Tower Semiconductor to Showcase its Next-Generation BCD Technology at APEC 2025
Tower Semiconductor (NASDAQ/TASE: TSEM) announced its participation in the 2025 Applied Power Electronics Conference (APEC) from March 17-19 in Atlanta, Georgia. The company will showcase its advanced power management technology platform, featuring its 300mm 65nm 3.3V-based BCD solution.
The presentation will highlight Tower's power management solutions targeting Automotive, AI, Mobile PMIC, and Data Center power delivery applications. The company's 0.18μm (200mm) and 65nm (300mm) Bipolar-CMOS-DMOS (BCD) platforms support various applications including driver ICs, battery management, and high-voltage gate drivers.
Dr. Mete Erturk, Sr. Director of Power Management Marketing, will present 'Tower Semiconductor's BCD Technology Foundry Offerings: From Automotive to Datacenter Power' on March 19, 2025, at 12:45 PM in room A312.
Tower Semiconductor (NASDAQ/TASE: TSEM) ha annunciato la sua partecipazione alla 2025 Applied Power Electronics Conference (APEC) che si svolgerà dal 17 al 19 marzo ad Atlanta, Georgia. L'azienda presenterà la sua piattaforma avanzata di gestione dell'energia, caratterizzata dalla sua soluzione BCD basata su 300mm 65nm a 3.3V.
La presentazione metterà in evidenza le soluzioni di gestione dell'energia di Tower, mirate a applicazioni Automotive, AI, Mobile PMIC e alimentazione dei Data Center. Le piattaforme Bipolar-CMOS-DMOS (BCD) dell'azienda, da 0.18μm (200mm) e 65nm (300mm), supportano varie applicazioni tra cui IC di driver, gestione delle batterie e driver di gate ad alta tensione.
Il Dr. Mete Erturk, Direttore Senior del Marketing della Gestione dell'Energia, presenterà 'Offerte della tecnologia BCD di Tower Semiconductor: dall'Automotive all'alimentazione dei Data Center' il 19 marzo 2025, alle 12:45 nella sala A312.
Tower Semiconductor (NASDAQ/TASE: TSEM) anunció su participación en la 2025 Applied Power Electronics Conference (APEC) que se llevará a cabo del 17 al 19 de marzo en Atlanta, Georgia. La empresa mostrará su plataforma avanzada de gestión de energía, que presenta su solución BCD basada en 300mm 65nm a 3.3V.
La presentación destacará las soluciones de gestión de energía de Tower, dirigidas a aplicaciones de Automoción, AI, Mobile PMIC y entrega de energía para Data Centers. Las plataformas Bipolar-CMOS-DMOS (BCD) de la empresa, de 0.18μm (200mm) y 65nm (300mm), soportan diversas aplicaciones, incluyendo ICs de controladores, gestión de baterías y controladores de puerta de alta tensión.
El Dr. Mete Erturk, Director Senior de Marketing de Gestión de Energía, presentará 'Ofertas de tecnología BCD de Tower Semiconductor: desde Automoción hasta alimentación de Data Center' el 19 de marzo de 2025, a las 12:45 PM en la sala A312.
타워 반도체 (NASDAQ/TASE: TSEM)는 2025년 응용 전력 전자 회의 (APEC)에 참여한다고 발표했습니다. 이 회의는 3월 17일부터 19일까지 조지아주 애틀랜타에서 열립니다. 이 회사는 300mm 65nm 3.3V 기반 BCD 솔루션을 특징으로 하는 첨단 전력 관리 기술 플랫폼을 선보일 예정입니다.
발표에서는 자동차, AI, 모바일 PMIC 및 데이터 센터 전력 공급 애플리케이션을 목표로 하는 타워의 전력 관리 솔루션이 강조될 것입니다. 회사의 0.18μm (200mm) 및 65nm (300mm) Bipolar-CMOS-DMOS (BCD) 플랫폼은 드라이버 IC, 배터리 관리 및 고전압 게이트 드라이버를 포함한 다양한 애플리케이션을 지원합니다.
전력 관리 마케팅 수석 이사인 Mete Erturk 박사는 2025년 3월 19일 오후 12시 45분에 A312호에서 '타워 반도체의 BCD 기술 파운드리 제공: 자동차에서 데이터 센터 전력까지'를 발표할 예정입니다.
Tower Semiconductor (NASDAQ/TASE: TSEM) a annoncé sa participation à la 2025 Applied Power Electronics Conference (APEC) qui se tiendra du 17 au 19 mars à Atlanta, en Géorgie. L'entreprise présentera sa plateforme avancée de gestion de l'énergie, mettant en avant sa solution BCD basée sur 300mm 65nm à 3.3V.
La présentation mettra en lumière les solutions de gestion de l'énergie de Tower, visant les applications Automobile, IA, Mobile PMIC et alimentation des Data Centers. Les plateformes Bipolar-CMOS-DMOS (BCD) de l'entreprise, en 0.18μm (200mm) et 65nm (300mm), soutiennent diverses applications, y compris les circuits intégrés de pilote, la gestion des batteries et les pilotes de porte à haute tension.
