Tokyo Electron and IBM Renew Collaboration for Advanced Semiconductor Technology
IBM and Tokyo Electron (TEL) have announced a new 5-year collaboration agreement focused on advancing semiconductor and chiplet technology for generative AI applications. This renewal extends their two-decade partnership in semiconductor research and development.
The collaboration will leverage IBM's semiconductor process integration expertise and TEL's leading-edge equipment to explore smaller nodes and chiplet architectures, aiming to meet future AI performance and energy efficiency requirements. The partnership has previously achieved significant breakthroughs, including developing a laser debonding process for 300 mm silicon chip wafers in 3D chip stacking technology.
The research will continue at the Albany NanoTech Complex, recently selected as America's first National Semiconductor Technology Center (NSTC EUV Accelerator), where both companies are active members of the semiconductor research ecosystem.
IBM e Tokyo Electron (TEL) hanno annunciato un nuovo accordo di collaborazione della durata di 5 anni, incentrato sullo sviluppo della tecnologia dei semiconduttori e dei chiplet per applicazioni di intelligenza artificiale generativa. Questo rinnovo estende la loro partnership ventennale nella ricerca e nello sviluppo dei semiconduttori.
La collaborazione sfrutterà l'esperienza di IBM nell'integrazione dei processi dei semiconduttori e l'equipaggiamento all'avanguardia di TEL per esplorare nodi più piccoli e architetture di chiplet, con l'obiettivo di soddisfare i futuri requisiti di prestazioni ed efficienza energetica dell'IA. In precedenza, la partnership ha raggiunto importanti traguardi, tra cui lo sviluppo di un processo di debonding laser per wafer di silicio da 300 mm nella tecnologia di impilamento di chip 3D.
La ricerca continuerà presso il Albany NanoTech Complex, recentemente selezionato come il primo National Semiconductor Technology Center (NSTC EUV Accelerator) degli Stati Uniti, dove entrambe le aziende sono membri attivi dell'ecosistema della ricerca sui semiconduttori.
IBM y Tokyo Electron (TEL) han anunciado un nuevo acuerdo de colaboración de 5 años centrado en el avance de la tecnología de semiconductores y chiplets para aplicaciones de inteligencia artificial generativa. Esta renovación extiende su asociación de dos décadas en investigación y desarrollo de semiconductores.
La colaboración aprovechará la experiencia de IBM en la integración de procesos de semiconductores y el equipo de vanguardia de TEL para explorar nodos más pequeños y arquitecturas de chiplets, con el objetivo de satisfacer los futuros requisitos de rendimiento y eficiencia energética de la IA. La asociación ha logrado anteriormente importantes avances, incluyendo el desarrollo de un proceso de despegado láser para obleas de silicio de 300 mm en tecnología de apilamiento de chips 3D.
La investigación continuará en el Albany NanoTech Complex, recientemente seleccionado como el primer Centro Nacional de Tecnología de Semiconductores (NSTC EUV Accelerator) de América, donde ambas empresas son miembros activos del ecosistema de investigación de semiconductores.
IBM과 Tokyo Electron (TEL)은 생성적 AI 애플리케이션을 위한 반도체 및 칩렛 기술을 발전시키기 위한 새로운 5년 협력 계약을 발표했습니다. 이 갱신은 반도체 연구 및 개발에서의 20년 파트너십을 연장하는 것입니다.
이번 협력은 IBM의 반도체 공정 통합 전문성과 TEL의 최첨단 장비를 활용하여 더 작은 노드와 칩렛 아키텍처를 탐색하고, 향후 AI 성능 및 에너지 효율 요구 사항을 충족하는 것을 목표로 합니다. 이 파트너십은 3D 칩 스태킹 기술에서 300mm 실리콘 칩 웨이퍼를 위한 레이저 디본딩 공정 개발을 포함하여 중요한 돌파구를 달성한 바 있습니다.
연구는 최근 미국 최초의 국가 반도체 기술 센터(NSTC EUV Accelerator)로 선정된 Albany NanoTech Complex에서 계속될 예정이며, 두 회사는 반도체 연구 생태계의 적극적인 구성원입니다.
