Ansys Strengthens Collaboration with TSMC on Advanced Node Processes Certification and 3D-IC Multiphysics Design Solutions
Ansys (NASDAQ: ANSS) has strengthened its partnership with TSMC, announcing enhanced AI-assisted workflows and new certifications for semiconductor solutions. The collaboration focuses on 3D integrated circuit (3D-IC) design optimization and accelerating market readiness for AI and high-performance computing applications.
Key developments include certification of RedHawk-SC, RedHawk-SC Electrothermal, and Totem for TSMC's A16™ process, and HFSS-IC Pro certification for TSMC's 5nm and 3nm processes. The partnership introduces AI-assisted photonic design optimization using Ansys optiSLang® and enhanced RF migration flow capabilities.
The collaboration also establishes a joint multiphysics signoff analysis flow enablement platform with Synopsys, integrating various analysis tools for extraction, timing, power, EM/IR, and thermal analysis, aimed at accelerating the convergence of large 3D-IC designs.
Ansys (NASDAQ: ANSS) ha rafforzato la sua collaborazione con TSMC, annunciando flussi di lavoro potenziati dall'IA e nuove certificazioni per soluzioni nel settore dei semiconduttori. La partnership si concentra sull'ottimizzazione del design di circuiti integrati 3D (3D-IC) e sull'accelerazione della preparazione al mercato per applicazioni di intelligenza artificiale e calcolo ad alte prestazioni.
Tra le novità principali, la certificazione di RedHawk-SC, RedHawk-SC Electrothermal e Totem per il processo A16™ di TSMC, e la certificazione di HFSS-IC Pro per i processi a 5 nm e 3 nm di TSMC. La collaborazione introduce inoltre l'ottimizzazione del design fotonico assistita dall'IA tramite Ansys optiSLang® e funzionalità avanzate per il flusso di migrazione RF.
La partnership prevede anche la creazione di una piattaforma congiunta per l'abilitazione del flusso di analisi multiphysica di signoff con Synopsys, integrando diversi strumenti di analisi per estrazione, timing, consumo energetico, EM/IR e analisi termica, con l'obiettivo di accelerare la convergenza di grandi progetti 3D-IC.
Ansys (NASDAQ: ANSS) ha fortalecido su asociación con TSMC, anunciando flujos de trabajo mejorados asistidos por IA y nuevas certificaciones para soluciones de semiconductores. La colaboración se centra en la optimización del diseño de circuitos integrados 3D (3D-IC) y en acelerar la preparación para el mercado de aplicaciones de inteligencia artificial y computación de alto rendimiento.
Los desarrollos clave incluyen la certificación de RedHawk-SC, RedHawk-SC Electrothermal y Totem para el proceso A16™ de TSMC, y la certificación de HFSS-IC Pro para los procesos de 5 nm y 3 nm de TSMC. La asociación introduce además la optimización del diseño fotónico asistida por IA utilizando Ansys optiSLang® y capacidades mejoradas para el flujo de migración RF.
La colaboración también establece una plataforma conjunta para habilitar el flujo de análisis multiphysics de signoff con Synopsys, integrando varias herramientas de análisis para extracción, temporización, consumo de energía, EM/IR y análisis térmico, con el objetivo de acelerar la convergencia de grandes diseños 3D-IC.
Ansys (NASDAQ: ANSS)는 TSMC와의 파트너십을 강화하여 AI 지원 워크플로우와 반도체 솔루션에 대한 새로운 인증을 발표했습니다. 이번 협력은 3D 집적 회로(3D-IC) 설계 최적화와 AI 및 고성능 컴퓨팅 애플리케이션의 시장 출시 가속화에 중점을 두고 있습니다.
주요 발전 사항으로는 TSMC의 A16™ 공정에 대한 RedHawk-SC, RedHawk-SC Electrothermal, Totem 인증과 5nm 및 3nm 공정에 대한 HFSS-IC Pro 인증이 포함됩니다. 또한 Ansys optiSLang®을 활용한 AI 지원 포토닉 설계 최적화와 향상된 RF 마이그레이션 플로우 기능이 도입되었습니다.
이번 협력은 Synopsys와 함께 다양한 추출, 타이밍, 전력, EM/IR, 열 분석 도구를 통합한 공동 다중물리(signoff) 분석 플로우 플랫폼을 구축하여 대형 3D-IC 설계의 수렴 가속화를 목표로 합니다.
Ansys (NASDAQ : ANSS) a renforcé son partenariat avec TSMC en annonçant des workflows améliorés assistés par IA et de nouvelles certifications pour les solutions semi-conducteurs. Cette collaboration se concentre sur l'optimisation de la conception des circuits intégrés 3D (3D-IC) et l'accélération de la mise sur le marché pour les applications d'IA et de calcul haute performance.
