Teradyne Announces Production System for Double-Sided Wafer Probe Test for Silicon Photonics
Teradyne (TER) has partnered with ficonTEC to launch the first high-volume, double-sided wafer probe test cell for silicon photonics. The innovative solution combines Teradyne's UltraFLEXplus automated test equipment and IG-XL programming environment with ficonTEC's optical alignment, probing, and wafer handling technologies.
The system enables testing of hybrid bonded PIC/EIC wafers in production environments, addressing the growing demand for high-throughput electro-optical testing driven by co-packaged optics (CPO) applications. While partnering with ficonTEC for immediate market deployment, Teradyne maintains an open ecosystem approach, ensuring UltraFLEXplus compatibility with various industry-leading optical instruments and systems.
This solution facilitates known good die testing before wafer dicing and packaging into CPO devices or pluggable transceivers, integrating efficiently with existing fab and OSAT test floor infrastructure.
Teradyne (TER) ha collaborato con ficonTEC per lanciare il primo sistema di test a sonda su wafer doppio lato ad alta capacità per la fotonica al silicio. Questa soluzione innovativa combina l'equipaggiamento di test automatizzato UltraFLEXplus di Teradyne e l'ambiente di programmazione IG-XL con le tecnologie di allineamento ottico, sondaggio e gestione dei wafer di ficonTEC.
Il sistema consente di testare i wafer ibridi PIC/EIC in ambienti di produzione, rispondendo alla crescente domanda di test elettroottici ad alta capacità, spinta dalle applicazioni di ottiche co-pacchettizzate (CPO). Pur collaborando con ficonTEC per un'immediata distribuzione sul mercato, Teradyne mantiene un approccio ecosistemico aperto, garantendo la compatibilità di UltraFLEXplus con vari strumenti e sistemi ottici leader del settore.
Questa soluzione facilita il test dei die noti prima del taglio dei wafer e del confezionamento in dispositivi CPO o transceiver pluggabili, integrandosi in modo efficiente con l'infrastruttura esistente dei piani di test fab e OSAT.
Teradyne (TER) se ha asociado con ficonTEC para lanzar el primer sistema de prueba de sonda de obleas de doble cara de alto volumen para fotónica de silicio. Esta solución innovadora combina el equipo de prueba automatizado UltraFLEXplus de Teradyne y el entorno de programación IG-XL con las tecnologías de alineación óptica, sondeo y manejo de obleas de ficonTEC.
El sistema permite probar obleas híbridas PIC/EIC en entornos de producción, abordando la creciente demanda de pruebas electroópticas de alto rendimiento impulsadas por aplicaciones de ópticas empaquetadas (CPO). Mientras colabora con ficonTEC para un despliegue inmediato en el mercado, Teradyne mantiene un enfoque de ecosistema abierto, asegurando la compatibilidad de UltraFLEXplus con varios instrumentos y sistemas ópticos líderes en la industria.
Esta solución facilita la prueba de die conocidos antes del corte de obleas y el empaquetado en dispositivos CPO o transceptores enchufables, integrándose de manera eficiente con la infraestructura existente en los pisos de prueba de fab y OSAT.
테라다인 (TER)은 피콘텍 (ficonTEC)과 협력하여 실리콘 포토닉스를 위한 첫 번째 고용량 양면 웨이퍼 프로브 테스트 셀을 출시했습니다. 이 혁신적인 솔루션은 테라다인의 UltraFLEXplus 자동 테스트 장비와 IG-XL 프로그래밍 환경을 피콘텍의 광학 정렬, 프로빙 및 웨이퍼 처리 기술과 결합합니다.
이 시스템은 생산 환경에서 하이브리드 본딩 PIC/EIC 웨이퍼의 테스트를 가능하게 하여, 공동 패키징 광학(CPO) 애플리케이션에 의해 촉발된 고처리량 전자광학 테스트에 대한 증가하는 수요를 해결합니다. 피콘텍과의 파트너십을 통해 즉각적인 시장 배포를 진행하는 동시에, 테라다인은 다양한 업계 선도적인 광학 기기 및 시스템과의 호환성을 보장하는 개방형 생태계 접근 방식을 유지합니다.
