Welcome to our dedicated page for Intel news (Ticker: INTC), a resource for investors and traders seeking the latest updates and insights on Intel stock.
Intel Corporation (INTC), the global leader in semiconductor innovation, maintains this dedicated news hub for investors and technology professionals. Access official press releases, financial announcements, and strategic updates directly from the company driving computing advancements worldwide.
This comprehensive resource aggregates Intel's latest developments across key operational areas including processor innovations, manufacturing expansions, and strategic partnerships. Users will find verified information on quarterly earnings, product launches, and technology breakthroughs - all essential for understanding the company's market position.
The curated collection includes updates on data center solutions, AI chip development, foundry services expansion, and sustainability initiatives. Bookmark this page to monitor Intel's progress in advancing semiconductor technology while maintaining awareness of industry-shaping developments.
Mobileye (MBLY) reported Q3 2024 financial results with revenue of $486 million, marking an 8% year-over-year decrease primarily due to a 9% reduction in EyeQ volumes. The company maintained its full-year 2024 revenue guidance. Q3 GAAP EPS was $(3.35), impacted by a non-cash goodwill impairment loss of $2,613 million, while Adjusted EPS was $0.10. The company generated $196 million in operating cash flow for the first nine months of 2024. Despite near-term challenges, Mobileye continues to focus on strategic objectives, including maintaining ADAS market position outside China and deepening relationships with top customers through advanced product design wins.
Intel (INTC) and AMD have announced the formation of an x86 ecosystem advisory group to shape the future of computing architecture. The group aims to enhance compatibility, simplify software development, and identify architectural needs for innovative solutions. Key tech leaders including Broadcom, Dell, Google, HPE, HP Inc., Lenovo, Meta, Microsoft, Oracle, and Red Hat have joined as founding members.
The initiative seeks to expand the x86 ecosystem by enabling cross-platform compatibility and providing developers with a platform to create scalable solutions. The group will focus on unifying instruction sets and architectural interfaces to enhance compatibility and consistency across x86 product offerings. This collaboration is expected to benefit customers by accelerating the adoption of new features and simplifying architectural guidelines.
Mobileye Global Inc. (Nasdaq: MBLY) has announced the timing for its third quarter 2024 financial results release. The company will disclose its results on Thursday, October 31, 2024, before the market opens. Following the release, Mobileye will host a conference call at 8:00am ET (2:00pm IT) to discuss the results and provide a general business update.
The call will feature key company executives, including CEO Professor Amnon Shashua, CFO Moran Shemesh Rojansky, EVP of Business Development and Strategy Nimrod Nehushtan, and CCO Dan Galves. Investors and interested parties can access the conference call via a live webcast on Mobileye's investor relations website at https://ir.mobileye.com/. A replay of the webcast will be made available shortly after the event concludes.
Intel has announced it will report its third-quarter 2024 financial results on Thursday, October 31, 2024, immediately after the market closes. The company will host an earnings conference call at 2 p.m. PDT on the same day to discuss the results. Investors and interested parties can access a live public webcast of the earnings call on Intel's Investor Relations website at intc.com. The website will also provide associated materials and a webcast replay for those unable to attend the live call.
Intel has unveiled next-generation AI solutions with the launch of Xeon 6 and Gaudi 3. The Xeon 6 with Performance-cores (P-cores) doubles the performance for AI and HPC workloads, while Gaudi 3 AI accelerators offer up to 20% more throughput and 2x price/performance vs H100 for inference of LLaMa 2 70B.
Key features of Xeon 6 include increased core count, double the memory bandwidth, and AI acceleration capabilities in every core. Gaudi 3 boasts 64 Tensor processor cores, 8 matrix multiplication engines, 128GB of HBM2e memory, and 24 200Gb Ethernet ports.
Intel is collaborating with IBM to deploy Gaudi 3 as a service on IBM Cloud, aiming to lower TCO and enhance performance. The company is also partnering with OEMs like Dell Technologies and Supermicro to develop co-engineered AI systems.
Flapmax and Intel have announced the launch of the Quantum AI Challenge, an initiative aimed at fostering innovation among Historically Black Colleges and Universities (HBCUs). The challenge invites students, faculty, and researchers to solve real-world problems using quantum computing and AI technologies. Applications open on September 20, 2024.
Participants will gain access to cutting-edge AI hardware, tools, and mentorship from global experts. The challenge focuses on defining and solving complex optimization problems in industries like healthcare, energy, material science, and supply chain. Selected teams will receive Intel AI PCs to run Python-based quantum simulations enhanced with AI.
The initiative builds on Flapmax's collaboration with Intel to accelerate AI innovation in underserved populations. It aims to empower HBCU students to lead in AI and quantum computing, addressing global challenges and developing practical applications across key industries.
Remark Holdings (OTCQX: MARK) announced the successful optimization of its Smart Safety Platform (SSP) for Intel Architecture. The SSP, an AI-powered solution for businesses, offers video analytics, real-time alerts, and scalable integration. The optimization, leveraging OpenVINO, enhances performance on Intel's hardware, including the 4th Gen Xeon scalable processor with Flex 140 GPU.
This optimization results in faster processing times, reduced latency, and increased throughput for AI workloads. The collaboration between Remark AI and Intel, as part of the Intel Partner Alliance, aims to provide efficient and versatile AI solutions across various industries and deployment scenarios.
Intel (INTC) and Amazon Web Services (AWS) have announced a multi-year, multi-billion-dollar collaboration to produce custom chip designs. Intel will manufacture an AI fabric chip on Intel 18A and a custom Xeon 6 chip on Intel 3 for AWS. This expansion of their longstanding partnership aims to accelerate U.S.-based chip manufacturing and create a vibrant AI ecosystem in Ohio.
The collaboration underscores both companies' commitment to domestic semiconductor production. Intel reaffirms its plans for leading-edge manufacturing in New Albany, while AWS plans to invest $7.8 billion to expand its data center operations in Central Ohio. This builds on AWS's existing $10.3 billion investment in Ohio since 2015.
The partnership is expected to drive innovation, support business growth, and contribute to a sustainable domestic AI supply chain. Both companies will explore potential for further designs on Intel's advanced process nodes, including those to be produced in Intel's Ohio facilities.
Intel has been awarded up to $3 billion in direct funding under the CHIPS and Science Act for the Secure Enclave program. This initiative aims to expand trusted manufacturing of leading-edge semiconductors for the U.S. government, building on previous collaborations with the Department of Defense (DoD). As the only American company designing and manufacturing leading-edge logic chips, Intel will help secure the domestic chip supply chain and enhance U.S. technological resilience.
The award is separate from Intel's proposed funding agreement in March 2023 for semiconductor facility construction. Intel Foundry is advancing its Intel 18A technology, set for production in 2025. The company has made significant progress in DoD projects like SHIP and RAMP-C, delivering multi-chip package prototypes and onboarding defense industrial base customers including Boeing, Northrop Grumman, and Microsoft.
Mobileye (MBLY) has decided to end internal development of next-generation FMCW lidar for autonomous and highly automated driving systems. This decision is based on advancements in EyeQ6-based computer vision perception, improved imaging radar performance, and cost reductions in third-party time-of-flight lidar units. The company emphasizes that this change does not impact any customer product programs or general product development.
The lidar R&D unit will be wound down by the end of 2024, affecting about 100 employees. Operating expenses for this unit are expected to total approximately $60 million in 2024. While not materially impacting 2024 results, this action will reduce future lidar development spending. Mobileye continues to prioritize imaging radar development, which is meeting performance specifications and is expected to enter production next year.
