Lantronix Powers Next-Generation AI-Enabled Camera Solutions With Seamless Teledyne FLIR Thermal Integration
Lantronix (NASDAQ: LTRX) announced a breakthrough in AI-powered camera technology by integrating its Open-Q™ System-on-Module (SoM) solutions with Teledyne FLIR's thermal infrared camera modules and Prism™ embedded software. The integration enables development of next-generation AI-enabled camera solutions for autonomous navigation, drones, surveillance and robotics.
The solution leverages Lantronix's Open-Q SoMs, powered by Qualcomm Dragonwing™ QRB5165 and QCS8250 processors, delivering advanced AI capabilities including:
- Prism ISP features: super resolution, turbulence mitigation, and image enhancement
- Prism AI: real-time object detection and high-speed target tracking
- Support for Teledyne FLIR Hadron™ dual visible-thermal and Boson® thermal camera modules
The ultra-compact Open-Q 5165 SoM (50mm x 29mm) features 5th generation Qualcomm® AI Engine, delivering up to 15 trillion operations per second - twice the performance of previous generation.
Lantronix (NASDAQ: LTRX) ha annunciato una svolta nella tecnologia delle telecamere alimentate dall'IA integrando le sue soluzioni Open-Q™ System-on-Module (SoM) con i moduli di telecamera termica a infrarossi di Teledyne FLIR e il software embedded Prism™. Questa integrazione consente lo sviluppo di soluzioni per telecamere di nuova generazione abilitate all'IA per la navigazione autonoma, droni, sorveglianza e robotica.
La soluzione sfrutta gli Open-Q SoM di Lantronix, alimentati dai processori Qualcomm Dragonwing™ QRB5165 e QCS8250, offrendo capacità avanzate di IA tra cui:
- Caratteristiche ISP di Prism: super risoluzione, mitigazione delle turbolenze e miglioramento delle immagini
- Prism AI: rilevamento degli oggetti in tempo reale e tracciamento dei bersagli ad alta velocità
- Supporto per i moduli di telecamera duale visibile-termica Hadron™ e Boson® di Teledyne FLIR
L'ultra-compatto Open-Q 5165 SoM (50mm x 29mm) presenta il 5° generazione del Qualcomm® AI Engine, in grado di eseguire fino a 15 trilioni di operazioni al secondo - il doppio delle prestazioni della generazione precedente.
Lantronix (NASDAQ: LTRX) anunció un avance en la tecnología de cámaras impulsadas por IA al integrar sus soluciones Open-Q™ System-on-Module (SoM) con los módulos de cámara térmica infrarroja de Teledyne FLIR y el software embebido Prism™. Esta integración permite el desarrollo de soluciones para cámaras de próxima generación habilitadas para IA para navegación autónoma, drones, vigilancia y robótica.
La solución aprovecha los Open-Q SoMs de Lantronix, impulsados por los procesadores Qualcomm Dragonwing™ QRB5165 y QCS8250, que ofrecen capacidades avanzadas de IA que incluyen:
- Características ISP de Prism: super resolución, mitigación de turbulencias y mejora de imágenes
- Prism AI: detección de objetos en tiempo real y seguimiento de objetivos a alta velocidad
- Soporte para los módulos de cámara dual visible-térmica Hadron™ y Boson® de Teledyne FLIR
El ultra compacto Open-Q 5165 SoM (50mm x 29mm) presenta el 5ª generación del Qualcomm® AI Engine, que ofrece hasta 15 billones de operaciones por segundo, el doble del rendimiento de la generación anterior.
란트로닉스 (NASDAQ: LTRX)는 Open-Q™ 시스템 온 모듈(SoM) 솔루션을 테레다인 FLIR의 열 적외선 카메라 모듈 및 Prism™ 임베디드 소프트웨어와 통합하여 AI 기반 카메라 기술의 혁신을 발표했습니다. 이 통합은 자율 내비게이션, 드론, 감시 및 로봇 공학을 위한 차세대 AI 지원 카메라 솔루션 개발을 가능하게 합니다.
