Leading European Research Institute Chooses Veeco MOCVD Platform for Wireless and Broadband Communication Applications

Rhea-AI Summary

Veeco Instruments Inc (NASDAQ: VECO) announced a collaboration with IHP Microelectronics in Frankfurt, Germany, selecting Veeco's TurboDisc® metal organic chemical vapor deposition (MOCVD) system to develop advanced silicon-based microelectronic technologies. This partnership highlights the TurboDisc platform's capability in supporting high-performance applications essential for wireless and broadband communications. The system offers faster production ramping, up to 50% quicker than traditional tools, and ensures uniform temperature profiles across wafers.

Positive

• Collaboration with IHP Microelectronics, a recognized leader in microelectronics and communication technologies.
• Validation of TurboDisc platform's capabilities in high-performance silicon-based systems.
• Faster production ramping capability of TurboDisc, providing up to 50% quicker recipe capabilities than traditional tools.

Negative

• None.

PLAINVIEW, N.Y., Aug. 12, 2020 (GLOBE NEWSWIRE) -- Veeco Instruments Inc. (NASDAQ: VECO) today announced that IHP Microelectronics, based in Frankfurt, Germany, has selected Veeco’s TurboDisc® metal organic chemical vapor deposition (MOCVD) system for the development of high-performance, silicon-based microelectronic technologies. IHP is an expert in the fields of silicon-based systems, highest-frequency integrated circuits, and technologies for wireless and broadband communication.

“We are honored to work with IHP, a well-respected institute and a driving force of innovation and leadership in the German and European microelectronic and communication space,” commented Ajit Paranjpe, Veeco’s chief technology officer. “Their selection of our TurboDisc platform is validation of its exceptional process capabilities and ability to help enable game-changing technologies. We look forward to continuing to support IHP as they continue to innovate and execute on their mission.”

Veeco’s TurboDisc platform has been the foundation of Veeco’s decades of compound semiconductor materials science leadership. The proprietary technology is a key enabler for today’s demanding As/P and GaN applications critical for next-generation communications infrastructure and highly efficient microelectronic devices. The TurboDisc platform provides production ramping due to faster recipe capabilities up to 50% quicker than when using traditional batch tools. In addition, the platform also includes Veeco’s IsoFlange™ and SymmHeat™ technologies, which provide homogeneous laminar flow and uniform temperature profile across the entire wafer delivering world-class uniformity and repeatability.

About Veeco
Veeco (NASDAQ: VECO) is an innovative manufacturer of semiconductor process equipment. Our proven ion beam, laser annealing, lithography, MOCVD and single wafer etch & clean technologies play an integral role in the fabrication and packaging of advanced semiconductor devices. With equipment designed to optimize performance, yield and cost of ownership, Veeco holds leading technology positions in the markets we serve. To learn more about Veeco’s systems and service offerings, visit www.veeco.com.

About IHP Microelectronics
The IHP performs research and development in the fields of silicon-based systems, highest-frequency integrated circuits, and technologies for wireless and broadband communication. The focus of research at the institute is oriented towards issues relevant for business, resulting in applications for telecommunications, semiconductor and automotive industries, aerospace, telemedicine, and automation technologies. The institute has developed into an internationally recognized competence center for silicon-germanium technologies. Learn more at https://www.ihp-microelectronics.com/en/start.html.

To the extent that this news release discusses expectations or otherwise makes statements about the future, such statements are forward-looking and are subject to a number of risks and uncertainties that could cause actual results to differ materially from the statements made. These factors include the risks discussed in the Business Description and Management's Discussion and Analysis sections of Veeco's Annual Report on Form 10-K for the year ended December 31, 2019 and in our subsequent quarterly reports on Form 10-Q, current reports on Form 8-K and press releases. Veeco does not undertake any obligation to update any forward-looking statements to reflect future events or circumstances after the date of such statements.

Veeco Contacts
Investors:	Anthony Bencivenga | (516) 252-1438 | abencivenga@veeco.com
Media:	Kevin Long | (516) 714-3978 | klong@veeco.com

FAQ

What recent partnership did Veeco (NASDAQ: VECO) announce?

Veeco announced a partnership with IHP Microelectronics in Germany to utilize its TurboDisc® MOCVD system for developing silicon-based microelectronics.

What is the significance of the TurboDisc® platform for Veeco's business?

The TurboDisc platform is essential for high-performance applications in microelectronics, enabling faster production and high uniformity in semiconductor processes.

How much quicker is the TurboDisc platform's production ramp compared to traditional tools?

The TurboDisc platform offers up to 50% quicker production ramping capabilities compared to traditional batch tools.