Ciena Brings Data Center Connectivity Innovations to OFC 2025
Ciena (NYSE: CIEN) is set to showcase groundbreaking data center connectivity innovations at OFC 2025 in San Francisco from March 30 to April 3. The company will demonstrate industry-first technologies addressing the anticipated sixfold increase in DCI bandwidth demand over the next five years.
Key innovations include:
- 1.6T Coherent-Lite featuring 224G SerDes, offering enhanced robustness and higher loss budget while maintaining power efficiency
- 448Gb/s PAM4 technology implemented in low-power 3nm CMOS, paving the way for 3.2T interconnects
Ciena's technological achievements include being first to market with 3nm coherent DSP in communications, 200GBaud analog-digital converters, 224G SerDes in coherent ASIC, high-bandwidth 100GHz transmitter/receiver, and 448Gb/s PAM4 transmission. These innovations aim to support growing cloud and AI traffic demands in data centers.
Ciena (NYSE: CIEN) è pronta a presentare innovazioni rivoluzionarie nella connettività dei data center all'OFC 2025 a San Francisco dal 30 marzo al 3 aprile. L'azienda dimostrerà tecnologie all'avanguardia che affrontano l'anticipato aumento di sei volte della domanda di larghezza di banda DCI nei prossimi cinque anni.
Le innovazioni principali includono:
- 1.6T Coherent-Lite con 224G SerDes, che offre maggiore robustezza e un budget di perdita più elevato mantenendo l'efficienza energetica
- 448Gb/s PAM4 implementato in CMOS a bassa potenza da 3nm, aprendo la strada a interconnessioni da 3.2T
I risultati tecnologici di Ciena includono il primato nel mercato con DSP coerente da 3nm nelle comunicazioni, convertitori analogico-digitale da 200GBaud, 224G SerDes in ASIC coerenti, trasmettitore/ricevitore ad alta larghezza di banda da 100GHz e trasmissione PAM4 a 448Gb/s. Queste innovazioni mirano a supportare la crescente domanda di traffico cloud e AI nei data center.
Ciena (NYSE: CIEN) se prepara para mostrar innovaciones revolucionarias en la conectividad de centros de datos en el OFC 2025 en San Francisco del 30 de marzo al 3 de abril. La empresa demostrará tecnologías pioneras que abordan el anticipado aumento de seis veces en la demanda de ancho de banda de DCI en los próximos cinco años.
Las innovaciones clave incluyen:
- 1.6T Coherent-Lite con 224G SerDes, que ofrece mayor robustez y un presupuesto de pérdida más alto manteniendo la eficiencia energética
- 448Gb/s PAM4 implementado en CMOS de bajo consumo de 3nm, allanando el camino para interconexiones de 3.2T
Los logros tecnológicos de Ciena incluyen ser los primeros en el mercado con DSP coherente de 3nm en comunicaciones, convertidores analógico-digital de 200GBaud, 224G SerDes en ASIC coherentes, transmisores/receptores de alta capacidad de 100GHz y transmisión PAM4 de 448Gb/s. Estas innovaciones tienen como objetivo apoyar la creciente demanda de tráfico en la nube y de IA en los centros de datos.
Ciena (NYSE: CIEN)는 3월 30일부터 4월 3일까지 샌프란시스코에서 열리는 OFC 2025에서 데이터 센터 연결 혁신을 선보일 예정입니다. 이 회사는 향후 5년간 DCI 대역폭 수요가 6배 증가할 것으로 예상되는 상황에 대응하는 업계 최초의 기술을 시연할 것입니다.
주요 혁신 사항은 다음과 같습니다:
- 1.6T Coherent-Lite는 224G SerDes를 특징으로 하며, 전력 효율성을 유지하면서 더 높은 손실 예산과 향상된 견고성을 제공합니다.
- 448Gb/s PAM4 기술은 저전력 3nm CMOS에 구현되어 3.2T 상호 연결을 위한 길을 열고 있습니다.
