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Tower Semiconductor Releases 300mm Silicon Photonics Process as a Standard Foundry Offering

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Tower Semiconductor (NASDAQ/TASE: TSEM) has announced the release of its new 300mm Silicon Photonics (SiPho) process as a standard foundry offering. This advanced process complements their existing 200mm (PH18) platform, which is currently in high-volume production. The new offering features industry-leading silicon waveguides and advanced low-loss silicon nitride waveguide technology. The larger wafer size improves compatibility with industry-standard OSAT platforms, enabling better integration with electronic components and enhanced efficiency.

Tower Semiconductor (NASDAQ/TASE: TSEM) ha annunciato il lancio del suo nuovo processo di Fotonica Siliconica da 300mm (SiPho) come offerta standard di fonderia. Questo processo avanzato completa la loro piattaforma esistente da 200mm (PH18), attualmente in produzione ad alto volume. La nuova offerta presenta guide d'onda in silicio leader nel settore e una tecnologia avanzata di guide d'onda in nitruro di silicio a bassa perdita. La dimensione maggiore del wafer migliora la compatibilità con le piattaforme OSAT standard di settore, consentendo una migliore integrazione con componenti elettronici e una maggiore efficienza.

Tower Semiconductor (NASDAQ/TASE: TSEM) ha anunciado el lanzamiento de su nuevo proceso de Fotónica de Silicio de 300mm (SiPho) como una oferta estándar de fundición. Este avanzado proceso complementa su plataforma existente de 200mm (PH18), que actualmente está en producción a gran escala. La nueva oferta cuenta con guías de onda de silicio líderes en la industria y tecnología avanzada de guías de onda de nitruro de silicio de baja pérdida. El mayor tamaño de la oblea mejora la compatibilidad con las plataformas OSAT estándar de la industria, permitiendo una mejor integración con componentes electrónicos y una eficiencia mejorada.

Tower Semiconductor (NASDAQ/TASE: TSEM)는 새로운 300mm 실리콘 포토닉스(SiPho) 프로세스를 표준 파운드리 서비스로 출시한다고 발표했습니다. 이 첨단 프로세스는 현재 대량 생산 중인 기존 200mm(PH18) 플랫폼을 보완합니다. 새로운 제품은 업계 최고의 실리콘 웨이브가이드와 고급 저손실 실리콘 나이트라이드 웨이브가이드 기술을 특징으로 합니다. 더 큰 웨이퍼 크기는 업계 표준 OSAT 플랫폼과의 호환성을 개선하여 전자 구성 요소와의 통합을 더 잘 가능하게 하고 효율성을 향상시킵니다.

Tower Semiconductor (NASDAQ/TASE: TSEM) a annoncé le lancement de son nouveau processus de Photonique au Silicium de 300mm (SiPho) comme une offre standard de fonderie. Ce processus avancé complète leur plateforme existante de 200mm (PH18), qui est actuellement en production en haute volume. La nouvelle offre présente des guides d'onde en silicium à la pointe de l'industrie et une technologie avancée de guides d'onde en nitrure de silicium à faible perte. La taille plus grande du wafer améliore la compatibilité avec les plateformes OSAT standard de l'industrie, permettant une meilleure intégration avec les composants électroniques et une efficacité accrue.

Tower Semiconductor (NASDAQ/TASE: TSEM) hat die Einführung seines neuen 300mm Silizium-Photonik (SiPho)-Verfahrens als Standard-Fertigungsofferte angekündigt. Dieses fortschrittliche Verfahren ergänzt ihre bestehende 200mm (PH18) Plattform, die derzeit in Hochvolumenproduktion ist. Das neue Angebot bietet branchenführende Siliziumwellenleiter und fortschrittliche, verlustarme Siliziumnitrid-Wellenleittechnologie. Die größere Wafergröße verbessert die Kompatibilität mit branchenüblichen OSAT-Plattformen und ermöglicht eine bessere Integration mit elektronischen Bauteilen sowie eine gesteigerte Effizienz.

Positive
  • Introduction of new 300mm Silicon Photonics process expanding product portfolio
  • Enhanced compatibility with industry-standard OSAT platforms
  • Builds upon existing high-volume production 200mm platform
Negative
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Insights

This 300mm Silicon Photonics process release represents a significant technological advancement for Tower Semiconductor's manufacturing capabilities. The transition from 200mm to 300mm wafers delivers substantial cost efficiencies and increased production capacity - critical factors for serving the rapidly growing datacenter market. The larger wafer size typically reduces per-chip costs by 20-30% and increases throughput substantially.

