Introducing a Wide Portfolio of IGBT 7 Power Devices Optimized for Applications Across Sustainability, E-Mobility and Data Centers
Microchip Technology (MCHP) has unveiled its new portfolio of IGBT 7 power devices, designed for sustainability, E-Mobility, and data center applications. The portfolio features multiple topologies, packages, and voltage ranges from 1200V to 1700V with currents from 50A to 900A.
The devices offer improved performance with lower power losses, higher power density, and enhanced system efficiency. Available in D3, D4 62mm, SP6C, SP1F, and SP6LI packages, these components support various configurations including three-level NPC, three-phase bridge, and multiple chopper topologies. The portfolio is specifically optimized for applications in solar inverters, hydrogen ecosystems, commercial vehicles, and More Electric Aircraft (MEA).
Microchip Technology (MCHP) ha presentato il suo nuovo portafoglio di dispositivi di potenza IGBT 7, progettati per la sostenibilità, la mobilità elettrica e le applicazioni nei data center. Il portafoglio include molteplici topologie, pacchetti e intervalli di tensione da 1200V a 1700V con correnti da 50A a 900A.
I dispositivi offrono prestazioni migliorate con minor perdita di potenza, maggiore densità di potenza ed efficienza del sistema ottimizzata. Disponibili nei pacchetti D3, D4 62mm, SP6C, SP1F e SP6LI, questi componenti supportano varie configurazioni, inclusi NPC a tre livelli, ponte trifase e molteplici topologie a chopper. Il portafoglio è specificatamente ottimizzato per applicazioni in inverter solari, ecosistemi dell'idrogeno, veicoli commerciali e aerei più elettrici (MEA).
Microchip Technology (MCHP) ha presentado su nueva cartera de dispositivos de potencia IGBT 7, diseñados para la sostenibilidad, la movilidad eléctrica y aplicaciones en centros de datos. La cartera presenta múltiples topologías, paquetes y rangos de voltaje desde 1200V hasta 1700V con corrientes de 50A a 900A.
Los dispositivos ofrecen un rendimiento mejorado con menores pérdidas de energía, mayor densidad de potencia y eficiencia del sistema mejorada. Disponibles en paquetes D3, D4 62mm, SP6C, SP1F y SP6LI, estos componentes admiten varias configuraciones, incluidos NPC de tres niveles, puente trifásico y múltiples topologías de chopper. La cartera está específicamente optimizada para aplicaciones en inversores solares, ecosistemas de hidrógeno, vehículos comerciales y aviones más eléctricos (MEA).
마이크로칩 기술(MCHP)가 지속 가능성, 전기 이동 수단 및 데이터 센터 애플리케이션을 위해 설계된 IGBT 7 전력 장치의 새로운 포트폴리오를 공개했습니다. 이 포트폴리오는 1200V에서 1700V까지의 다양한 전압 범위와 50A에서 900A까지의 전류를 포함한 여러 가지 토폴로지 및 패키지를 특징으로 합니다.
이 장치는 낮은 전력 손실, 높은 전력 밀도 및 향상된 시스템 효율성을 제공하는 향상된 성능을 자랑합니다. D3, D4 62mm, SP6C, SP1F 및 SP6LI 패키지로 제공되는 이러한 구성 요소는 3단계 NPC, 3상 브리지 및 다중 다이오드 토폴로지를 포함한 다양한 구성을 지원합니다. 이 포트폴리오는 태양광 인버터, 수소 생태계, 상업용 차량 및 더 많은 전기 항공기(MEA) 애플리케이션에 최적화되어 있습니다.
Microchip Technology (MCHP) a dévoilé son nouveau portefeuille de dispositifs de puissance IGBT 7, conçus pour la durabilité, la mobilité électrique et les applications en centres de données. Le portefeuille comprend plusieurs topologies, emballages et plages de tension allant de 1200V à 1700V, avec des courants de 50A à 900A.
Les dispositifs offrent des performances améliorées avec des pertes de puissance réduites, une densité de puissance plus élevée et une efficacité système accrue. Disponibles dans des boîtiers D3, D4 62mm, SP6C, SP1F et SP6LI, ces composants prennent en charge diverses configurations, y compris NPC à trois niveaux, pont triphasé et plusieurs topologies de découpage. Le portefeuille est spécifiquement optimisé pour des applications dans des onduleurs solaires, des écosystèmes à hydrogène, des véhicules commerciaux et des avions plus électriques (MEA).