Ciena의 기술적 성과에는 통신 분야에서 3nm 일관성 DSP를 시장에 처음 출시한 것, 200GBaud 아날로그-디지털 변환기, 일관성 ASIC의 224G SerDes, 고대역폭 100GHz 송신기/수신기 및 448Gb/s PAM4 전송이 포함됩니다. 이러한 혁신은 데이터 센터에서 증가하는 클라우드 및 AI 트래픽 수요를 지원하는 것을 목표로 하고 있습니다.
Ciena (NYSE: CIEN) est prêt à présenter des innovations révolutionnaires en matière de connectivité des centres de données lors de l'OFC 2025 à San Francisco du 30 mars au 3 avril. L'entreprise démontrera des technologies de pointe répondant à l'augmentation prévue par six de la demande de bande passante DCI au cours des cinq prochaines années.
Les innovations clés comprennent :
- 1.6T Coherent-Lite avec 224G SerDes, offrant une robustesse accrue et un budget de perte plus élevé tout en maintenant l'efficacité énergétique
- 448Gb/s PAM4 technologie mise en œuvre dans un CMOS basse consommation de 3nm, ouvrant la voie à des interconnexions de 3.2T
Les réalisations technologiques de Ciena incluent le premier lancement sur le marché de DSP cohérents de 3nm dans les communications, des convertisseurs analogique-numérique de 200GBaud, 224G SerDes dans des ASIC cohérents, des émetteurs/récepteurs haute bande passante de 100GHz et une transmission PAM4 de 448Gb/s. Ces innovations visent à soutenir la demande croissante de trafic cloud et IA dans les centres de données.
Ciena (NYSE: CIEN) wird bahnbrechende Innovationen zur Datenzentrumskonnektivität auf der OFC 2025 in San Francisco vom 30. März bis 3. April präsentieren. Das Unternehmen wird branchenweit erste Technologien demonstrieren, die auf den erwarteten sechsmaligen Anstieg der DCI-Bandbreitennachfrage in den nächsten fünf Jahren reagieren.
Wichtige Innovationen umfassen:
- 1.6T Coherent-Lite mit 224G SerDes, das verbesserte Robustheit und ein höheres Verlustbudget bei gleichzeitiger Energieeffizienz bietet
- 448Gb/s PAM4 Technologie, die in einem energieeffizienten 3nm CMOS implementiert ist und den Weg für 3.2T Interconnects ebnet
Die technologischen Errungenschaften von Ciena umfassen die Markteinführung des ersten 3nm kohärenten DSP in der Kommunikation, 200GBaud Analog-Digital-Wandler, 224G SerDes in kohärenten ASICs, hochbandbreitige 100GHz Sender/Empfänger und 448Gb/s PAM4 Übertragung. Diese Innovationen zielen darauf ab, die wachsenden Anforderungen an Cloud- und KI-Traffic in Datenzentren zu unterstützen.
- First-to-market position in multiple critical optical technologies
- Strategic positioning to address growing cloud and AI infrastructure demands
- Development of power-efficient solutions for data center scaling
- None.
New technologies including 448Gb/s PAM4 and Coherent-Lite support emergent applications in and around the data center
A recent Ciena global survey found that data center experts anticipate at least a sixfold increase in DCI bandwidth demand over the next five years, requiring new levels of scalability. To address this challenge, Ciena, the established leader in high-speed optical innovation, is bringing its expertise to high-performance interconnects—the pluggables and components required to support growth in cloud and AI traffic.
Ciena will break new ground with the following live demonstrations of industry-first technologies:
- 1.6T Coherent-Lite: Featuring Ciena’s 224G SerDes, 1.6T Coherent-Lite provides robustness and a higher loss budget at a comparable power consumption to IMDD, supporting the scale and flexibility needed for data center and campus applications.
