Applied Materials Announces a Strategic Investment in BE Semiconductor Industries
Applied Materials (AMAT) has acquired 9% of BE Semiconductor Industries (Besi) common stock through market-based transactions, strengthening their ongoing collaboration in hybrid bonding technology. The companies have been working together since 2020 and recently extended their agreement to develop the industry's first fully integrated equipment solution for die-based hybrid bonding.
The strategic investment highlights AMAT's commitment to advancing hybrid bonding technology, which is becoming important for advanced semiconductor packaging. This technology enables direct copper-to-copper bonds between chips, resulting in improved performance, reduced power consumption, and lower costs - particularly important for advanced logic and memory chips used in AI applications.
The co-developed integrated hybrid bonding system combines Applied's front-end wafer and chip processing expertise with Besi's die placement, interconnect, and assembly solutions. AMAT stated it won't seek board representation or purchase additional Besi shares.
Applied Materials (AMAT) ha acquisito il 9% delle azioni ordinarie di BE Semiconductor Industries (Besi) tramite operazioni di mercato, rafforzando la loro collaborazione continua nella tecnologia di bonding ibrido. Le aziende collaborano dal 2020 e hanno recentemente esteso l'accordo per sviluppare la prima soluzione integrata del settore per il bonding ibrido basato su die.
L'investimento strategico sottolinea l'impegno di AMAT nel potenziare la tecnologia di bonding ibrido, sempre più rilevante per il packaging avanzato dei semiconduttori. Questa tecnologia consente legami diretti rame-su-rame tra chip, migliorando le prestazioni, riducendo i consumi energetici e abbattendo i costi, aspetti fondamentali soprattutto per chip logici e di memoria avanzati impiegati nelle applicazioni AI.
Il sistema integrato di bonding ibrido co-sviluppato unisce l'esperienza di Applied nel processamento front-end di wafer e chip con le soluzioni di posizionamento die, interconnessione e assemblaggio di Besi. AMAT ha dichiarato che non cercherà rappresentanza nel consiglio né acquisterà ulteriori azioni di Besi.
Applied Materials (AMAT) ha adquirido el 9% de las acciones ordinarias de BE Semiconductor Industries (Besi) mediante transacciones de mercado, fortaleciendo su colaboración continua en tecnología de unión híbrida. Las compañías trabajan juntas desde 2020 y recientemente ampliaron su acuerdo para desarrollar la primera solución integrada de la industria para la unión híbrida basada en dados.
La inversión estratégica destaca el compromiso de AMAT con el avance de la tecnología de unión híbrida, que se está volviendo crucial para el empaquetado avanzado de semiconductores. Esta tecnología permite enlaces directos cobre a cobre entre chips, mejorando el rendimiento, reduciendo el consumo energético y disminuyendo costos, aspectos especialmente importantes para chips lógicos y de memoria avanzados usados en aplicaciones de IA.
El sistema integrado de unión híbrida co-desarrollado combina la experiencia de Applied en el procesamiento frontal de obleas y chips con las soluciones de colocación de dados, interconexión y ensamblaje de Besi. AMAT declaró que no buscará representación en la junta ni comprará más acciones de Besi.
Applied Materials (AMAT)는 시장 거래를 통해 BE Semiconductor Industries (Besi)의 보통주 9%를 인수하며 하이브리드 본딩 기술에 대한 지속적인 협력을 강화했습니다. 두 회사는 2020년부터 협력해 왔으며, 최근에는 다이 기반 하이브리드 본딩을 위한 업계 최초의 완전 통합 장비 솔루션 개발을 위한 계약을 연장했습니다.
이번 전략적 투자는 첨단 반도체 패키징에 점점 중요해지는 하이브리드 본딩 기술을 발전시키려는 AMAT의 의지를 보여줍니다. 이 기술은 칩 간 구리 대 구리 직접 결합을 가능하게 하여 성능 향상, 전력 소비 감소 및 비용 절감을 이루며, 특히 AI 응용 분야에서 사용되는 첨단 로직 및 메모리 칩에 중요합니다.
공동 개발된 통합 하이브리드 본딩 시스템은 Applied의 웨이퍼 및 칩 전단 처리 전문성과 Besi의 다이 배치, 인터커넥트 및 조립 솔루션을 결합합니다. AMAT는 이사회 진출이나 추가 Besi 주식 매입 계획이 없다고 밝혔습니다.
Applied Materials (AMAT) a acquis 9 % des actions ordinaires de BE Semiconductor Industries (Besi) via des transactions sur le marché, renforçant ainsi leur collaboration continue dans la technologie de liaison hybride. Les entreprises collaborent depuis 2020 et ont récemment étendu leur accord pour développer la première solution entièrement intégrée de l'industrie pour la liaison hybride basée sur les die.
L'investissement stratégique souligne l'engagement d'AMAT à faire progresser la technologie de liaison hybride, qui devient essentielle pour l'emballage avancé des semi-conducteurs. Cette technologie permet des liaisons directes cuivre-cuivre entre puces, améliorant les performances, réduisant la consommation d'énergie et les coûts, ce qui est particulièrement important pour les puces logiques et mémoires avancées utilisées dans les applications d'IA.