이 솔루션은 Qualcomm Dragonwing™ QRB5165 및 QCS8250 프로세서로 구동되는 란트로닉스 Open-Q SoM을 활용하여 다음과 같은 고급 AI 기능을 제공합니다:
- Prism ISP 기능: 초해상도, 난기류 완화 및 이미지 향상
- Prism AI: 실시간 객체 감지 및 고속 목표 추적
- 테레다인 FLIR의 이중 가시-열 카메라 모듈 Hadron™ 및 Boson® 지원
초소형 Open-Q 5165 SoM(50mm x 29mm)은 5세대 Qualcomm® AI 엔진을 갖추고 있으며, 초당 최대 15조 작업을 수행할 수 있어 이전 세대의 성능을 두 배로 향상시킵니다.
Lantronix (NASDAQ: LTRX) a annoncé une avancée dans la technologie des caméras alimentées par l'IA en intégrant ses solutions Open-Q™ System-on-Module (SoM) avec les modules de caméra thermique infrarouge de Teledyne FLIR et le logiciel embarqué Prism™. Cette intégration permet le développement de solutions de caméras de nouvelle génération habilitées à l'IA pour la navigation autonome, les drones, la surveillance et la robotique.
La solution exploite les Open-Q SoMs de Lantronix, alimentés par les processeurs Qualcomm Dragonwing™ QRB5165 et QCS8250, offrant des capacités avancées en IA comprenant:
- Fonctionnalités ISP de Prism : super résolution, atténuation des turbulences et amélioration des images
- Prism AI : détection d'objets en temps réel et suivi de cibles à grande vitesse
- Support pour les modules de caméra duale visible-thermique Hadron™ et Boson® de Teledyne FLIR
L'Open-Q 5165 SoM ultra-compact (50mm x 29mm) dispose du moteur IA Qualcomm® de 5ème génération, capable de réaliser jusqu'à 15 trillions d'opérations par seconde, soit deux fois les performances de la génération précédente.
Lantronix (NASDAQ: LTRX) hat einen Durchbruch in der KI-gestützten Kameratechnologie bekannt gegeben, indem es seine Open-Q™ System-on-Module (SoM)-Lösungen mit den Wärmebildkameramodulen von Teledyne FLIR und der eingebetteten Software Prism™ integriert hat. Diese Integration ermöglicht die Entwicklung von KI-fähigen Kameralösungen der nächsten Generation für autonome Navigation, Drohnen, Überwachung und Robotik.
Die Lösung nutzt die Open-Q SoMs von Lantronix, die von den Qualcomm Dragonwing™ QRB5165 und QCS8250 Prozessoren betrieben werden und fortschrittliche KI-Funktionen bieten, darunter:
- Prism ISP-Funktionen: Superauflösung, Turbulenzminderung und Bildverbesserung
- Prism AI: Echtzeit-Objekterkennung und Hochgeschwindigkeits-Zielverfolgung
- Unterstützung für die duale Sicht-thermische Kameramodule Hadron™ und Boson® von Teledyne FLIR
Das ultra-kompakte Open-Q 5165 SoM (50mm x 29mm) verfügt über die 5. Generation des Qualcomm® AI Engines und kann bis zu 15 Billionen Operationen pro Sekunde ausführen - das Doppelte der Leistung der vorherigen Generation.
- New AI camera technology breakthrough with FLIR integration
- Advanced AI processing capabilities with 15 trillion operations/second
- Strategic partnership with industry leader Teledyne FLIR
- None.
Advanced Open-Q SoMs Accelerate AI-Powered Visual Navigation in Drones, Robotics and Surveillance Applications
IRVINE, Calif., March 04, 2025 (GLOBE NEWSWIRE) -- Lantronix Inc. (NASDAQ: LTRX), a global leader of compute and connectivity for IoT solutions enabling AI Edge Intelligence, today announced a breakthrough in AI-powered camera technology with the seamless integration of its high-performance Open-Q™ System-on-Module (SoM) solutions including hardware and software with Teledyne FLIR’s thermal infrared (IR) camera modules and Prism™ embedded software. This integration accelerates the development of next-generation AI-enabled camera solutions in autonomous navigation/drones, surveillance and robotics.