- Paving the way to 3.2T interconnects: Only Ciena has 448Gb/s PAM4 working in silicon today, powered by Ciena’s ultra-high-bandwidth DAC (digital-to-analog) and ADC (analog-to-digital) converters implemented in low-power 3nm CMOS. Electrical PAM4 transmission will be shown in OIF booth #5745, and optical PAM4 IMDD transmission will be demonstrated in Ciena’s booth.
“Faster data rates inside cloud and AI-powered data centers require transformative technology,” noted Andrew Schmitt, Directing Analyst at Cignal AI. “With Ciena's latest innovations, such as 1.6T Coherent-Lite and 448Gb/s PAM4, the company is demonstrating how its technical leadership in coherent optical technology can be directly applied to solve these emerging challenges within the data center.”
“Ciena understands the challenges that hyperscalers, cloud, and AI providers are facing in and around the data center. Through our unmatched coherent technology expertise and vertical integration know-how, we are uniquely positioned to bring to market the innovative solutions required for next-generation data center applications and interconnection,” said Brodie Gage, Senior Vice President, Global Products & Supply Chain, Ciena.
Ciena’s Optical Leadership
Ciena has a proven track record of being first to market with optical technology innovations:
- First 3nm coherent DSP in communications
- First 200GBaud analog-digital and digital-analog converters
- First 224G SerDes in a coherent ASIC
- First high-bandwidth 100GHz transmitter and receiver
- First 448Gb/s PAM4 transmission
OIF Unites Interoperability and Innovation at OFC 2025: Driving Industry Progress in Performance, Efficiency and Capacity for Future-Oriented Data Centers
OIF continues to lead the charge in advancing interoperability, with 35 member companies at OFC 2025 showcasing innovative solutions that redefine performance, efficiency and capacity. The work being demonstrated—including 800ZR, 400ZR, OpenZR+, Multi-span optics, EEI & Co-Packaging, Common Electrical I/O (CEI) CEI-448G, CEI-224G & CEI-112G and CMIS—is collectively enabling the industry to move forward toward future-oriented data centers and laying the foundation for hyperscalers to scale AI networks seamlessly. Visit OIF at booth #5745 to experience these groundbreaking solutions live. For more information, visit: https://www.oiforum.com/meetings-events/oif-ofc-2025/.
About Ciena
Ciena (NYSE: CIEN) is a global leader in networking systems, services, and software. We build the most adaptive networks in the industry, enabling customers to anticipate and meet ever-increasing digital demands. For three-plus decades, Ciena has brought our humanity to our relentless pursuit of innovation. Prioritizing collaborative relationships with our customers, partners, and communities, we create flexible, open, and sustainable networks that better serve all users—today and into the future. For updates on Ciena, follow us on LinkedIn, Twitter, the Ciena Insights blog, or visit www.ciena.com.
Note to Ciena Investors
You are encouraged to review the Investors section of our website, where we routinely post press releases, SEC filings, recent news, financial results, and other announcements. From time to time, we exclusively post material information to this website along with other disclosure channels that we use. This press release contains certain forward-looking statements that are based on our current expectations, forecasts, information and assumptions. These statements involve inherent risks and uncertainties. Actual results or outcomes may differ materially from those stated or implied, because of risks and uncertainties, including those detailed in our most recent annual and quarterly reports filed with the SEC. Forward-looking statements include statements regarding our expectations, beliefs, intentions or strategies and can be identified by words such as "anticipate," "believe," "could," "estimate," "expect," "intend," "may," "should," "will," and "would" or similar words. Ciena assumes no obligation to update the information included in this press release, whether as a result of new information, future events or otherwise.
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Press Contact:
Colleen Seery
Ciena Corporation
+1 (724) 419-5753
pr@ciena.com
Investor Contact:
Gregg Lampf
Ciena Corporation
+1 (410) 694-5700
ir@ciena.com
Source: Ciena
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