Le système intégré de liaison hybride co-développé combine l'expertise d'Applied dans le traitement en amont des wafers et des puces avec les solutions de placement de die, d'interconnexion et d'assemblage de Besi. AMAT a déclaré qu'il ne cherchera pas de représentation au conseil d'administration ni n'achètera d'actions supplémentaires de Besi.
Applied Materials (AMAT) hat 9 % der Stammaktien von BE Semiconductor Industries (Besi) durch marktbasierte Transaktionen erworben und damit ihre laufende Zusammenarbeit im Bereich der Hybridbindungstechnologie gestärkt. Die Unternehmen arbeiten seit 2020 zusammen und haben kürzlich ihre Vereinbarung zur Entwicklung der ersten vollständig integrierten Geräte-Lösung der Branche für die die-basierte Hybridbindung verlängert.
Die strategische Investition unterstreicht AMATs Engagement zur Weiterentwicklung der Hybridbindungstechnologie, die für fortschrittliche Halbleitergehäuse immer wichtiger wird. Diese Technologie ermöglicht direkte Kupfer-zu-Kupfer-Verbindungen zwischen Chips, was zu verbesserter Leistung, reduziertem Energieverbrauch und niedrigeren Kosten führt – besonders wichtig für fortschrittliche Logik- und Speicherchips, die in KI-Anwendungen eingesetzt werden.
Das gemeinsam entwickelte integrierte Hybridbindungssystem vereint Applieds Fachwissen in der Front-End-Wafer- und Chipverarbeitung mit Besis Lösungen für Die-Platzierung, Interkonnektivität und Montage. AMAT erklärte, dass es keine Vorstandsvertretung anstrebt und keine weiteren Besi-Aktien kaufen wird.
- Strategic 9% stake acquisition in Besi strengthens existing technological partnership
- Successfully developed integrated hybrid bonding system ready for high-volume manufacturing
- Technology enables improved chip performance and reduced power consumption
- No regulatory approvals required for the investment
- None.
Insights
Applied Materials' 9% stake in Besi represents a significant strategic move in the advanced packaging space, particularly for hybrid bonding technology - a critical capability as the industry shifts toward chiplet architectures and heterogeneous integration.
Hybrid bonding creates direct copper-to-copper connections between chips, enabling higher interconnect density and shorter wiring between chiplets. This translates to three key advantages: enhanced performance, reduced power consumption, and improved cost economics - the semiconductor industry's eternal trifecta of goals.
This investment deepens a four-year collaboration that has already produced an integrated hybrid bonding system ready for high-volume manufacturing. What's particularly notable is how this combines Applied's front-end wafer processing expertise with Besi's back-end assembly capabilities, creating a comprehensive solution across what were traditionally separate manufacturing domains.
The specific emphasis on AI applications is telling. As AI accelerators and high-performance computing drive semiconductor development, packaging technologies that can efficiently connect multiple chiplets have become as important as traditional node scaling. By strengthening its position in hybrid bonding, Applied is targeting a high-growth segment of the semiconductor equipment market that will be essential for next-generation AI chips.
While the market-based transaction doesn't require regulatory approval and Applied has explicitly stated it doesn't seek board representation, this stake establishes a deeper relationship than mere partnership and potentially positions Applied for future opportunities in the advanced packaging landscape.
Purchased 9 percent of outstanding shares to build upon four years of successful collaboration on hybrid bonding technology for advanced packaging
SANTA CLARA, Calif., April 14, 2025 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced it has purchased 9 percent of the outstanding shares of the common stock of BE Semiconductor Industries N.V. (Besi), a leading manufacturer of assembly equipment for the semiconductor industry.
Applied and Besi have been successfully collaborating since 2020, and recently extended their agreement, to co-develop the industry’s first fully integrated equipment solution for die-based hybrid bonding. Hybrid bonding is becoming a critical technology for advanced packaging of semiconductors as designers and manufacturers race to develop more energy-efficient chips. Hybrid bonding connects chips using direct copper-to-copper bonds, which increases density and shortens the lengths of interconnect wiring between chiplets, resulting in improved overall performance, power consumption and cost.
“We view this as a strategic, long-term investment that demonstrates Applied Materials’ commitment to co-developing the industry’s most capable hybrid bonding solution, a technology that is becoming increasingly important to the advanced logic and memory chips at the foundation of AI,” said Terry Lee, Corporate Vice President and General Manager, Heterogeneous Integration and Packaging at Applied Materials. “We look forward to furthering our collaboration with Besi and delivering innovative technology to our customers.”
Applied Materials and Besi have co-developed an integrated hybrid bonding system, which has the full capabilities chipmakers need to take the technology to very high-volume manufacturing over the next several years. The system brings together Applied’s expertise in front-end wafer and chip processing with high levels of bonding accuracy and speed from Besi’s leading die placement, interconnect and assembly solutions.
The investment was made through market-based transactions and is not subject to regulatory approvals. Applied does not intend to seek board representation at Besi, nor does it have plans to purchase additional shares of Besi common stock.
About Applied Materials
Applied Materials, Inc. (Nasdaq: AMAT) is the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. At Applied Materials, our innovations make possible a better future. Learn more at www.appliedmaterials.com.
Applied Materials Contact:
Ricky Gradwohl (editorial/media) 408.235.4676
Liz Morali (financial community) 408.986.7977
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