Cadence Accelerates Hyperscale SoC Design with Next-Generation 112G Extended Long-Reach SerDes IP on TSMC’s N4P Process
Cadence Design Systems has launched its new 112G Extended Long-Reach (112G-ELR) SerDes IP on TSMC’s N4P process, aimed at advancing hyperscale ASICs, AI/ML accelerators, and 5G infrastructure. This innovative technology supports an insertion loss of 43dB and a bit error rate of 10-7, delivering significant performance margins and robust system capabilities for challenging channels. The IP, compliant with IEEE and OIF standards, excels in power, performance, and area efficiency, catering to a variety of reach applications from 1G to 112G. Cadence’s collaboration with TSMC promises to enhance customer design solutions, effectively addressing industry challenges.
The 112G-ELR SerDes PHY is currently available for customer engagements, reinforcing Cadence’s leadership in high-performance connectivity.
- Launch of 112G-ELR SerDes IP enhances Cadence's offerings in high-speed data transfer.
- Performance margin exceeding standard long-reach specifications boosts competitiveness.
- Collaboration with TSMC enhances technology advancement for customers in hyperscale and AI/ML sectors.
- Support for a wide range of applications (ELR, LR, MR, VSR) broadens market reach.
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Highlights:
- DSP-based, flexible-rate SerDes IP is optimized for PPA for next-generation cloud networking, AI/ML, and 5G wireless applications
- New architecture delivers exceptional ELR performance and enables system robustness for lossy and reflective channels
- The IP supports ELR, LR, MR and VSR applications and provides a flexible power-saving capability over different channels
The Cadence® 112G-ELR SerDes PHY IP on TSMC’s N4P process, a performance-focused enhancement of the TSMC 5nm technology platform, incorporates industry-leading digital signal processor (DSP)-based SerDes architecture with maximum likelihood sequence detection (MLSD) and reflection cancellation technology. The SerDes PHY IP is compliant with IEEE and OIF Long-Reach (LR) standards while providing extra performance margin for ELR applications. The optimized power, performance and area are ideal for different user scenarios, including high port-density applications. In addition to ELR and LR channels, the IP also supports Medium Reach (MR) and Very Short Reach (VSR) applications with a flexible power-saving capability over different channels. The supported data rates range from 1G to 112G with NRZ and PAM4 signaling, enabling reliable high-speed data transfer over backplane, direct-attached cable (DAC), chip-to-chip and chip-to-module channels.
“Cadence’s latest 112G-ELR IP on TSMC’s N4P process will benefit our mutual customers with significant performance improvement in silicon, helping them address design challenges with the continuous technology advancement from Cadence’s leading IP solutions and TSMC’s advanced process technologies,” said Dan Kochpatcharin, head of the
“Our next-generation 112G-ELR SerDes on TSMC N4P solution offers exceptional performance margin and system robustness for customer applications,” said
Cadence currently has the 112G-ELR on TSMC N4P test chip silicon in-house, demonstrating optimal performance. The Cadence 112G-ELR SerDes solution on TSMC’s N4P process is available for broad customer engagements now. Cadence has built a large customer base for its PAM4 SerDes by enabling different variations. The 112G-ELR SerDes PHY IP on TSMC’s N4P process is part of the broader Cadence IP portfolio and supports the Cadence Intelligent System Design™ strategy, which enables advanced-node SoC design excellence. For more information on the 112G-ELR SerDes, please visit www.cadence.com/go/112gelr.
About Cadence
Cadence is a pivotal leader in electronic systems design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world’s most innovative companies, delivering extraordinary products from chips to boards to complete systems for the most dynamic market applications, including hyperscale computing, 5G communications, automotive, mobile, aerospace, consumer, industrial and healthcare. For nine years in a row,
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