Applied Materials Accelerates Chip Defect Review with Next-Gen eBeam System
Applied Materials has introduced the SEMVision H20, a new defect review system designed to enhance semiconductor manufacturing. The system combines advanced electron beam (eBeam) technology with AI image recognition to analyze nanoscale defects in leading-edge chips.
The system features second-generation cold field emission (CFE) technology, delivering up to 50% increased nanoscale image resolution and 10X faster imaging compared to conventional thermal field emission. The H20 can process results up to 3X faster than current techniques.
Key innovations include sub-nanometer resolution for identifying buried defects and deep learning AI capabilities that automatically distinguish true defects from false alarms. The system is particularly important for complex 3D architecture in 2nm node logic chips and higher-density memory manufacturing. Leading logic and memory chipmakers have already adopted the technology for emerging nodes.
Applied Materials ha introdotto il SEMVision H20, un nuovo sistema di revisione dei difetti progettato per migliorare la produzione di semiconduttori. Il sistema combina la tecnologia avanzata del fascio di elettroni (eBeam) con il riconoscimento delle immagini basato sull'IA per analizzare i difetti su scala nanometrica nei chip all'avanguardia.
Il sistema presenta la tecnologia di emissione a freddo (CFE) di seconda generazione, che offre una risoluzione dell'immagine nanometrica aumentata fino al 50% e un'imaging 10 volte più veloce rispetto all'emissione termica convenzionale. L'H20 può elaborare i risultati fino a 3 volte più rapidamente rispetto alle tecniche attuali.
Le principali innovazioni includono una risoluzione sub-nanometrica per identificare i difetti sepolti e capacità di apprendimento profondo dell'IA che distinguono automaticamente i veri difetti dagli allarmi falsi. Il sistema è particolarmente importante per l'architettura 3D complessa nei chip logici a nodo di 2nm e nella produzione di memorie ad alta densità. I principali produttori di chip logici e di memoria hanno già adottato la tecnologia per i nodi emergenti.
Applied Materials ha presentado el SEMVision H20, un nuevo sistema de revisión de defectos diseñado para mejorar la fabricación de semiconductores. El sistema combina tecnología avanzada de haz de electrones (eBeam) con reconocimiento de imágenes basado en IA para analizar defectos a escala nanométrica en chips de última generación.
El sistema cuenta con tecnología de emisión de campo frío (CFE) de segunda generación, que ofrece una resolución de imagen nanométrica aumentada de hasta un 50% y una velocidad de imagen 10 veces más rápida en comparación con la emisión térmica convencional. El H20 puede procesar resultados hasta 3 veces más rápido que las técnicas actuales.
Las innovaciones clave incluyen resolución sub-nanométrica para identificar defectos enterrados y capacidades de IA de aprendizaje profundo que distinguen automáticamente los verdaderos defectos de las falsas alarmas. El sistema es particularmente importante para arquitecturas 3D complejas en chips lógicos de nodo de 2nm y en la fabricación de memoria de alta densidad. Los principales fabricantes de chips lógicos y de memoria ya han adoptado la tecnología para nodos emergentes.
Applied Materials는 반도체 제조를 개선하기 위해 설계된 새로운 결함 검토 시스템인 SEMVision H20를 소개했습니다. 이 시스템은 첨단 전자빔(eBeam) 기술과 AI 이미지 인식을 결합하여 최첨단 칩의 나노 스케일 결함을 분석합니다.
이 시스템은 냉전계 방출(CFE) 기술의 2세대 모델로, 기존의 열 전계 방출 방식에 비해 나노 스케일 이미지 해상도를 최대 50% 향상시키고 이미징 속도를 10배 빠르게 제공합니다. H20은 현재 기술보다 최대 3배 빠르게 결과를 처리할 수 있습니다.
주요 혁신 사항으로는 묻힌 결함을 식별하기 위한 서브 나노미터 해상도와 진정한 결함과 잘못된 경고를 자동으로 구별하는 딥 러닝 AI 기능이 포함됩니다. 이 시스템은 2nm 노드 로직 칩의 복잡한 3D 아키텍처와 고밀도 메모리 제조에 특히 중요합니다. 주요 로직 및 메모리 칩 제조업체는 이미 새로운 노드를 위해 이 기술을 채택했습니다.
