dimensity 7300X makes it easier for OEMs to meet the growing market demand for innovative form factors.

Other key features of the Dimensity 7300 and the Dimensity 7300X include:

• MediaTek 5G UltraSave 3.0+ technology incorporating a complete suite of R16 power saving enhancements, plus MediaTek's own optimizations that provide between 13-30% greater power efficiency compared to competitor alternatives in common 5G sub-6GHz connectivity scenarios.
• Support for up to 3.27Gb/s 5G downlink via 3CC carrier aggregation, providing faster downlink speeds within urban and suburban environments.
• Tri-band Wi-Fi 6E support for fast and reliable multi-gigabit wireless connectivity.
• Dual 5G SIM support with dual VoNR to give users more choice.

To learn more about MediaTek's Dimensity portfolio, please visit: https://i.mediatek.com/mediatek-5g.

About MediaTek Inc.

MediaTek Incorporated (TWSE: 2454) is a global fabless semiconductor company that enables nearly 2 billion connected devices a year. We are a market leader in developing innovative systems-on-chip (SoC) for mobile, home entertainment, connectivity and IoT products. Our dedication to innovation has positioned us as a driving market force in several key technology areas, including highly power-efficient mobile technologies, automotive solutions and a broad range of advanced multimedia products such as smartphones, tablets, digital televisions, 5G, Voice Assistant Devices (VAD) and wearables. MediaTek empowers and inspires people to expand their horizons and achieve their goals through smart technology, more easily and efficiently than ever before. We work with the brands you love to make great technology accessible to everyone, and it drives everything we do. Visit www.mediatek.com for more information.

MediaTek Press Office: 
PR@mediatek.com

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SOURCE MediaTek Inc.

FAQ

What are the key features of MediaTek's Dimensity 7300 chips released on May 29, 2024?

The Dimensity 7300 chips offer 25% lower power consumption, 20% faster FPS, support for 200MP cameras, and enhanced AI task efficiency.

How do MediaTek's Dimensity 7300 chips improve mobile gaming?

The Dimensity 7300 chips use Arm Mali-G615 GPU and MediaTek HyperEngine optimizations, providing 20% faster FPS and improved energy efficiency.

What is the significance of the Dimensity 7300X for foldable devices?

The Dimensity 7300X supports dual displays, making it ideal for flip-style foldable devices.

What AI enhancements do the Dimensity 7300 chips offer?

The Dimensity 7300 chips feature the MediaTek APU 655, which delivers twice the AI task efficiency compared to the Dimensity 7050.

How do the Dimensity 7300 chips enhance photography?

They include the MediaTek Imagiq 950, supporting 200MP cameras, 4K HDR video, MCNR, HWFD, and video HDR for superior image and video quality.

What connectivity features are included in the Dimensity 7300 chips?

The chips feature 5G UltraSave 3.0+, tri-band Wi-Fi 6E, and dual 5G SIM support for enhanced connectivity.

How does the power efficiency of the Dimensity 7300 compare to previous models?

The Dimensity 7300 achieves up to 25% lower power consumption in the A78 cores compared to the Dimensity 7050.