Welcome to our dedicated page for TOPPAN Holdings news (Ticker: TOPPY), a resource for investors and traders seeking the latest updates and insights on TOPPAN Holdings stock.
Toppan Photomask, a leading semiconductor photomask provider, has partnered with IBM to collaborate on research and development for the 2 nanometer logic semiconductor node using extreme ultraviolet lithography. Over the next five years, the two companies will focus on developing photomask capabilities at the Albany NanoTech Complex and Toppan Photomask's Asaka Plant. This partnership aims to advance semiconductor technology through material selection, process control, and commercial solutions for 2nm node and beyond printing.
TOPPAN Holdings (TYO: 7911) has agreed to acquire Sonoco's Thermoformed & Flexible Packaging (TFP) business for approximately $1.8 billion on a cash-free and debt-free basis. The acquisition combines Sonoco TFP's robust sales network and customer base in the Americas with TOPPAN Group's technical expertise in global packaging.
Sonoco's TFP, which generated approximately $1.3 billion in revenue in 2023, is a leading provider of thermoformed and flexible packaging serving food, retail, and medical verticals. The transaction is expected to close in the first half of 2025, subject to regulatory approvals.
This acquisition aligns with TOPPAN Group's strategy to become a global leader in sustainable packaging solutions and represents a significant milestone in their global expansion plans.
TOPPAN Holdings Inc. (TYO: 7911) has announced a definitive agreement to acquire HID's Citizen Identity Solutions (CID) business from HID Global This acquisition will establish TOPPAN as a major leader in security and identity solutions, expanding its global footprint and portfolio. HID's CID business has over 20 years of experience in delivering innovative technologies to more than 50 countries worldwide.
The acquisition is set in the context of a US$10 billion global government identity sector with strong fundamentals, including the growth of mobile IDs and Digital Travel Credentials. TOPPAN views this move as a strategic expansion into new markets and an enhancement of its capabilities and offerings to clients.
Jean-Pierre Ting, President of TOPPAN Gravity, highlighted the complementary nature of the two companies' technologies and expertise. Chee Tong Yeo, President & CEO of TOPPAN NEXT, emphasized the strengthened position of TOPPAN as an industry leader offering a wider range of end-to-end government identity solutions.
Toppan (TYO: 7911) has launched the LC MAGIC™ Normal Black, a liquid crystal light control film that enhances vehicle privacy by blocking 95% of visible light when powered off. With a light transmission of just 5% off and 43% on, this innovation is designed for electric and self-driving vehicles, promoting comfort and eliminating the need for traditional shades. Toppan aims for mass production in fiscal 2024, offering advantages such as light weight and low power consumption to manufacturers and designers in the mobility sector.
Toppan and Brookman Technology have developed the world's first CMOS-process-based Time-of-Flight (ToF) sensor capable of measuring distances up to 30 meters, more than five times the range of traditional models. This hybrid ToF technology, presented at the 2022 IEEE Symposium, enhances operability for autonomous drones and robots, supporting obstacle detection in bright conditions (up to 100,000 lux). Toppan plans to start testing in December 2022 and aims for sales in the fall of 2023.
Toppan has carved out its semiconductor photomask business, launching Toppan Photomask Co., Ltd., in partnership with Integral Corporation. This independent venture aims to enhance growth and competitiveness in the rapidly expanding semiconductor market, projected to exceed 100 trillion yen by 2030. With manufacturing locations in the U.S., Europe, Japan, and Asia, Toppan Photomask will capitalize on increased demand for photomasks, driven by a global semiconductor shortage. The venture supports customers with agile, investment-focused strategies and aims for a future IPO to accelerate growth.
Toppan Printing has unveiled a groundbreaking flexible thin-film transistor (TFT) that combines exceptional flexibility, durability, and carrier mobility. This new TFT can endure up to a million bending cycles with a 1 mm radius of curvature, achieving an on/off current ratio of at least 107 and carrier mobility exceeding 10 cm2/Vs. Its innovative design aims to enhance applications in wearable sensors, medical devices, and smart packaging. Toppan aspires to further refine manufacturing techniques for flexible sensors.