Lam Research and JSR Corporation/Inpria Corporation Enter Cross-Licensing, Collaboration Agreement to Advance Semiconductor Manufacturing
Lam Research (NASDAQ:LRCX) and JSR Corporation/Inpria have entered into a non-exclusive cross-licensing and collaboration agreement to advance semiconductor manufacturing technology. The partnership focuses on integrating JSR/Inpria's patterning resists and films with Lam's etch and dry resist deposition technologies, including Lam's Aether® dry resist technology.
The collaboration aims to accelerate innovation in several key areas: metal oxide resists, high NA EUV patterning for advanced nodes, and advanced films for next-generation patterning. Additionally, leveraging JSR's acquisition of Yamanaka Hutech Corporation, the companies will explore new precursor materials for advanced atomic layer deposition and etch solutions. As part of the agreement, both companies will dismiss all existing litigation claims in the Inpria v. Lam Research case.
Lam Research (NASDAQ:LRCX) e JSR Corporation/Inpria hanno siglato un accordo non esclusivo di cross-licensing e collaborazione per avanzare la tecnologia di produzione dei semiconduttori. La partnership si concentra sull'integrazione dei fotoresisti e dei film di patterning di JSR/Inpria con le tecnologie di incisione e di deposizione di residui secchi di Lam, inclusa la tecnologia Lam Aether® dry resist.
La collaborazione mira ad accelerare l'innovazione in diverse aree chiave: resisti a ossidi metallici, patterning EUV ad alta NA per nodi avanzati e film avanzati per la prossima generazione di patterning. Inoltre, sfruttando l'acquisizione da parte di JSR di Yamanaka Hutech Corporation, le aziende esploreranno nuovi materiali precursori per la deposizione atomica di strati avanzata e soluzioni di etching. Nell'ambito dell'accordo, entrambe le aziende rinunceranno a tutte le controversie legali esistenti nel caso Inpria contro Lam Research.
Lam Research (NASDAQ:LRCX) y JSR Corporation/Inpria han firmado un acuerdo de licencia cruzada no exclusiva y de colaboración para avanzar en la tecnología de manufactura de semiconductores. La alianza se centra en integrar los reveladores de patrón y películas de JSR/Inpria con las tecnologías de grabado y deposición de resistes secos de Lam, incluida la tecnología Aether® dry resist de Lam.
La colaboración tiene como objetivo acelerar la innovación en varias áreas clave: resist de óxidos metálicos, patrón EUV de alta NA para nodos avanzados y películas avanzadas para la próxima generación de patterning. Además, aprovechando la adquisición de JSR de Yamanaka Hutech Corporation, las compañías explorarán nuevos materiales precursores para deposición atómica de capas avanzadas y soluciones de grabado. Como parte del acuerdo, ambas compañías retirarán todas las reclamaciones de litigio existentes en el caso Inpria vs. Lam Research.
Lam Research (NASDAQ:LRCX)와 JSR Corporation/Inpria는 반도체 제조 기술을 발전시키기 위한 비독점적인 교차 라이선스 및 협력 계약을 체결했습니다. 파트너십은 JSR/Inpria의 패터닝 레지스트와 필름을 Lam의 식각 및 드라이 레지스트 증착 기술과 통합하는 데 중점을 두며, Lam의 Aether® 드라이 레지스트 기술도 포함됩니다.
협력은 고NA EUV 패터닝의 메탈 옥사이드 레지스트, 차세대 노드용 고급 패터닝 및 차세대 패터닝을 위한 고급 필름 등 여러 핵심 영역에서 혁신을 가속화하는 것을 목표로 합니다. 또한 JSR의 야마나카 휴테크 코퍼레이션 인수를 활용하여 고급 원자층 증착 및 에칭 솔루션을 위한 새로운 전구재료를 모색할 것입니다. 계약의 일부로 두 회사는 Inpria 대 Lam Research 사건에 대한 기존 소송 청구를 모두 포기합니다.
Lam Research (NASDAQ:LRCX) et JSR Corporation/Inpria ont signé un accord non exclusif de cross-licensing et de collaboration pour faire progresser la technologie de fabrication des semi-conducteurs. Le partenariat vise à intégrer les résists de motif et les films de JSR/Inpria avec les technologies de gravure et de dépôt de résists secs de Lam, y compris la technologie Aether® dry resist de Lam.
La collaboration vise à accélérer l'innovation dans plusieurs domaines clés: résists d'oxydes métalliques, motifage EUV à haute NA pour des nœuds avancés, et films avancés pour la prochaine génération de motifage. De plus, tirant parti de l'acquisition par JSR de Yamanaka Hutech Corporation, les entreprises exploreront de nouveaux matériaux précurseurs pour la dépositional atomique et des solutions d'attaque avancées. Dans le cadre de l'accord, les deux sociétés abandonnent toutes les revendications litigieuses existantes dans l'affaire Inpria contre Lam Research.
