Ansys Thermal and Multiphysics Solutions Certified for Intel 18A Process and 3D-IC Designs
Ansys has achieved certification for its thermal and multiphysics signoff tools with Intel's 18A process technology, marking a significant advancement in semiconductor design capabilities. The certification covers key products including RedHawk-SC, Totem, and HFSS-IC Pro, specifically designed for AI chips, GPUs, and HPC applications.
The collaboration extends to Intel Foundry's EMIB technology for multi-die 3D-IC systems, with Ansys providing comprehensive analysis tools for thermal reliability and electromagnetic integrity. The company is also progressing certification for Intel 18A-P and collaborating on Intel 14A-E process development.
Notably, Ansys has joined the Intel Foundry Chiplet Alliance to help develop a secure ecosystem for interoperable chiplets. This partnership aims to enhance semiconductor system reliability through precise simulation tools, supporting the industry's shift toward advanced multi-die assembly and efficient chip design.
Ansys ha ottenuto la certificazione per i suoi strumenti di verifica termica e multifisica con la tecnologia di processo Intel 18A, segnando un importante progresso nelle capacità di progettazione dei semiconduttori. La certificazione riguarda prodotti chiave come RedHawk-SC, Totem e HFSS-IC Pro, specificamente progettati per chip AI, GPU e applicazioni HPC.
La collaborazione si estende alla tecnologia EMIB di Intel Foundry per sistemi 3D-IC multi-die, con Ansys che fornisce strumenti di analisi completi per l'affidabilità termica e l'integrità elettromagnetica. L'azienda sta inoltre avanzando nella certificazione per Intel 18A-P e collabora allo sviluppo del processo Intel 14A-E.
In particolare, Ansys è entrata a far parte della Intel Foundry Chiplet Alliance per contribuire a sviluppare un ecosistema sicuro per chiplet interoperabili. Questa partnership mira a migliorare l'affidabilità dei sistemi semiconduttori attraverso strumenti di simulazione precisi, supportando la transizione dell'industria verso assemblaggi multi-die avanzati e progettazioni di chip più efficienti.
Ansys ha logrado la certificación para sus herramientas de validación térmica y multifísica con la tecnología de proceso Intel 18A, marcando un avance significativo en las capacidades de diseño de semiconductores. La certificación cubre productos clave como RedHawk-SC, Totem y HFSS-IC Pro, diseñados específicamente para chips de IA, GPUs y aplicaciones HPC.
La colaboración se extiende a la tecnología EMIB de Intel Foundry para sistemas 3D-IC multi-die, con Ansys proporcionando herramientas de análisis integrales para la fiabilidad térmica y la integridad electromagnética. La compañía también está avanzando en la certificación para Intel 18A-P y colaborando en el desarrollo del proceso Intel 14A-E.
De manera destacada, Ansys se ha unido a la Intel Foundry Chiplet Alliance para ayudar a desarrollar un ecosistema seguro para chiplets interoperables. Esta asociación busca mejorar la fiabilidad de los sistemas de semiconductores mediante herramientas de simulación precisas, apoyando la transición de la industria hacia el ensamblaje multi-die avanzado y el diseño eficiente de chips.
Ansys는 인텔 18A 공정 기술에 대한 열 및 다중 물리 검증 도구 인증을 획득하며 반도체 설계 역량에 중요한 진전을 이루었습니다. 이 인증은 AI 칩, GPU 및 HPC 애플리케이션용으로 특별히 설계된 RedHawk-SC, Totem, HFSS-IC Pro 등 주요 제품을 포함합니다.
이번 협력은 멀티 다이 3D-IC 시스템을 위한 인텔 파운드리의 EMIB 기술까지 확장되며, Ansys는 열 신뢰성 및 전자기 무결성을 위한 종합 분석 도구를 제공합니다. 또한 인텔 18A-P 인증 진행 중이며 인텔 14A-E 공정 개발에도 협력하고 있습니다.
특히 Ansys는 인텔 파운드리 칩렛 얼라이언스에 합류하여 상호 운용 가능한 칩렛을 위한 안전한 생태계 개발을 지원합니다. 이 파트너십은 정밀한 시뮬레이션 도구를 통해 반도체 시스템 신뢰성을 향상시키고, 업계가 첨단 멀티 다이 조립 및 효율적인 칩 설계로 전환하는 데 기여하는 것을 목표로 합니다.
Ansys a obtenu la certification de ses outils de validation thermique et multiphysique avec la technologie de procédé Intel 18A, marquant une avancée significative dans les capacités de conception des semi-conducteurs. La certification couvre des produits clés tels que RedHawk-SC, Totem et HFSS-IC Pro, spécialement conçus pour les puces IA, GPU et applications HPC.
La collaboration s'étend à la technologie EMIB d'Intel Foundry pour les systèmes 3D-IC multi-die, Ansys fournissant des outils d'analyse complets pour la fiabilité thermique et l'intégrité électromagnétique. La société progresse également dans la certification pour Intel 18A-P et collabore au développement du procédé Intel 14A-E.
Notamment, Ansys a rejoint la Intel Foundry Chiplet Alliance afin de contribuer au développement d'un écosystème sécurisé pour des chiplets interopérables. Ce partenariat vise à améliorer la fiabilité des systèmes semi-conducteurs grâce à des outils de simulation précis, soutenant la transition de l'industrie vers un assemblage multi-die avancé et une conception de puces efficace.
Ansys hat die Zertifizierung für seine thermischen und multiphysikalischen Abnahmewerkzeuge mit der Intel 18A-Prozesstechnologie erhalten und damit einen bedeutenden Fortschritt in den Fähigkeiten der Halbleiterentwicklung erzielt. Die Zertifizierung umfasst wichtige Produkte wie RedHawk-SC, Totem und HFSS-IC Pro, die speziell für KI-Chips, GPUs und HPC-Anwendungen entwickelt wurden.