Le Dr. Mete Erturk, Directeur Senior du Marketing de la Gestion de l'Énergie, présentera 'Offres de technologie BCD de Tower Semiconductor : de l'Automobile à l'alimentation des Data Centers' le 19 mars 2025 à 12h45 dans la salle A312.
Tower Semiconductor (NASDAQ/TASE: TSEM) hat seine Teilnahme an der 2025 Applied Power Electronics Conference (APEC) angekündigt, die vom 17. bis 19. März in Atlanta, Georgia, stattfindet. Das Unternehmen wird seine fortschrittliche Plattform für Energiemanagement vorstellen, die auf einer 300mm 65nm 3.3V BCD-Lösung basiert.
Die Präsentation wird die Energiemanagementlösungen von Tower hervorheben, die auf Automotive, KI, Mobile PMIC und die Stromversorgung von Rechenzentren abzielen. Die Bipolar-CMOS-DMOS (BCD) Plattformen des Unternehmens in 0.18μm (200mm) und 65nm (300mm) unterstützen verschiedene Anwendungen, darunter Treiber-ICs, Batteriemanagement und Hochspannungs-Gate-Treiber.
Dr. Mete Erturk, Senior Director of Power Management Marketing, wird am 19. März 2025 um 12:45 Uhr im Raum A312 'Tower Semiconductors BCD-Technologie-Fundamentalanwendungen: Von Automotive bis Datacenter Power' präsentieren.
- Advanced 300mm 65nm BCD technology expansion
- Diversified application portfolio across high-growth sectors (Automotive, AI, Data Centers)
- Enhanced power efficiency capabilities with new 3.3V gate oxide technology
- None.
Presenting Advanced Power Management Solutions for Automotive, AI, Mobile, and Data Center Applications
MIGDAL HAEMEK, Israel, March 5, 2025 – Tower Semiconductor (NASDAQ/TASE: TSEM), a leading foundry of high-value analog semiconductor solutions, today announced its participation in the upcoming 2025 Applied Power Electronics Conference (APEC), taking place March 17–19 in Atlanta, Georgia. The Company will highlight its cutting-edge power management technology platform with its high-efficiency power conversion capabilities including the latest 300mm 65nm 3.3V-based BCD solution, designed to meet the growing demands of Automotive, AI, Mobile PMIC, and Data Center power delivery.
Tower’s industry-leading 0.18μm (200mm) and 65nm (300mm) Bipolar-CMOS-DMOS (BCD) platforms drive innovation across a broad range of applications, including driver ICs, battery management, portable power solutions, PC power control, and high-voltage gate drivers. With its recently announced 3.3V gate oxide technology offering 3.3V and 5V-based solutions as well as a comprehensive suite of design enablement tools, Tower continues to set new benchmarks in power efficiency, enabling next-generation solutions for a variety of high-demand sectors.
Presentation schedule:
Tower Semiconductor's BCD Technology Foundry Offerings: From Automotive to Datacenter Power
By Dr. Mete Erturk, Sr. Director, Power Management Marketing
Date: March 19, 2025
Time: 12:45 PM – 1:15 PM
Location: A312
To meet with Tower’s engineering team at APEC 2025, visit booth #1148.
For more information on Tower’s Power Management solutions, visit here.
About Tower Semiconductor
Tower Semiconductor Ltd. (NASDAQ/TASE: TSEM), the leading foundry of high-value analog semiconductor solutions, provides technology, development, and process platforms for its customers in growing markets such as consumer, industrial, automotive, mobile, infrastructure, medical and aerospace and defense. Tower Semiconductor focuses on creating a positive and sustainable impact on the world through long-term partnerships and its advanced and innovative analog technology offering, comprised of a broad range of customizable process platforms such as SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS image sensor, non-imaging sensors, displays, integrated power management (BCD and 700V), photonics, and MEMS. Tower Semiconductor also provides world-class design enablement for a quick and accurate design cycle as well as process transfer services including development, transfer, and optimization, to IDMs and fabless companies. To provide multi-fab sourcing and extended capacity for its customers, Tower Semiconductor owns one operating facility in Israel (200mm), two in the U.S. (200mm), two in Japan (200mm and 300mm) which it owns through its
Safe Harbor Regarding Forward-Looking Statements
This press release includes forward-looking statements, which are subject to risks and uncertainties. Actual results may vary from those projected or implied by such forward-looking statements. A complete discussion of risks and uncertainties that may affect the accuracy of forward-looking statements included in this press release or which may otherwise affect Tower’s business is included under the heading “Risk Factors” in Tower’s most recent filings on Forms 20-F, F-3, F-4 and 6-K, as were filed with the Securities and Exchange Commission (the “SEC”) and the Israel Securities Authority. Tower does not intend to update, and expressly disclaim any obligation to update, the information contained in this release.
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Tower Semiconductor Company Contact: Orit Shahar | +972-74-7377440 | oritsha@towersemi.com
Investor Relations Contact: Liat Avraham | +972-4-6506154 | liatavra@towersemi.com
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