TTM Technologies, Inc. Announces Upcoming Conference Participation

Rhea-AI Summary

SANTA ANA, Calif., May 19, 2022 – TTM Technologies (NASDAQ:TTMI) announced its management team will attend several upcoming investor conferences. Key events include the Barclays High Yield Bond Conference on May 24, the J.P. Morgan Technology Conference on May 25 at 9:20 am ET, the virtual Craig-Hallum Conference on June 1, and the UBS Global Industrials Conference on June 7 at 4:20 pm ET. The Baird Conference is set for June 8 at 3:10 pm ET, followed by the Stifel Conference on June 9 at 3:00 pm ET. All presentations will be webcast live on TTM's website.

SANTA ANA, Calif., May 19, 2022 (GLOBE NEWSWIRE) -- TTM Technologies, Inc. (NASDAQ:TTMI), a leading global manufacturer of printed circuit boards (“PCB”), radio frequency (“RF”) components and RF microwave/microelectronic assemblies, today announced that members of its management team will attend the following investor conferences:

• The Barclays High Yield Bond and Syndicated Loan Conference on May 24^th at the Omni Barton Creek Hotel in Austin,
• The J.P. Morgan Global Technology, Media and Communications conference on May 25^th at the Westin Seaport Hotel in Boston with a presentation at 9:20 am Eastern Time,
• The virtual Craig-Hallum Institutional Investor Conference on June 1^st,
• The UBS Global Industrials and Transportation Conference on June 7^th at the Lotte New York Palace Hotel in New York, with a presentation at 4:20 pm Eastern Time,
• The Baird Global Consumer, Technology & Services Conference on June 8^th with a presentation at 3:10 pm Eastern Time at the Intercontinental Barclays Hotel in New York, and
• The Stifel Cross Sector Insight Conference on June 9^th at the Intercontinental Hotel in Boston with a presentation at 3:00 pm Eastern Time.

All presentations will be webcast live on the company’s website, www.ttm.com, and a replay will be accessible for a limited time following the events.

About TTM
TTM Technologies, Inc. is a leading global printed circuit board manufacturer, focusing on quick-turn and technologically advanced PCBs and backplane assemblies, and a global designer and manufacturer of RF and microwave/microelectronic components and assemblies. TTM stands for time-to-market, representing how TTM's time-critical, one-stop manufacturing services enable customers to shorten the time required to develop new products and bring them to market. Additional information can be found at www.ttm.com.

Contact:
Sameer Desai,
Vice President, Corporate Development & Investor Relations
sameer.desai@ttmtech.com
714-327-3050

FAQ

What investor conferences will TTM Technologies attend in May and June 2022?

TTM Technologies will attend the Barclays High Yield Bond Conference on May 24, the J.P. Morgan Technology Conference on May 25, the Craig-Hallum Conference on June 1, the UBS Conference on June 7, the Baird Conference on June 8, and the Stifel Conference on June 9.

What is the date and time of TTM Technologies' presentation at the J.P. Morgan Conference?

TTM Technologies' presentation at the J.P. Morgan Global Technology Conference will be on May 25 at 9:20 am Eastern Time.

Where can I watch TTM Technologies' conference presentations?

All of TTM Technologies' conference presentations will be webcast live on their website.

What does TTM stand for in TTM Technologies?

TTM stands for time-to-market, highlighting the company's focus on efficient manufacturing services.

What type of products does TTM Technologies manufacture?

TTM Technologies is a leading manufacturer of printed circuit boards and RF components.