이 솔루션은 웨이퍼 절단 및 CPO 장치 또는 플러그형 트랜시버로 포장하기 전에 알려진 좋은 다이 테스트를 용이하게 하여 기존의 팹 및 OSAT 테스트 플로어 인프라와 효율적으로 통합됩니다.
Teradyne (TER) s'est associé à ficonTEC pour lancer la première cellule de test à sonde de wafer double face à haut volume pour la photonique au silicium. Cette solution innovante combine l'équipement de test automatisé UltraFLEXplus de Teradyne et l'environnement de programmation IG-XL avec les technologies d'alignement optique, de sondage et de manipulation des wafers de ficonTEC.
Le système permet de tester des wafers PIC/EIC hybridement liés dans des environnements de production, répondant à la demande croissante de tests électro-optiques à haut débit, stimulée par les applications d'optique co-emballées (CPO). Tout en s'associant à ficonTEC pour un déploiement immédiat sur le marché, Teradyne maintient une approche d'écosystème ouvert, garantissant la compatibilité d'UltraFLEXplus avec divers instruments et systèmes optiques de premier plan dans l'industrie.
Cette solution facilite le test de dies connus avant la découpe des wafers et l'emballage dans des dispositifs CPO ou des transceivers enfichables, s'intégrant efficacement à l'infrastructure existante des plans de test des fabs et des OSAT.
Teradyne (TER) hat sich mit ficonTEC zusammengeschlossen, um die erste hochvolumige, doppelseitige Wafer-Probe-Testzelle für Siliziumphotonik zu starten. Die innovative Lösung kombiniert Teradynes automatisierte Testausrüstung UltraFLEXplus und die Programmierumgebung IG-XL mit den Technologien zur optischen Ausrichtung, Probing und Wafer-Handhabung von ficonTEC.
Das System ermöglicht das Testen von hybrid gebondeten PIC/EIC-Wafern in Produktionsumgebungen und geht auf die wachsende Nachfrage nach hochdurchsatzfähigen elektro-optischen Tests ein, die durch co-packaged optics (CPO)-Anwendungen vorangetrieben wird. Während Teradyne mit ficonTEC für eine sofortige Markteinführung zusammenarbeitet, verfolgt das Unternehmen einen offenen Ökosystemansatz, der die Kompatibilität von UltraFLEXplus mit verschiedenen marktführenden optischen Instrumenten und Systemen sicherstellt.
Diese Lösung erleichtert das Testen bekannter guter Dies vor dem Wafer-Sägen und der Verpackung in CPO-Geräte oder steckbare Transceiver und integriert sich effizient in die bestehende Infrastruktur der Testflächen von Fab und OSAT.
- First-to-market advantage in high-volume silicon photonics testing
- Strategic partnership with industry leader ficonTEC
- Open ecosystem approach enables flexibility and market expansion
- Addresses growing market demand in CPO applications
- None.
Insights
Teradyne's launch of the first high-volume, double-sided wafer probe test cell for silicon photonics represents a significant technological advancement in semiconductor testing capabilities. This innovation directly addresses the growing demand for electro-optical testing in the rapidly expanding silicon photonics market, particularly for co-packaged optics (CPO) applications that are becoming increasingly critical in data centers and high-performance computing.
The strategic partnership with ficonTEC combines Teradyne's UltraFLEXplus automated test equipment with ficonTEC's optical alignment expertise, creating a comprehensive solution for testing hybrid bonded PIC/EIC wafers in production environments. What's particularly notable is Teradyne's commitment to an open ecosystem approach, making their platform compatible with various industry-leading optical instruments and probe systems.
This product addresses a critical market need for known good die testing before further processing, improving yields and reducing costs in photonic integrated circuit manufacturing. By integrating with existing fab infrastructure, Teradyne is lowering the barrier to adoption while positioning itself as a key enabler in the silicon photonics supply chain.