The platform's compatibility with standard OSAT integration will likely accelerate customer adoption and reduce time-to-market for new products. The improved silicon waveguides and low-loss silicon nitride features could give Tower a competitive edge in the high-performance computing and AI sectors, where data transmission speeds are crucial. However, the full revenue impact will depend on customer migration rates and market demand for these advanced solutions.

Featuring industry-leading figures of merit addressing the evolving needs for next-generation datacom applications 

MIGDAL HAEMEK, Israel, November 26, 2024 – Tower Semiconductor (NASDAQ/TASE: TSEM), a leading foundry of high-value analog semiconductor solutions, today announced the release of its new 300mm Silicon Photonics (SiPho) process as a standard foundry offering. This advanced process complements Tower's well-established 200mm (PH18) platform that is in high-volume production today, providing its customers with a cutting-edge solution tailored to meet the growing needs of high-speed data communications for next generation datacom applications.

The unique 300mm offering features best-in-class silicon waveguides and the most advanced low-loss silicon nitride waveguide offerings in the industry. The larger wafer size enhances compatibility with industry-standard OSAT (Outsourced Semiconductor Assembly and Test) platforms, facilitating seamless integration with electronic components and improving overall efficiency.

"We are proud to introduce our new, highly advanced Silicon Photonics offering, which provides a seamless path for our existing customers to transition to next-generation technology on 300mm wafers,” said Dr. Edward Preisler, Vice President and General Manager of RF Business Unit. “This process builds on Tower’s industry-leading 200mm SiPho platform both in terms of continuous process enhancements and increasing flexibility of supply for our customers."

For additional information on Tower’s RF & HPA technology platform, please visit here.

About Tower Semiconductor         

Tower Semiconductor Ltd. (NASDAQ/TASE: TSEM), the leading foundry of high-value analog semiconductor solutions, provides technology, development, and process platforms for its customers in growing markets such as consumer, industrial, automotive, mobile, infrastructure, medical and aerospace and defense. Tower Semiconductor focuses on creating a positive and sustainable impact on the world through long-term partnerships and its advanced and innovative analog technology offering, comprised of a broad range of customizable process platforms such as SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS image sensor, non-imaging sensors, displays, integrated power management (BCD and 700V), photonics, and MEMS. Tower Semiconductor also provides world-class design enablement for a quick and accurate design cycle as well as process transfer services including development, transfer, and optimization, to IDMs and fabless companies. To provide multi-fab sourcing and extended capacity for its customers, Tower Semiconductor owns two facilities in Israel (150mm and 200mm), two in the U.S. (200mm), two in Japan (200mm and 300mm) which it owns through its 51% holdings in TPSCo, shares a 300mm facility in Agrate, Italy, with ST as well as has access to a 300mm capacity corridor in Intel’s New Mexico factory. For more information, please visit: www.towersemi.com.

Safe Harbor Regarding Forward-Looking Statements

This press release includes forward-looking statements, which are subject to risks and uncertainties. Actual results may vary from those projected or implied by such forward-looking statements. A complete discussion of risks and uncertainties that may affect the accuracy of forward-looking statements included in this press release or which may otherwise affect Tower’s business is included under the heading “Risk Factors” in Tower’s most recent filings on Forms 20-F and 6-K, as were filed with the Securities and Exchange Commission (the “SEC”) and the Israel Securities Authority. Tower does not intend to update, and expressly disclaim any obligation to update, the information contained in this release.

Tower Semiconductor Investor Relations Contact: Noit Levy | +972-4-604-7066 | noitle@towersemi.com
Tower Semiconductor Company Contact: Orit Shahar | +972-74-7377440 | oritsha@towersemi.com

          

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FAQ

What new technology did Tower Semiconductor (TSEM) release in November 2024?

Tower Semiconductor released a new 300mm Silicon Photonics (SiPho) process as a standard foundry offering.

What are the key features of Tower Semiconductor's (TSEM) new 300mm Silicon Photonics process?

The process features best-in-class silicon waveguides, advanced low-loss silicon nitride waveguide offerings, and enhanced compatibility with industry-standard OSAT platforms.

How does Tower Semiconductor's (TSEM) new 300mm SiPho process complement their existing technology?

The new 300mm process complements Tower's existing 200mm (PH18) platform that is currently in high-volume production, providing a seamless transition path for customers to next-generation technology.

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