Applied Materials a introduit le SEMVision H20, un nouveau système de révision des défauts conçu pour améliorer la fabrication des semi-conducteurs. Ce système combine une technologie avancée de faisceau d'électrons (eBeam) avec une reconnaissance d'images par IA pour analyser les défauts à l'échelle nanométrique dans les puces de pointe.
Le système dispose de la technologie de l'émission de champ froid (CFE) de deuxième génération, offrant jusqu'à 50% d'augmentation de la résolution d'image à l'échelle nanométrique et une imagerie 10 fois plus rapide par rapport à l'émission thermique conventionnelle. Le H20 peut traiter les résultats jusqu'à 3 fois plus rapidement que les techniques actuelles.
Les principales innovations incluent une résolution sub-nanométrique pour identifier les défauts enfouis et des capacités d'IA d'apprentissage profond qui distinguent automatiquement les véritables défauts des fausses alertes. Ce système est particulièrement important pour l'architecture 3D complexe dans les puces logiques de nœud de 2nm et la fabrication de mémoire à haute densité. Les principaux fabricants de puces logiques et de mémoire ont déjà adopté cette technologie pour les nœuds émergents.
Applied Materials hat das SEMVision H20 vorgestellt, ein neues Defektreview-System, das entwickelt wurde, um die Halbleiterfertigung zu verbessern. Das System kombiniert fortschrittliche Elektronenstrahl(eBeam)-Technologie mit KI-Bilderkennung, um nanoskalige Defekte in führenden Chips zu analysieren.
Das System verfügt über die zweite Generation der kalten Feldemission (CFE)-Technologie, die eine bis zu 50% erhöhte nanoskalige Bildauflösung und eine 10-mal schnellere Bildgebung im Vergleich zur herkömmlichen thermischen Feldemission bietet. Das H20 kann Ergebnisse bis zu 3-mal schneller verarbeiten als die aktuellen Techniken.
Wichtige Innovationen umfassen eine sub-nanometer Auflösung zur Identifizierung begrabener Defekte und Deep-Learning-KI-Fähigkeiten, die automatisch echte Defekte von Fehlalarmen unterscheiden. Das System ist besonders wichtig für komplexe 3D-Architekturen in 2nm-Logikchips und in der Herstellung von hochdichtem Speicher. Führende Logik- und Speicherchip-Hersteller haben die Technologie bereits für aufkommende Knoten übernommen.
- New SEMVision H20 system delivers 3X faster defect analysis results
- 50% increase in nanoscale image resolution compared to conventional technology
- 10X faster imaging speed versus traditional thermal field emission
- System already adopted by leading logic and memory chipmakers
- None.
Insights
The launch of SEMVision H20 marks a pivotal advancement in semiconductor manufacturing technology that strengthens Applied Materials' competitive moat in the critical process control segment. The system's ability to deliver 3X faster results while maintaining superior accuracy directly addresses one of the most pressing challenges in advanced chip manufacturing - the exponential increase in potential defect sites that require review.
The significance of this innovation extends beyond mere technical improvements. In the semiconductor industry, where yield rates directly impact profitability, the system's enhanced defect detection capabilities represent substantial value for chip manufacturers. The 50% increase in nanoscale image resolution combined with 10X faster imaging speed enables manufacturers to maintain quality control while scaling to more complex chip architectures, particularly important for 2nm node production and advanced memory devices.
From a market perspective, this launch reinforces Applied Materials' leadership in the semiconductor equipment sector. The integration of second-generation CFE technology with AI-driven defect classification creates significant barriers to entry, as competitors would need to develop both advanced electron beam technology and sophisticated AI models to match these capabilities. This technological advantage is particularly valuable as the industry transitions to more complex Gate-All-Around transistors and higher-density memory architectures.
The timing of this release is strategically important, coinciding with the industry's push toward more advanced nodes and 3D chip architectures. By enabling faster and more accurate defect analysis, AMAT is positioning itself to capture increased market share in the high-margin process control segment, while helping customers accelerate their technology roadmaps and improve factory economics through better yield rates and reduced cycle times.