IBM et Tokyo Electron (TEL) ont annoncé un nouvel accord de collaboration de 5 ans axé sur l'avancement de la technologie des semi-conducteurs et des chiplets pour les applications d'intelligence artificielle générative. Ce renouvellement prolonge leur partenariat de deux décennies dans la recherche et le développement des semi-conducteurs.
La collaboration tirera parti de l'expertise d'IBM en intégration de processus de semi-conducteurs et de l'équipement de pointe de TEL pour explorer des nœuds plus petits et des architectures de chiplets, visant à répondre aux futures exigences de performance et d'efficacité énergétique de l'IA. Le partenariat a déjà réalisé des percées significatives, notamment le développement d'un processus de décollement laser pour des wafers de silicium de 300 mm dans la technologie d'empilement de puces 3D.
La recherche se poursuivra au Albany NanoTech Complex, récemment sélectionné comme le premier Centre National de Technologie des Semi-conducteurs (NSTC EUV Accelerator) d'Amérique, où les deux entreprises sont des membres actifs de l'écosystème de recherche sur les semi-conducteurs.
IBM und Tokyo Electron (TEL) haben eine neue 5-jährige Partnerschaftsvereinbarung angekündigt, die sich auf die Weiterentwicklung der Halbleiter- und Chiplet-Technologie für generative KI-Anwendungen konzentriert. Diese Erneuerung verlängert ihre zwanzigjährige Partnerschaft in der Forschung und Entwicklung von Halbleitern.
Die Zusammenarbeit wird die Expertise von IBM in der Integration von Halbleiterprozessen und die Spitzentechnologie von TEL nutzen, um kleinere Knoten und Chiplet-Architekturen zu erforschen, mit dem Ziel, zukünftige Anforderungen an Leistung und Energieeffizienz von KI zu erfüllen. Die Partnerschaft hat zuvor bedeutende Durchbrüche erzielt, einschließlich der Entwicklung eines Laser-Entbonding-Prozesses für 300-mm-Silizium-Chip-Wafer in der 3D-Chip-Stapelungstechnologie.
Die Forschung wird im Albany NanoTech Complex fortgesetzt, der kürzlich als erstes National Semiconductor Technology Center (NSTC EUV Accelerator) in Amerika ausgewählt wurde, wo beide Unternehmen aktive Mitglieder des Halbleiterforschungsökosystems sind.
- Extended strategic partnership with industry leader Tokyo Electron for 5 years
- Access to advanced semiconductor research facilities at Albany NanoTech Complex
- Focus on next-generation AI chip technology development
- Proven track record of successful collaboration with previous technological breakthroughs
- None.
Insights
IBM and Tokyo Electron's renewed 5-year collaboration represents a strategic positioning move in the increasingly competitive AI semiconductor landscape. The partnership's focus on advanced node technology and chiplet architectures directly addresses two critical challenges in AI chip development: achieving both the performance scaling and energy efficiency required for next-generation AI workloads.
The mention of High NA EUV technology is particularly significant, as this represents the bleeding edge of semiconductor lithography - essential for continuing Moore's Law progression. With only a handful of companies globally having access to such advanced fabrication capabilities, this collaboration maintains IBM's seat at the table of semiconductor innovation leadership.
The extended collaboration leverages complementary strengths: IBM's expertise in process integration paired with TEL's equipment manufacturing prowess. Their continued presence at the Albany NanoTech Complex - now America's first National Semiconductor Technology Center - provides access to unique infrastructure that few competitors can match.
While this partnership doesn't guarantee commercial dominance, it ensures IBM remains in the semiconductor innovation race at a time when custom AI accelerator chips are becoming increasingly strategic assets. The focus on chiplet architectures aligns with the industry's shift toward more specialized, modular chip designs that can be optimized for specific AI workloads while managing manufacturing complexity and costs.
This partnership renewal demonstrates IBM's long-term commitment to vertical integration in the AI value chain. By investing in fundamental semiconductor research rather than just focusing on software or services, IBM is positioning itself to capture value across multiple layers of the AI technology stack.