Lam Research (NASDAQ:LRCX) und JSR Corporation/Inpria haben eine nicht-exklusive Cross-Lizenzierungs- und Kooperationsvereinbarung getroffen, um die Technologie in der Halbleiterfertigung voranzutreiben. Die Partnerschaft konzentriert sich darauf, die Patterning-Resists und Filme von JSR/Inpria mit Lam's Ätz- und Trocken-Resist-Besetzungs- Technologien zu integrieren, einschließlich der Lam Aether® Dry Resist-Technologie.
Ziel der Zusammenarbeit ist es, Innovationen in mehreren Schlüsselbereichen zu beschleunigen: Metalloxid-Resists, hochNA EUV-Patterning für fortschrittliche Nodes und fortgeschrittene Filme für die nächste Generation des Patternings. Zusätzlich werden die Unternehmen, gestützt auf die Übernahme von Yamanaka Hutech Corporation durch JSR, neue Vorläufermaterialien für fortgeschrittene Atomschichtenvakblatt-Deposition und Ätzlösungen erforschen. Im Rahmen der Vereinbarung werden beide Unternehmen alle bestehenden Rechtsstreitigkeiten im Fall Inpria gegen Lam Research eingestellt.
Lam Research (NASDAQ:LRCX) وJSR Corporation/Inpria قد وقعا اتفاقية ترخيص متبادل غير حصري وتعاون لتعزيز تكنولوجيا تصنيع أشباه الموصلات. يركز الشريك على دمج مواد التشكيل والطبقات من JSR/Inpria مع تقنيات النحت والترسيب الجاف للمقاومات من Lam، بما في ذلك تقنية Lam Aether® Dry Resist.
يهدف التعاون إلى تسريع الابتكار في عدة مجالات رئيسية: مقاوِمات أكسيد معدني، تشكيل EUV عالي NA للنُّظم المتقدمة، وطبقات متقدمة للإصدار التالي من التشكيل. بالإضافة إلى ذلك، وباستغلال استحواذ JSR على شركة Yamanaka Hutech Corporation، ستستكشف الشركات مواد مسبقة جديدة لطبقة الترسيب الذرّي المتقدمة وحلول الإيْحَاء المتقدمة. كجزء من الاتفاق، ستتنازل الشركتان عن جميع دعاوى التقاضي القائمة في قضية Inpria ضد Lam Research.
Lam Research (NASDAQ:LRCX) 与 JSR Corporation/Inpria 已签署一项非排他性交叉许可与合作协议，以推进半导体制造技术。该伙伴关系聚焦于将 JSR/Inpria 的图案化光刻胶与薄膜，与 Lam 的蚀刻及干法光刻胶沉积技术相结合，包括 Lam 的 Aether® 干法光刻胶技术。
此次合作旨在在若干关键领域加速创新：金属氧化物光刻胶、高 NA EUV 高级节点图案化，以及用于下一代图案化的先进薄膜。此外，借助 JSR 收购 Yamanaka Hutech Corporation 的机会，双方将探索用于先进原子层沉积及蚀刻解决方案的新前体材料。根据协议，双方还将放弃 Inpria 对 Lam Research 案件中的所有现有诉讼请求。
- None.
- Non-exclusive nature of the agreement allows competitors to potentially form similar partnerships
Insights
Lam Research and JSR/Inpria partnership accelerates advanced chip manufacturing technology, particularly for AI/HPC applications while resolving legal disputes.
This cross-licensing and collaboration agreement between Lam Research and JSR/Inpria represents a significant technological alliance in the semiconductor manufacturing space. The partnership strategically combines Lam's expertise in deposition, etch, and EUV patterning technologies with JSR's innovative materials solutions, particularly metal oxide photoresists.
The collaboration targets critical bottlenecks in advanced semiconductor manufacturing, focusing on dry resist technology for extreme ultraviolet (EUV) lithography. Lam's Aether® technology reduces the complexity of creating intricate patterns required for AI and high-performance computing chips - precisely where the industry faces its greatest scaling challenges.
What makes this partnership particularly valuable is its focus on next-generation processes for sub-2nm nodes, including high numerical aperture (high NA) EUV patterning. This technology is crucial for continuing Moore's Law scaling as traditional lithography approaches physical limits. The companies will also explore new precursor materials for atomic layer deposition and etch solutions, essential for building increasingly complex 3D transistor architectures.
Additionally, the agreement resolves ongoing litigation between Lam and Inpria (now part of JSR), eliminating legal uncertainty and potentially accelerating commercialization timelines. This settlement suggests the companies recognized greater value in collaboration than continued legal battles over intellectual property.
For chipmakers developing advanced AI and high-performance computing solutions, this partnership could translate to faster access to manufacturing technologies needed to deliver more powerful, energy-efficient processors. The collaboration addresses both near-term manufacturing challenges and longer-term research needs for continuing semiconductor scaling in the AI era.
Companies to Focus on Patterning for Leading-Edge Chips, Including Dry Resist EUV Lithography and Next-Generation Materials
The agreement capitalizes on JSR group's innovative semiconductor materials, including metal oxide solutions, and Lam's deep capabilities in deposition, etch, and EUV patterning, including Aether®, Lam's groundbreaking dry resist equipment and process technology that reduces the cost and complexity of creating the intricate patterns required for chips for artificial intelligence (AI) and high-performance computing (HPC).