For Teradyne, this represents an expansion of their addressable market into the growing photonics segment, leveraging their core competencies in semiconductor test while adapting to emerging technologies. The timing aligns well with industry momentum toward silicon photonics for high-bandwidth, power-efficient connectivity solutions in data centers and AI applications.
The introduction of Teradyne's double-sided wafer probe test cell addresses a critical bottleneck in silicon photonics manufacturing. Silicon photonics represents the convergence of optical and electronic components on silicon substrates, enabling dramatic improvements in data transfer rates while reducing power consumption—a crucial advantage as data centers scale to meet AI and cloud computing demands.
What makes this announcement technically significant is the double-sided testing capability. Silicon photonic devices typically require both electrical connections on one side and optical connections on the other. Traditional single-sided testing approaches have severely throughput and test coverage, making comprehensive wafer-level testing challenging.
Co-packaged optics (CPO)—where optical components are packaged alongside ASICs—is emerging as a key technology for next-generation switch and server architectures. The ability to identify known good photonic die before integration into expensive CPO modules significantly reduces manufacturing costs and improves yields in a notoriously challenging process.
By creating an open ecosystem compatible with various optical instruments, Teradyne is positioning its UltraFLEXplus as a potential standard platform for photonic testing. This strategic approach could secure Teradyne's position as photonic integrated circuits move from niche applications toward mainstream adoption in telecommunications, data centers, and eventually consumer electronics.
The new test cell integrates Teradyne's UltraFLEXplus automated test equipment (ATE) and programming environment, IG-XL, with ficonTEC's advanced optical alignment, probing, and wafer handling technologies. This collaboration enables the testing of hybrid bonded PIC/EIC wafers in a production environment.
While the partnership with ficonTEC enables Teradyne to bring a production-ready system to market today, Teradyne is committed to fostering an open ecosystem for silicon photonics and CPO testing. By ensuring that the UltraFLEXplus is compatible with industry-leading optical instrumentation, probers, alignment systems, and probe cards, Teradyne is delivering a seamless and flexible testing environment for its customers.
"At Teradyne, we believe in the power of collaboration and innovation. Our partnership with ficonTEC enables us to deliver the first high-volume double-sided test cell for silicon photonics wafer test to meet the quickly evolving needs of the industry. Our commitment to an open ecosystem ensures our customers can choose the solution that is right for them," said Regan Mills, President, Product Test at Teradyne.
The introduction of the double-sided wafer probe test cell is expected to have a significant impact on the silicon photonics and CPO market. By enabling high-throughput electro-optical testing of silicon photonic wafers, this solution addresses the critical need for known good die testing before wafers are diced and packaged into CPO devices or pluggable transceivers. The integration of Teradyne's UltraFLEXplus and ficonTEC's optical alignment and probing technologies ensures that the test cell operates efficiently within the existing fab and OSAT test floor infrastructure, providing a comprehensive and cost-effective solution.
"ficonTEC is proud to partner with Teradyne to pioneer this innovative solution for the rapidly developing market. Our joint effort uniquely combines the class-leading capability of both companies, delivering a high-throughput, cost-effective test solution for silicon photonics and CPO manufacturing workflows," said Stefano Concezzi, Corporate Vice President at ficonTEC.
To learn more about Teradyne’s solutions for silicon photonics testing, find us at OFC 2025, April 1- 3 in
About Teradyne
Teradyne (NASDAQ:TER) designs, develops, and manufactures automated test equipment and advanced robotics systems. Its test solutions for semiconductors and electronics products enable Teradyne’s customers to consistently deliver on their quality standards. Its advanced robotics business includes collaborative robots and mobile robots that support manufacturing and warehouse operations for companies of all sizes. For more information, visit teradyne.com. Teradyne® is a registered trademark of Teradyne, Inc., in the
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Traci Tsuchiguchi
Investor Relations
investor.relations@teradyne.com
Source: Teradyne
FAQ
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