Powered by Lantronix’s cutting-edge Open-Q SoMs, based on the Qualcomm Dragonwing™ QRB5165 and QCS8250 processor platforms, this solution delivers unparalleled processing capabilities for AI-driven situational awareness, advanced computational imaging and real-time decision-making. Lantronix’s seamless technology integration provides a competitive edge, enabling developers to create high-performance, size-, weight- and power-optimized (SWaP) AI camera solutions that push the boundaries of innovation.
Lantronix at the Forefront of AI Edge Intelligence
“With Lantronix’s Open-Q SoMs, developers can confidently build AI-powered solutions knowing they are backed by industry-leading embedded compute technologies that deliver longevity, reliability and continuous innovation,” said Mathi Gurusamy, Chief Strategy Officer at Lantronix. “By integrating with Teledyne FLIR’s advanced thermal camera modules, Lantronix provides a turnkey embedded AI solution that maximizes performance while simplifying development and deployment,” he added.
Advanced AI and Thermal Processing
Lantronix’s integration of Teledyne FLIR Prism into the Qualcomm Dragonwing QRB5165 and QCS8250 platforms brings advanced thermal image signal processing (ISP) and AI capabilities to edge devices. Key features include:
- Prism ISP: Super resolution, turbulence mitigation, atmospheric obscurant correction, de-noising, image fusion, electronic stabilization, and local contrast enhancement.
- Prism AI: Real-time object detection, motion target indication, and high-speed target tracking at video frame rates.
Lantronix’s Open-Q SoMs fully support Teledyne FLIR Hadron™ dual visible-thermal and Boson® thermal camera modules, allowing for simultaneous color and infrared video capture across multiple MIPI-CSI camera interfaces. Key configurations include:
- Hadron Camera: Integrated with the Lantronix Open-Q 8250 SoM, featuring the Dragonwing QCS8250 processor running Android™.
- Boson Camera: Integrated with the Lantronix ultra-compact Open-Q 5165 SoM, leveraging the Dragonwing QRB5165 platform on Linux®.
Teledyne FLIR on the Lantronix Collaboration
“Our collaboration with Lantronix adds flexibility for integrators developing thermal-enabled AI-based platforms,” said Michael Walters, Vice President of Product Management at Teledyne FLIR OEM. “Our SWaP-optimized IR camera modules and ultra-low embedded software processing power simplify thermal management and extend battery life for autonomy applications.”
Lantronix Open-Q 5165: Optimized for AI and Edge Computing
Lantronix’s Open-Q 5165 is an ultra-compact (50mm x 29mm), production-ready, pre-certified SoM based on the powerful Dragonwing QRB5165 platform. Features include:
- Qualcomm Spectra™ ISP, Qualcomm® Adreno™ GPU, and Qualcomm® Hexagon™ DSP
- 5th generation Qualcomm® AI Engine, with twice the performance of the previous generation, with up to 15 trillion operations per second
- Wi-Fi 6 connectivity, advanced camera features and many high-speed interfaces
Lantronix will display its SoMs in the Qualcomm Technologies booth at Hall5/5-161 at Embedded World, March 13–15, 2025, in Nuremberg, Germany.
About Lantronix
Lantronix Inc. is a global leader of compute and connectivity IoT solutions that target high-growth markets, including Smart Cities, Enterprise and Transportation. Lantronix’s products and services empower companies to succeed in the growing IoT markets by delivering customizable solutions that enable AI Edge Intelligence. Lantronix’s advanced solutions include Intelligent Substations infrastructure, Infotainment systems and Video Surveillance, supplemented with advanced Out-of-Band Management (OOB) for Cloud and Edge Computing.
For more information, visit the Lantronix website.
Lantronix Media Contact:
Gail Kathryn Miller
Corporate Marketing &
Communications Manager
media@lantronix.com
Lantronix Analyst and Investor Contact:
investors@lantronix.com
©2025 Lantronix, Inc. All rights reserved. Lantronix is a registered trademark. Other trademarks and trade names are those of their respective owners.
Snapdragon and Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm, Qualcomm Dragonwing, Qualcomm Spectra, Snapdragon, Adreno and Hexagon are trademarks or registered trademarks of Qualcomm Incorporated.
FAQ
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