STMicroelectronics to enable higher-performance cloud optical interconnect in datacenters and AI clusters
STMicroelectronics (NYSE: STM) has announced new proprietary technologies for enhanced optical interconnect performance in datacenters and AI clusters. The company is developing silicon photonics (SiPho) and next-gen BiCMOS technologies, scheduled for production from H2 2025, targeting 800Gb/s and 1.6Tb/s optical modules.
These technologies will enable the integration of multiple complex components into single chips while providing ultra high-speed, low-power optical connectivity. Both technologies will be manufactured on 300mm processes in Europe at ST's Crolles fab.
According to LightCounting, the Pluggable Optics for Data Center Market, valued at $7 billion in 2024, is projected to grow at a 23% CAGR during 2025-2030, reaching $24 billion by 2030. The market share of silicon photonics modulator-based transceivers is expected to increase from 30% in 2024 to 60% by 2030.
STMicroelectronics (NYSE: STM) ha annunciato nuove tecnologie proprietarie per migliorare le prestazioni delle interconnessioni ottiche nei datacenter e nei cluster di intelligenza artificiale. L'azienda sta sviluppando fotonica siliconica (SiPho) e tecnologie BiCMOS di nuova generazione, previste per la produzione a partire dal secondo semestre del 2025, con l'obiettivo di realizzare moduli ottici da 800Gb/s e 1.6Tb/s.
Queste tecnologie consentiranno l'integrazione di più componenti complessi in singoli chip, offrendo connettività ottica ultra-veloce e a basso consumo energetico. Entrambe le tecnologie saranno prodotte con processi da 300mm in Europa presso lo stabilimento di Crolles di ST.
Secondo LightCounting, il mercato delle ottiche pluggable per i datacenter, valutato 7 miliardi di dollari nel 2024, è previsto crescere a un CAGR del 23% durante il periodo 2025-2030, raggiungendo i 24 miliardi di dollari entro il 2030. Si prevede che la quota di mercato dei trasmettitori basati su modulatore di fotonica siliconica aumenti dal 30% nel 2024 al 60% entro il 2030.
STMicroelectronics (NYSE: STM) ha anunciado nuevas tecnologías propietarias para mejorar el rendimiento de las interconexiones ópticas en centros de datos y clusters de inteligencia artificial. La empresa está desarrollando fotónica de silicio (SiPho) y tecnologías BiCMOS de próxima generación, programadas para producción a partir del segundo semestre de 2025, con el objetivo de alcanzar módulos ópticos de 800Gb/s y 1.6Tb/s.
Estas tecnologías permitirán la integración de múltiples componentes complejos en chips únicos, proporcionando conectividad óptica de ultra alta velocidad y bajo consumo energético. Ambas tecnologías se fabricarán en procesos de 300mm en Europa en la fábrica de Crolles de ST.
Según LightCounting, el mercado de Ópticas Plugables para Centros de Datos, valorado en 7 mil millones de dólares en 2024, se proyecta que crezca a un CAGR del 23% durante 2025-2030, alcanzando los 24 mil millones de dólares para 2030. Se espera que la cuota de mercado de los transceptores basados en moduladores de fotónica de silicio aumente del 30% en 2024 al 60% en 2030.
STMicroelectronics (NYSE: STM)는 데이터 센터와 AI 클러스터에서 광학 인터커넥트 성능을 향상시키기 위한 새로운 독점 기술을 발표했습니다. 이 회사는 실리콘 포토닉스(SiPho)와 차세대 BiCMOS 기술을 개발 중이며, 2025년 하반기부터 생산할 예정이며, 800Gb/s 및 1.6Tb/s 광 모듈을 목표로 하고 있습니다.
이 기술들은 여러 복잡한 구성 요소를 단일 칩으로 통합하면서 초고속, 저전력 광 연결을 제공할 수 있게 해줍니다. 두 기술 모두 ST의 Crolles 공장에서 유럽의 300mm 공정으로 제조될 예정입니다.
LightCounting에 따르면, 2024년에 70억 달러로 평가되는 데이터 센터용 플러그형 광학 시장은 2025-2030년 동안 23% CAGR로 성장할 것으로 예상되며, 2030년까지 240억 달러에 이를 것으로 보입니다. 실리콘 포토닉스 모듈레이터 기반 트랜시버의 시장 점유율은 2024년 30%에서 2030년까지 60%로 증가할 것으로 예상됩니다.