- SEMVision™ H20 enables better and faster analysis of nanoscale defects in leading-edge chips
- Second-generation “cold field emission” technology provides high-resolution imaging
- AI image recognition speeds up defect detection and classification
SANTA CLARA, Calif., Feb. 19, 2025 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today introduced a new defect review system to help leading semiconductor manufacturers continue pushing the limits of chip scaling. The company’s SEMVision™ H20 system combines the industry’s most sensitive electron beam (eBeam) technology with advanced AI image recognition to enable better and faster analysis of buried nanoscale defects in the world’s most advanced chips.
eBeam imaging has long been an important tool for examining defects that are too small to be seen with optical techniques. Its ultra-high resolution enables analysis of the tiniest imperfections in a sea of billions of nanoscale circuit patterns. Traditionally, optical techniques are used to scan a wafer for potential defects, and then eBeam is deployed to better characterize these defects. In the emerging “angstrom era” – where the smallest chip features can be just a few atoms thick – it is becoming increasingly difficult to differentiate true defects from false alarms.
At today’s most advanced nodes, optical inspection creates much denser defect maps, which can require as much as a 100X increase in the number of defect candidates delivered to eBeam review. Process control engineers increasingly need defect review systems that can analyze exponentially more samples while maintaining the speed and sensitivity required for high-volume production.
“Our new SEMVision H20 system allows the world’s leading chipmakers to better separate the signal from the noise amidst massive amounts of data provided by inspection tools,” said Keith Wells, Group Vice President of Imaging and Process Control at Applied Materials. “By combining advanced AI algorithms with the superior speed and resolution of our innovative eBeam technology, our system enables rapid identification of the smallest defects buried deep in 3D device structures, delivering faster and more accurate inspection results that can improve factory cycle time and yield.”
Applied’s new eBeam technology is critical for complex 3D architecture inflections required to manufacture logic chips at the 2nm node and beyond – including new Gate-All-Around (GAA) transistors – as well as the formation of higher-density DRAM and 3D NAND memories. Applied’s SEMVision H20 defect review system has been adopted by leading logic and memory chipmakers for emerging technology nodes.
The new SEMVision H20 system leverages two significant innovations to classify defects with remarkable accuracy, while delivering results as much as 3X faster than today’s most advanced techniques.
- Next-generation CFE technology: Applied’s “cold field emission” (CFE) technology is a breakthrough in eBeam imaging that enables sub-nanometer resolution for identifying the smallest buried defects. Operating at room temperature, CFE produces a narrower beam with more electrons, thereby increasing nanoscale image resolution by up to 50 percent and imaging speed by up to 10X compared to conventional thermal field emission (TFE) technology. With SEMVision H20, Applied is introducing the second generation of its CFE technology, delivering even faster throughput while maintaining the industry’s highest sensitivity and resolution. This faster imaging speed provides increased coverage across each wafer, allowing chipmakers to gather the same amount of information in one third of the time.
- Deep learning AI image models: SEMVision H20 uses deep learning AI capabilities for automatic extraction of true defects from false “nuisance” defects. Applied’s proprietary deep learning network is continuously trained with data from a chipmaker’s fab and sorts the defects into a distribution including voids, residues, scratches, particles and dozens of other defect types, enabling more accurate and efficient defect characterization.
Applied’s SEMVision product family is the most advanced and widely used eBeam review system in the world. The new SEMVision H20 extends this leadership by combining next-generation CFE technology and advanced AI models to deliver faster and more accurate defect analysis, allowing chipmakers to accelerate chip development and make greater use of eBeam technology in high-volume manufacturing.
About Applied Materials
Applied Materials, Inc. (Nasdaq: AMAT) is the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. At Applied Materials, our innovations make possible a better future. Learn more at www.appliedmaterials.com.
Applied Materials Contact:
Ricky Gradwohl (editorial/media) 408.235.4676
Liz Morali (financial community) 408.986.7977
A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/80511701-73c9-406d-8cb0-aeb0793e4497
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