The timing is strategically sound - as generative AI drives unprecedented demand for computational power, the semiconductor industry faces both tremendous opportunity and severe technical challenges. The limitations of traditional scaling approaches are becoming increasingly apparent, making innovations in chiplet architecture and advanced packaging potentially game-changing.
What's particularly valuable about this collaboration is the 20+ year foundation it builds upon. Semiconductor innovation requires institutional knowledge and continuity that can't be quickly replicated by competitors. The previous breakthrough in laser debonding for 3D chip stacking showcases the partnership's ability to deliver tangible innovations.
The collaboration's embedding within the Albany NanoTech Complex ecosystem creates network effects and knowledge spillovers that benefit both companies. The facility's designation as America's first National Semiconductor Technology Center likely brings additional resources and potential governmental support to their research efforts.
While direct financial impact may take years to materialize, this partnership maintains IBM's optionality in a field that's becoming increasingly strategic for every major technology company. The ability to influence and potentially lead in next-generation chip architecture could create significant competitive advantages as AI workloads continue evolving.
New 5-year agreement will focus on semiconductor and chiplet innovation for the age of generative AI
ALBANY, N.Y. and
This agreement builds on a more than two-decade partnership between IBM and TEL for joint research and development. Previously, the two companies have achieved several breakthroughs, including the development of a new laser debonding process for producing 300 mm silicon chip wafers for 3D chip stacking technology.
Now, bringing together IBM's expertise in semiconductor process integration and TEL's leading-edge equipment, they will explore technology for smaller nodes and chiplet architectures to achieve the performance and energy efficiency requirements for the future of generative AI.
"The work IBM and TEL have done together over the last 20 years has helped to push the semiconductor technology innovation to provide many generations of chip performance and energy efficiency to the semiconductor industry," said Mukesh Khare, GM of IBM Semiconductors and VP of Hybrid Cloud, IBM. "We are thrilled to be continuing our work together at this critical time to accelerate chip innovations that can fuel the era of generative AI."
"IBM and Tokyo Electron have built a strong relationship of trust and innovation through years of joint development. We are excited to continue to build on our long-standing partnership with IBM for another five years. This renewed agreement underscores our mutual commitment to advancing semiconductor technologies, including patterning processes with High NA EUV." said Toshiki Kawai, Representative Director, President & CEO Tokyo Electron Limited. "Our collaboration at the Albany NanoTech Complex has been instrumental in driving innovation and we look forward to continuing this journey together."
IBM and TEL are members of the Albany NanoTech Complex, the world's leading ecosystem for semiconductor research, owned and operated by NY CREATES. For years, IBM, TEL, and others have worked together to build the most advanced public-private semiconductor research facility to accelerate chip innovation. As a result, last year, the site was selected as America's first National Semiconductor Technology Center, the NSTC EUV Accelerator. As part of this new agreement, IBM and TEL researchers will continue to work together in Albany utilizing its unique ecosystem and R&D capabilities.
About TEL
As a leading global company of innovative semiconductor production equipment, Tokyo Electron (TEL) engages in development, manufacturing, and sales in a wide range of product fields. All of TEL's semiconductor production equipment product lines maintain high market shares in their respective global segments. TEL provides outstanding products and services to customers through a global network in the
About IBM
IBM is a leading provider of global hybrid cloud, artificial intelligence, and consulting expertise. We help clients in over 175 countries harness insights from their data, optimize business processes, reduce costs and gain a competitive advantage in their industries. More than 4,000 government and corporate entities in critical infrastructure areas such as financial services, telecommunications and healthcare rely on the IBM hybrid cloud platform and Red Hat OpenShift to achieve their digital transformations quickly, efficiently and securely. IBM's breakthrough innovations in artificial intelligence, quantum computing, industry-specific cloud solutions and consulting offer open and flexible options to our clients. All of this is backed by IBM's long-standing commitment to trust, transparency, accountability, inclusion and service. Visit www.ibm.com for more information.
CONTACT: Bethany McCarthy, bethany@ibm.com
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SOURCE IBM
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