Les développements clés incluent la certification de RedHawk-SC, RedHawk-SC Electrothermal et Totem pour le procédé A16™ de TSMC, ainsi que la certification de HFSS-IC Pro pour les procédés 5 nm et 3 nm de TSMC. Le partenariat introduit également l'optimisation de la conception photonique assistée par IA via Ansys optiSLang® et des capacités améliorées pour le flux de migration RF.
La collaboration établit aussi une plateforme conjointe d'activation du flux d'analyse multiphysique de validation avec Synopsys, intégrant divers outils d'analyse pour l'extraction, la temporisation, la consommation d'énergie, EM/IR et l'analyse thermique, visant à accélérer la convergence des grands designs 3D-IC.
Ansys (NASDAQ: ANSS) hat seine Partnerschaft mit TSMC gestärkt und verbesserte KI-unterstützte Workflows sowie neue Zertifizierungen für Halbleiterlösungen angekündigt. Die Zusammenarbeit konzentriert sich auf die Optimierung des Designs von 3D-integrierten Schaltkreisen (3D-IC) und die Beschleunigung der Marktreife für KI- und Hochleistungsrechenanwendungen.
Wesentliche Entwicklungen umfassen die Zertifizierung von RedHawk-SC, RedHawk-SC Electrothermal und Totem für den A16™-Prozess von TSMC sowie die Zertifizierung von HFSS-IC Pro für die 5-nm- und 3-nm-Prozesse von TSMC. Die Partnerschaft führt zudem eine KI-gestützte Optimierung des photonischen Designs mit Ansys optiSLang® ein und erweitert die RF-Migrations-Flow-Fähigkeiten.
Darüber hinaus wird eine gemeinsame Multiphysik-Signoff-Analyseplattform mit Synopsys etabliert, die verschiedene Analysetools für Extraktion, Timing, Energieverbrauch, EM/IR und Thermalanalyse integriert, um die Konvergenz großer 3D-IC-Designs zu beschleunigen.
- New certifications for advanced node processes (A16, 5nm, and 3nm) expand market opportunities
- AI-assisted workflows implementation enhances design optimization capabilities
- Strategic partnership with TSMC strengthens market position in semiconductor solutions
- Integration with Synopsys creates comprehensive multiphysics analysis platform
- None.
Insights
Ansys secures strategic TSMC certifications for advanced node processes, strengthening its position in high-growth AI and HPC chip markets.
The certification of Ansys' core tools—RedHawk-SC, RedHawk-SC Electrothermal, and Totem—for TSMC's A16 process with Super Power Rail directly addresses one of the most critical challenges in advanced semiconductor design: power integrity. As chipmakers push toward more complex architectures for AI accelerators and HPC applications, power delivery becomes a fundamental bottleneck.
The introduction of HFSS-IC Pro with RaptorX technology and its certification for TSMC's 5nm and 3nm processes is technically significant. At these nodes, electromagnetic effects become dominant factors in performance. Having certified EM analysis tools gives designers confidence that simulations accurately predict silicon behavior, reducing costly design iterations.
The enhanced thermal analysis flow addresses another critical challenge in advanced node designs. With increasing power densities at smaller geometries, thermal management has become a performance limiter. More precise thermal analysis enables optimizations that directly impact reliability and performance.
The AI-assisted workflows for RF design migration and photonic design optimization target two emerging areas: advanced RF for communications and photonics for next-generation computing interconnects. The joint AI-assisted RF migration flow with Synopsys automates traditionally manual processes in transitioning designs between nodes—a significant efficiency gain for analog/RF designers working on advanced wireless applications.
The multiphysics signoff analysis flow represents the industry's shift toward more integrated design approaches, where electrical, thermal, and mechanical effects must be analyzed simultaneously rather than sequentially—critical for successfully implementing complex 3D-IC designs.
Ansys' expanded TSMC partnership strengthens its competitive positioning in simulation software for the semiconductor industry's highest-growth segments.
This partnership expansion strategically positions Ansys within the semiconductor design ecosystem. TSMC's certification process is notably rigorous, providing Ansys with a competitive advantage in the electronic design automation (EDA) market. The breadth of certifications across multiple advanced processes—A16, 5nm, and 3nm—demonstrates Ansys' technical leadership in simulation capabilities for cutting-edge semiconductor manufacturing.
The focus on AI and HPC applications aligns Ansys with the semiconductor market's fastest-growing segments. The current surge in AI chip development creates substantial demand for advanced simulation tools that can handle the complex multiphysics challenges these designs present. Similarly, the partnership's emphasis on 3D-IC design solutions positions Ansys favorably as chiplet-based designs and advanced packaging become increasingly critical for performance scaling.
The collaboration on AI-assisted workflows shows Ansys' innovation in design automation. These workflows address complex challenges in RF migration and photonic integrated circuits—two specialized areas seeing increased investment industry-wide. The joint development with Synopsys on certain workflows highlights the collaborative nature of the EDA ecosystem.