Die Zusammenarbeit erstreckt sich auf die EMIB-Technologie von Intel Foundry für Multi-Die-3D-IC-Systeme, wobei Ansys umfassende Analysetools für thermische Zuverlässigkeit und elektromagnetische Integrität bereitstellt. Das Unternehmen arbeitet zudem an der Zertifizierung für Intel 18A-P und kooperiert bei der Entwicklung des Intel 14A-E-Prozesses.
Besonders hervorzuheben ist, dass Ansys der Intel Foundry Chiplet Alliance beigetreten ist, um ein sicheres Ökosystem für interoperable Chiplets zu entwickeln. Diese Partnerschaft zielt darauf ab, die Zuverlässigkeit von Halbleitersystemen durch präzise Simulationswerkzeuge zu verbessern und die Industrie beim Übergang zu fortschrittlicher Multi-Die-Montage und effizientem Chipdesign zu unterstützen.
- Certification of Ansys tools for Intel's advanced 18A process technology strengthens market position in AI and HPC segments
- Strategic partnership with Intel Foundry through Chiplet Alliance expands market opportunities
- Early involvement in Intel's next-gen 14A-E process development indicates strong competitive position
- Tools certified for cutting-edge 3D-IC designs and EMIB technology, capturing growing market segment
- Expansion into EMIB-T technology with TSV capabilities demonstrates continued innovation leadership
- Certification for Intel 18A-P still in progress, not yet complete
- Heavy dependence on Intel's ecosystem and technology roadmap
Signoff certification includes power integrity, multi-die thermal reliability, and electromagnetic modeling for AI and HPC applications
/ Key Highlights
- Ansys RedHawk-SC™ and Ansys Totem™ power integrity signoff platforms and Ansys HFSS-IC™ Pro electromagnetic simulation software are certified for Intel's 18A transistor process technology
- Ansys and Intel Foundry deliver a thermal and multiphysics signoff flow for Intel Foundry's Embedded Multi-Die Interconnect Bridge (EMIB) technology, including Ansys RedHawk-SC Electrothermal™ signoff platform, and Ansys SIwave™ package electromagnetics simulation software and HFSS-IC Pro for signal integrity signoff and extending EMIB-T
- Ansys joins the Intel Foundry Chiplet Alliance to enable an interoperable, secure ecosystem for designing multi-die heterogenous systems
- Ansys is progressing certification for Intel 18A-P and collaborating on enablement for Intel 14A-E
Recognized as industry-leading solutions, RedHawk-SC and Totem deliver speed, accuracy, and capacity to analyze the power integrity and reliability of Intel 18A RibbonFET Gate-all-around (GAA) transistors with PowerVia backside power delivery. For scalable electromagnetic analysis, Ansys is introducing HFSS-IC Pro, a new addition to the HFSS-IC product family. HFSS-IC Pro is certified for modeling on-chip electromagnetic integrity in radio frequency chips, WiFi, 5G/6G, and other telecommunication applications made with the Intel 18A process node.
EMIB facilitates 3D-IC for high-performance microprocessors, heterogeneous integrated systems, and more, enhancing the performance and integration of advanced computing systems by seamlessly connecting diverse chip types. The flow includes thermal reliability analysis with RedHawk-SC Electrothermal. Ansys and Intel Foundry are also extending the collaboration to cover next-generation EMIB-T technology that will add through-silicon vias (TSVs) to EMIB. The EMIB-T flow is expanded to include HFSS-IC Pro and SIwave for signal integrity analysis and RedHawk-SC and Totem for power integrity analysis.
The qualification process for RedHawk-SC, Totem, and HFSS-IC Pro is currently in progress for the Intel 18A high-performance process node (Intel 18A-P). Customers have the option to request the latest Intel PDK to begin early design work and IP development. These solutions are part of the Intel 14A-E process definition and Design Technology Co-Optimization (DTCO).
In addition, Ansys is joining the Intel Foundry Chiplet Alliance, part of the Intel Foundry Accelerator Alliance, to help develop a secure ecosystem for designing and manufacturing interoperable chiplets.
"Our approach to multi-die assembly is changing the way the industry thinks about stacking chips and designing for efficiency," said Suk Lee, vice president & general manager, Ecosystem Technology Office at Intel Foundry. "Ansys tools are critical in this process because they help our mutual customers validate their designs with extreme accuracy — saving them costs that may not otherwise be recoverable. Furthermore, we are looking forward to Ansys' participation in the Intel Foundry Chiplet Alliance, which is critical to advancing chiplet technology."
"Ansys' suite of multiphysics simulation tools instill confidence in our customers, ensuring their semiconductor systems achieve the highest levels of thermal, signal, power, and mechanical integrity," said John Lee, vice president and general manager of the electronics, semiconductor, and optics business unit at Ansys. "While customers may adopt various methods for chip design, the need for precise tools and solutions to ensure reliability remains constant — this is where Ansys excels. By joining the Intel Foundry Chiplet Alliance and deepening our collaboration with Intel Foundry, Ansys is delivering on its commitment to providing open-source and interoperable technology in pursuit of engineering excellence."
/ About Ansys
Our Mission: Powering Innovation that Drives Human Advancement™
When visionary companies need to know how their world-changing ideas will perform, they close the gap between design and reality with Ansys simulation. For more than 50 years, Ansys software has enabled innovators across industries to push boundaries by using the predictive power of simulation. From sustainable transportation to advanced semiconductors, from satellite systems to life-saving medical devices, the next great leaps in human advancement will be powered by Ansys.
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