The companies will collaborate to integrate JSR/Inpria's patterning resists and films with Lam's etch and dry resist deposition technologies. Lam and JSR/Inpria will also work together to expand innovation in several areas to support chipmakers as they scale in the AI era, including research and development related to metal oxide resists, high NA EUV patterning for advanced nodes, and other advanced films for next-generation patterning. In addition, leveraging JSR's recent acquisition of Yamanaka Hutech Corporation, Lam and JSR plan to explore new precursor materials and processes for advanced atomic layer deposition and etch solutions.
"By richly complementing Lam's proven atomic layer deposition and etch capabilities with JSR's deep expertise in advanced patterning materials, this collaboration enables us to accelerate innovation at a time of rising semiconductor complexity," said Vahid Vahedi, chief technology and sustainability officer, Lam Research. "This includes driving new low-NA and high-NA EUV patterning materials and metal oxide resists and providing greater access to Aether dry resist technology."
"At JSR, we are committed to advancing cutting-edge materials to enable our customers' most demanding technology roadmaps," said Toru Kimura, senior officer, JSR Corporation. "By combining JSR and Inpria's materials expertise with Lam Research's strengths in deposition, etch, and dry resist technologies, we aim to accelerate solutions for EUV lithography – including high NA – and support the industry to scale efficiently for the new AI era."
Lam and Inpria have also agreed to dismiss all claims against each other in the litigation Inpria v. Lam Research (Case 1:22cv01359) in the District Court of
About Lam Research
Lam Research Corporation is a global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Lam's equipment and services allow customers to build smaller and better performing devices. In fact, today, nearly every advanced chip is built with Lam technology. We combine superior systems engineering, technology leadership, and a strong values-based culture, with an unwavering commitment to our customers. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in
About JSR Corporation
JSR Corporation is a global technology company developing cutting-edge materials. Our Electronic Materials business provides a wide range of semiconductor materials for advanced logic and memory, including photoresists and ancillaries, process materials such as CMP slurries, cleaning solutions, packaging materials, and precursors. JSR's Electronic Materials Division's group companies include Inpria Corporation, acquired in 2021 for EUV metal oxide resists, and Yamanaka Hutech, added in August 2024 for high-purity CVD/ALD precursors. JSR delivers high-quality materials with added functionality, driving innovation in the semiconductor market and enabling customer breakthroughs. Please visit www.jsr.co.jp.
Caution Regarding Forward-Looking Statements:
Statements made in this press release that are not of historical fact are forward-looking statements and are subject to the safe harbor provisions created by the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on Lam's and JSR's current expectations, their respective managements' beliefs, and certain assumptions made by Lam and JSR, all of which are subject to change. Forward-looking statements can often be identified by words such as "likely," "plan," "believe," "will," "may," "if," similar expressions, and variations or negatives of these words. Examples of such forward-looking statements include, but are not limited to, statements in this press release regarding (i) the collaboration between Lam and JSR, (ii) Lam's and JSR's expectations regarding the benefits of the cross-licensing and collaboration agreement, (iii) industry and trends and future technology requirements, (iv) the capabilities of Lam's and JSR's products and technology, and (v) the dismissal of litigation. There are a number of important factors that could cause actual results or events to differ materially from those indicated by such forward-looking statements, including: Lam and JSR may not receive the expected benefits of the cross-licensing and collaboration agreement; court approvals required for the dismissal of litigation may not be obtained, or are obtained subject to conditions that are not anticipated; business, economic, political and/or regulatory conditions in the industry and the overall economy may deteriorate or change; the actions of Lam's and JSR's customers and competitors may be inconsistent with Lam's and JSR's expectations; trade regulations, export controls, tariffs, trade disputes, and other geopolitical tensions may inhibit Lam's and JSR's ability to sell their products; as well as the other risks and uncertainties that are described in the documents filed or furnished by Lam with the Securities and Exchange Commission, including specifically the Risk Factors described in Lam's annual report on Form 10-K for the fiscal year ended June 29, 2025. These uncertainties and changes could materially affect the forward-looking statements and cause actual results to vary from expectations in a material way. Lam and JSR undertake no obligation to update the information or statements made in this press release.
*Editor's Note: This press release was distributed at 5 p.m. Pacific Time on September 15, 2025 / 9 a.m. Japan Standard Time on September 16, 2025
Lam Research Contacts:
Laura Bakken
Media Relations
Tel: +1 (510) 572-9021
e-mail: publicrelations@lamresearch.com
Ram Ganesh
Investor Relations
Tel: +1 +1 (510) 572-1615
e-mail: investor.relations@lamresearch.com
JSR Corporation Contacts:
Yuki Kawashima
Electronic Materials Business Strategy Dept.
Tel: +81-3-6218-3500
e-mail: litho_semi@jsr.co.jp
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SOURCE Lam Research Corporation; JSR Corporation
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