For context, certification announcements typically translate to increased tool adoption as semiconductor companies begin designs on new process nodes. TSMC's dominant position in advanced process manufacturing means their certified partners have access to a substantial customer base developing next-generation chips. The mention of ongoing collaboration for TSMC's future A14 technology demonstrates long-term strategic alignment between the companies in addressing the semiconductor industry's most challenging design problems.
AI-based workflows aid advanced node designs, ensuring design and system technology co-optimization for HPC and AI applications
/ Key Highlights
- TSMC and Ansys advance AI-assisted workflows to support design optimization during technology node migration and photonic design optimization with TSMC's Compact Universal Photonic Engine (COUPE) platform
- Ansys RedHawk-SC™ and Ansys Totem™ power integrity and electromigration reliability platforms and Ansys RedHawk-SC-Electrothermal™ multiphysics platform are certified for TSMC's latest A16™ process
- Ansys HFSS-IC Pro system-on-chip (SoC) electromagnetic solution is certified for TSMC's 5nm and 3nm process
A16 EM/IR and thermal certification
RedHawk-SC, RedHawk-SC Electrothermal, and Totem are certified for TSMC's advanced silicon process A16™ with Super Power Rail, a best-in-class backside power delivery solution for analog/block-level and SoC-level electromigration (EM) and voltage drop (IR) analysis.
To ensure reliable thermal management for the TSMC A16 process, Ansys and TSMC developed a more precise thermal analysis flow. The enhanced method leverages TSMC's thermal specifications, providing accurate temperature calculations, and enhancing performance in advanced applications. In addition, Ansys and TSMC continue collaborating on design enablement for TSMC's next-generation A14 technology.
Advanced 5nm and 3nm on-chip electromagnetic certification
To support the increasing demand for scalable electromagnetic analysis, Ansys is introducing a new HFSS-IC product family. HFSS-IC Pro, with RaptorX™ technology embedded, is certified by TSMC for its advanced 5nm and 3nm processes, meeting the rigorous accuracy requirements necessary for designing next-generation semiconductor products. The certification reinforces Ansys' role in advancing semiconductor design technologies and empowering customers to meet the demands of complex applications including AI, HPC, 5G/6G communications, and automotive electronics.
AI-assisted photonic design optimization
Ansys and TSMC continue to refine COUPE design solutions by leveraging AI capabilities in Ansys optiSLang® process integration and design optimization software. These solutions enable PIC optimization with Ansys Lumerical INTERCONNECT™ and empower optical coupling system optimization and robustness analysis with Ansys Zemax OpticStudio®.
AI-assisted optimal RF design migration
TSMC, Ansys, and Synopsys have enhanced a joint AI-assisted RF migration flow, combining Ansys HFSS-IC Pro AI technology with Synopsys Custom Compiler™ and ASO.ai™ solutions, accelerating the transition from one silicon process to another for analog and RF ICs. The flow automates device placement, routing optimization, and EM-aware tuning, while preserving design intent and performance. As the semiconductor industry moves toward more advanced nodes, RF IC migration presents significant challenges in maintaining performance, yield, and design productivity. Leveraging AI to predict and mitigate EM challenges ensures signal integrity, power efficiency, and manufacturability in advanced RF applications.
Multiphysics signoff analysis flow enablement
Ansys RedHawk-SC, RedHawk-SC Electrothermal, and Synopsys 3DIC Compiler™ are integrated into TSMC, Ansys, and Synopsys' joint multiphysics signoff analysis flow enablement platform for extraction, timing, power, EM/IR, and thermal analysis. These analyses are linked through a shared data flow, supporting thermal-aware timing analysis and voltage-aware timing analysis. This multiphysics approach can help customers accelerate the convergence of large 3D-IC designs.
"Ansys' continued collaboration with Synopsys and TSMC drives innovation in 3D-IC design and improves chip reliability for the most demanding applications," said John Lee, vice president and general manager of the semiconductor, electronics, and optics business unit at Ansys. "As chip sizes shrink and energy efficiency demands grow, Ansys continues to advance its multiphysics solutions across electromagnetics, thermal, structural integrity, and more to give our customers confidence that their design will meet specifications. The latest certifications from TSMC highlight our commitment to delivering the most advanced solutions to customers' most challenging problems."
"AI-driven solutions significantly boost productivity in designing 3D-IC components and offer seamless automation for essential tasks," said Lipen Yuan, senior director of advanced technology business development at TSMC. "Our continued collaboration with Open Innovation Platform® (OIP) partners like Ansys and Synopsys ensures optimal technical solutions that fully leverage the performance and power efficiency advantages of our cutting-edge technologies, advancing customer innovation across AI, HPC, mobile, automotive, and beyond."
/ About Ansys
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When visionary companies need to know how their world-changing ideas will perform, they close the gap between design and reality with Ansys simulation. For more than 50 years, Ansys software has enabled innovators across industries to push boundaries by using the predictive power of simulation. From sustainable transportation to advanced semiconductors, from satellite systems to life-saving medical devices, the next great leaps in human advancement will be powered by Ansys.
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