Teledyne unveils the first 16k TDI line scan camera with a 1-Megahertz line rate
Teledyne DALSA, a Teledyne Technologies [NYSE:TDY] company, has introduced the Linea™ HS2 TDI line scan camera family. This innovative series represents a significant breakthrough in next-generation TDI technology, designed for ultra-high-speed imaging in light-starved conditions. Key features include:
- 16k/5 µm resolution
- Maximum line rate of 1 Megahertz
- 16 Gigapixels per second data throughput
- Highly sensitive Backside Illuminated (BSI) multi-array charge-domain TDI CMOS sensor
- Configurable for superior image quality with maximized line rate, dynamic range, or full well
- Dual Camera Link HS CX4 connectors for EMI immunity
- 2.5 times increase in speed compared to existing Linea HS cameras
The Linea HS2 is ideal for inspecting semiconductor wafers, high-density interconnects, flat panel displays, and life science applications.
Teledyne DALSA, un'azienda di Teledyne Technologies [NYSE:TDY], ha introdotto la famiglia di telecamere a scansione lineare Linea™ HS2 TDI. Questa serie innovativa rappresenta un'importante svolta nella tecnologia TDI di nuova generazione, progettata per immagini ultra-veloci in condizioni di scarsa illuminazione. Le caratteristiche principali includono:
- Risoluzione di 16k/5 µm
- Velocità massima di scansione di 1 Megahertz
- Throughput dati di 16 Gigapixel al secondo
- Sensor multi-array TDI CMOS altamente sensibile illuminato da dietro (BSI)
- Configurabile per una qualità dell'immagine superiore con massimizzazione della velocità di scansione, gamma dinamica o capacità di ben pieno
- Connettori Dual Camera Link HS CX4 per immunità EMI
- Aumento della velocità di 2,5 volte rispetto alle telecamere Linea HS esistenti
La Linea HS2 è ideale per ispezionare wafer di semiconduttori, interconnessioni ad alta densità, display a pannello piatto e applicazioni nelle scienze della vita.
Teledyne DALSA, una empresa de Teledyne Technologies [NYSE:TDY], ha presentado la familia de cámaras de escaneo lineal Linea™ HS2 TDI. Esta serie innovadora representa un avance significativo en la tecnología TDI de próxima generación, diseñada para imágenes ultra-rápidas en condiciones de poca luz. Las características clave incluyen:
- Resolución de 16k/5 µm
- Ritmo de línea máximo de 1 Megaherzio
- Transmisión de datos de 16 Gigapíxeles por segundo
- Sensor CMOS TDI de múltiples matrices iluminado por detrás (BSI) altamente sensible
- Configuración para una calidad de imagen superior con maximización de la tasa de línea, rango dinámico o capacidad total
- Conectores Dual Camera Link HS CX4 para inmunidad EMI
- Aumento de velocidad de 2.5 veces en comparación con las cámaras Linea HS existentes
La Linea HS2 es ideal para la inspección de obleas de semiconductores, interconexiones de alta densidad, pantallas planas y aplicaciones en ciencias de la vida.
Teledyne DALSA는 Teledyne Technologies [NYSE:TDY]의 회사로서 Linea™ HS2 TDI 라인 스캔 카메라 패밀리를 소개했습니다. 이 혁신적인 시리즈는 차세대 TDI 기술에 있어 중요한 돌파구를 나타내며, 조명 부족 조건에서의 초고속 이미징을 위해 설계되었습니다. 주요 특징은 다음과 같습니다:
- 16k/5 µm 해상도
- 최대 라인 속도 1 메가헤르츠
- 초당 16 기가픽셀 데이터 처리량
- 고감도 백사이드 일루미네이티드(BSI) 멀티 어레이 충전 도메인 TDI CMOS 센서
- 최대 라인 속도, 다이나믹 레인지 또는 풀 웰로 최적화된 화질을 위해 구성 가능
- EMI 면역을 위한 듀얼 카메라 링크 HS CX4 커넥터
- 기존 Linea HS 카메라에 비해 2.5배 속도 증가
Linea HS2는 반도체 웨이퍼, 고밀도 인터커넥트, 평판 디스플레이 및 생명 과학 응용 분야 검사에 이상적입니다.
Teledyne DALSA, une entreprise de Teledyne Technologies [NYSE:TDY], a présenté la famille de caméras à balayage linéaire Linea™ HS2 TDI. Cette série innovante représente une avancée significative dans la technologie TDI de nouvelle génération, conçue pour l'imagerie ultra-haute vitesse dans des conditions de faible éclairage. Les caractéristiques clés comprennent :
- Résolution de 16k/5 µm
- Vitesse de ligne maximale de 1 mégahertz
- Débit de données de 16 gigapixels par seconde
- Capteur TDI CMOS multi-array hautement sensible illuminé par l'arrière (BSI)
- Configuré pour une qualité d'image supérieure avec une vitesse de ligne maximisée, une plage dynamique ou une capacité pleine
- Connecteurs Dual Camera Link HS CX4 pour immunité EMI
- Augmentation de la vitesse de 2,5 fois par rapport aux caméras Linea HS existantes
La Linea HS2 est idéale pour l'inspection des plaquettes de semi-conducteurs, des interconnexions à haute densité, des écrans plats et des applications en sciences de la vie.