Microchip Technology (MCHP) hat sein neues Portfolio von IGBT 7 Leistungshalbleitern vorgestellt, das für Nachhaltigkeit, E-Mobilität und Rechenzentrumsanwendungen konzipiert ist. Das Portfolio umfasst mehrere Topologien, Gehäuse und Spannungseinstellungen von 1200V bis 1700V mit Strömen von 50A bis 900A.
Die Geräte bieten verbesserte Leistung mit geringeren Energieverlusten, höherer Leistungsdichte und gesteigerter Systemeffizienz. Erhältlich in den Gehäusen D3, D4 62mm, SP6C, SP1F und SP6LI unterstützen diese Komponenten verschiedene Konfigurationen, einschließlich dreistufigem NPC, dreiphasigem Brücken und mehreren Chopper-Topologien. Das Portfolio ist speziell für Anwendungen in Solarwechselrichtern, Wasserstoffökosystemen, Nutzfahrzeugen und More Electric Aircraft (MEA) optimiert.
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Microchip’s IGBT 7 portfolio is available with multiple topologies, current and voltage ranges
CHANDLER, Ariz., Nov. 12, 2024 (GLOBE NEWSWIRE) -- Power components are evolving to meet the increasing demands for higher efficiency, smaller size and greater performance in power electronic systems. To provide system designers with a wide range of power solutions, Microchip Technology (Nasdaq: MCHP) today announces its portfolio of IGBT 7 devices offered in different packages, multiple topologies, and current and voltage ranges.
Featuring increased power capability, lower power losses and compact device sizes, this new portfolio is designed to meet high-growth market segments such as sustainability, E-Mobility and data centers. These high-performance IGBT 7 devices are key building blocks for power applications in solar inverters, hydrogen ecosystems, commercial and agricultural vehicles and More Electric Aircraft (MEA).
Designers can select a suitable power solution based on their requirements. The IGBT 7 devices are offered in standard D3 and D4 62 mm packages, as well as SP6C, SP1F and SP6LI packages. Many configurations are available in the following topologies: three-level Neutral-Point Clamped (NPC), three-phase bridge, boost chopper, buck chopper, dual-common source, full-bridge, phase leg, single switch and T-type. Devices are available with voltages ranging from 1200V to 1700V and current ranging from 50A to 900A.
“The versatile IGBT 7 portfolio combines ease of use and cost efficiency with higher power density and reliability, offering our customers maximum flexibility. These products are designed for general industrial applications as well as specialized aerospace and defense applications,” said Leon Gross, corporate vice president of Microchip’s discrete product group. “Additionally, our power solutions can be integrated with Microchip’s broad range of FPGAs, microcontrollers (MCUs), microprocessors (MPUs), dsPiC® Digital Signal Controllers (DSCs) and analog devices to provide a comprehensive system solution from one supplier.”
The lower on-state IGBT voltage (Vce), improved antiparallel diode (lower Vf) and increased current capability can enable lower power losses, higher power density and higher system efficiency. The lower-inductance packages, combined with the higher overload capability at Tvj −175°C, make these devices excellent options for creating rugged and high-reliability aviation and defense applications—such as propulsion, actuation and power distribution—at a lower system cost.
For motor control applications where enhanced controllability of dv/dt is important, the IGBT 7 devices are designed to offer freewheeling softness for efficient, smooth and optimized driving of switches. These high-performance devices also aim to improve system reliability, reduce EMI and minimize voltage spikes.
Microchip offers a broad portfolio of power management solutions that includes analog devices, Silicon (Si) and Silicon Carbide (SiC) power technologies, dsPIC® Digital Signal Controllers (DCSs), and standard, modified and custom power modules. For more information about Microchip’s power products, visit the website.
Pricing and Availability
The variants of the IGBT 7 portfolio are available to purchase in production quantities. For additional information and to purchase, contact a Microchip sales representative, authorized worldwide distributor or visit Microchip’s Purchasing and Client Services website, www.microchipdirect.com.
Resources
High-res images available through Flickr or editorial contact (feel free to publish):
• Application image: www.flickr.com/photos/microchiptechnology/53984086328/sizes/l
About Microchip Technology:
Microchip Technology Inc. is a leading provider of smart, connected and secure embedded control and processing solutions. Its easy-to-use development tools and comprehensive product portfolio enable customers to create optimal designs which reduce risk while lowering total system cost and time to market. The company’s solutions serve approximately 120,000 customers across the industrial, automotive, consumer, aerospace and defense, communications and computing markets. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality. For more information, visit the Microchip website at www.microchip.com.
Note: The Microchip name and logo, the Microchip logo, dsPIC are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. mSiC are trademarks of Microchip Technology Inc. in the U.S.A. and other countries. All other trademarks mentioned herein are the property of their respective companies.
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