Teledyne DALSA, ein Unternehmen von Teledyne Technologies [NYSE:TDY], hat die Linea™ HS2 TDI Linienkamerafamilie eingeführt. Diese innovative Serie stellt einen bedeutenden Durchbruch in der next-generation TDI-Technologie dar, die für ultra-hochgeschwindigkeits Imaging unter lichtarmen Bedingungen konzipiert ist. Zu den Hauptmerkmalen gehören:
- 16k/5 µm Auflösung
- Maximale Zeilenrate von 1 Megahertz
- 16 Gigapixel pro Sekunde Datenübertragung
- Hochsensitiver Backside Illuminated (BSI) Multi-Array Charge-Domain TDI CMOS Sensor
- Konfigurierbar für überlegene Bildqualität mit maximierter Zeilenrate, dynamischem Bereich oder voller Well
- Duale Camera Link HS CX4 Stecker für EMI-Immunität
- 2,5-fache Geschwindigkeitssteigerung im Vergleich zu bestehenden Linea HS Kameras
Die Linea HS2 ist ideal zur Inspektion von Halbleiterwafern, hochdichten Interconnects, Flachbildschirmen und Anwendungen im Bereich der Lebenswissenschaften.
- Introduction of a new high-performance camera family (Linea™ HS2 TDI)
- Industry-leading maximum line rate of 1 Megahertz
- 16 Gigapixels per second data throughput
- 2.5 times increase in speed compared to existing Linea HS cameras
- Potential for increased market share in semiconductor, electronics, and life science industries
- None.
Teledyne's Linea™ HS2 TDI line scan camera family represents a significant leap in imaging technology. The 16k resolution and 1 Megahertz line rate are industry-leading specs, enabling ultra-high-speed imaging in low-light conditions. This breakthrough could revolutionize inspection processes in semiconductor, electronics and life sciences industries.
The camera's Backside Illuminated (BSI) multi-array charge-domain TDI CMOS sensor optimizes quantum efficiency, important for capturing high-quality images in challenging lighting. The 16 Gigapixels per second data throughput is impressive, allowing for real-time processing of massive amounts of visual data. This could significantly boost production speeds and quality control in manufacturing.
The dual Camera Link HS CX4 connectors with Active Optical Cables provide EMI immunity, essential in industrial environments. The 2.5x speed increase over previous models, while maintaining reasonable power consumption, showcases Teledyne's engineering prowess in balancing performance and efficiency.
Teledyne's new camera family positions the company at the forefront of the high-speed imaging market. The product's versatility, catering to semiconductor, electronics and life sciences sectors, expands Teledyne's potential customer base. This could translate to increased market share and revenue growth in the machine vision segment.
The seamless upgrade path from existing Linea HS cameras is a smart strategy, potentially driving adoption among current customers. The optional liquid cooling accessory and compatibility with Teledyne's frame grabbers create opportunities for upselling and cross-selling within their product ecosystem.
However, the highly specialized nature of this product means its impact on Teledyne's overall financial performance may be Investors should monitor adoption rates in key industries and any resulting shifts in Teledyne's revenue mix to gauge the long-term impact of this innovation on the company's growth trajectory.
WATERLOO, Canada, Sept. 17, 2024 (GLOBE NEWSWIRE) -- Teledyne DALSA, a Teledyne Technologies [NYSE:TDY] company, is pleased to introduce the Linea™ HS2 TDI line scan camera family. Drawing on over four decades of industry leading expertise, this innovative camera series represents a significant breakthrough in next generation TDI technology. Designed for ultra-high-speed imaging in light starved conditions, it delivers exceptional image quality with 16k/5 µm resolution and boasts an industry leading maximum line rate of 1 Megahertz, or 16 Gigapixels per second data throughput.
The Linea HS2 features a highly sensitive Backside Illuminated (BSI) multi-array charge-domain TDI CMOS sensor with 16k/5 µm resolution and optimized Quantum Efficiency, meeting the rigorous demands of current and future machine vision applications. The multi-array TDI sensor architecture allows the camera to be configured for superior image quality with maximized line rate, dynamic range, or full well, according to specific application requirements. This makes it particularly ideal for inspecting semiconductor wafers, high density interconnects and flat panel displays, and for life science applications. On-chip binning also enables higher web speeds to boost system throughput. The camera is equipped with dual Camera Link HS CX4 connectors to Active Optical Cables providing complete EMI immunity.
Linea HS2 offers a seamless upgrade from Teledyne’s existing Linea HS line scan cameras, featuring the same pixel size, optics, cables, and mounting hardware, but with a 2.5 time increase in speed, while maintaining reasonable power consumption. An optional liquid cooling accessory provides thermal stability during operation.
For a complete solution, the Linea HS2 camera works with Teledyne’s Xtium2 CLHS series of high-performance frame grabbers, utilizing next generation CLHS technology. Built on reliable, field-proven high-speed data transmission technology, it delivers data at 16 Gigapixels per second over dual CLHS CX4 connectors to active optical cables. Its data forwarding capability supports parallel data processing in up to 12 PCs.
See Linea HS2 at VISION, Stuttgart from 8-10 October 2024 on Teledyne booth 8 B10 or visit the product page for more information. For sales enquiries, visit our contact page.
Teledyne DALSA is a part of Teledyne’s Vision Solutions group and a leader in the design, manufacture, and deployment of digital imaging components for machine vision. Teledyne DALSA image sensors, cameras, smart cameras, frame grabbers, software, and vision solutions are at the heart of thousands of inspection systems around the world and across multiple industries. For more information, visit www.teledynedalsa.com/imaging.
All trademarks are registered by their respective companies.
Teledyne DALSA reserves the right to make changes at any time without notice.
Media Contact:
Jessica Broom
Jessica.Broom@teledyne.com
A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/1c67c8c8-fc99-4589-989e-390de55382b1
FAQ
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