STMicroelectronics (NYSE: STM) a annoncé de nouvelles technologies propriétaires pour améliorer les performances des interconnexions optiques dans les centres de données et les clusters d'IA. L'entreprise développe la photonique silicium (SiPho) et des technologies BiCMOS de nouvelle génération, qui devraient entrer en production à partir du deuxième semestre 2025, visant des modules optiques de 800Gb/s et 1.6Tb/s.
Ces technologies permettront l'intégration de plusieurs composants complexes en une seule puce tout en offrant une connectivité optique ultra-rapide et à faible consommation d'énergie. Les deux technologies seront fabriquées sur des procédés de 300mm en Europe dans l'usine de Crolles de ST.
Selon LightCounting, le marché des optiques plugables pour les centres de données, évalué à 7 milliards de dollars en 2024, devrait croître à un CAGR de 23% durant la période 2025-2030, atteignant 24 milliards de dollars d'ici 2030. La part de marché des transceivers basés sur des modulateurs de photonique silicium devrait passer de 30% en 2024 à 60% d'ici 2030.
STMicroelectronics (NYSE: STM) hat neue proprietäre Technologien zur Verbesserung der optischen Interconnect-Leistung in Rechenzentren und KI-Clustern angekündigt. Das Unternehmen entwickelt Silizium-Photonik (SiPho) und next-gen BiCMOS-Technologien, die ab dem zweiten Halbjahr 2025 in Produktion gehen sollen, mit dem Ziel, optische Module mit 800Gb/s und 1.6Tb/s zu erreichen.
Diese Technologien ermöglichen die Integration mehrerer komplexer Komponenten in einzelne Chips und bieten gleichzeitig ultraschnelle, energieeffiziente optische Konnektivität. Beide Technologien werden in Europa in der 300mm-Fertigung bei STs Werk in Crolles hergestellt.
Laut LightCounting wird der Markt für Plug-in-Optiken für Rechenzentren, der 2024 auf 7 Milliarden Dollar geschätzt wird, voraussichtlich mit einer CAGR von 23% im Zeitraum 2025-2030 wachsen und bis 2030 24 Milliarden Dollar erreichen. Der Marktanteil von Transceivern auf Basis von Silizium-Photonik-Modulatoren wird voraussichtlich von 30% im Jahr 2024 auf 60% im Jahr 2030 steigen.
- New technology deployment scheduled for H2 2025, targeting high-growth AI and datacenter markets
- Manufacturing on 300mm processes in Europe ensures independent high-volume supply chain
- Partnership with major cloud provider AWS validates technology potential
- Targeting rapidly growing market projected to reach $24 billion by 2030
- None.
Insights
This strategic announcement positions STMicroelectronics at the forefront of the rapidly evolving AI infrastructure market. The development of advanced silicon photonics and BiCMOS technologies addresses a critical bottleneck in AI cluster performance - data transmission speed and energy efficiency.
The partnership with Amazon Web Services (AWS) is particularly significant, as it validates ST's technology capabilities and provides direct access to one of the largest cloud infrastructure providers. This collaboration could potentially secure a substantial portion of the $24 billion market projected by 2030.
Several key strategic advantages emerge from this development:
- The integration of multiple components into a single chip through SiPho technology will likely reduce manufacturing costs and improve reliability
- Manufacturing in Europe provides geopolitical advantages amid global supply chain concerns and aligns with EU chip sovereignty initiatives
- The timing of the 2H 2025 production ramp-up coincides with the expected surge in AI infrastructure deployment
The market impact is amplified by the projected growth in silicon photonics-based transceivers, expected to capture 60% market share by 2030, up from 30% in 2024. This positions ST to capitalize on both technology leadership and market expansion.
The 300mm wafer manufacturing capability ensures economies of scale, while the European production base offers strategic advantages in supply chain security and potential government support through EU chip initiatives. The technology's focus on power efficiency is particularly important as data centers face increasing pressure to reduce energy consumption while handling exponentially growing AI workloads.
STMicroelectronics to enable higher-performance cloud optical interconnect in datacenters and AI clusters
- New silicon photonics and next-gen BiCMOS proprietary technologies bring better performance to address the coming 800Gb/s and 1.6Tb/s optical interconnects.
- Developing a roadmap with partners across the value chain for higher energy efficiency pluggable optics and to address the next generation of AI clusters GPU interconnects.
Geneva, Switzerland, February 20, 2025 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is unveiling its next generation of proprietary technologies for higher-performing optical interconnect in datacenters and AI clusters. With the exponential growth of AI computing needs, challenges arise in performance and energy efficiency across computing, memory, power supply, and the interconnections linking them. ST is helping hyperscalers, and the leading optical module provider, overcome those challenges with new silicon photonics and next-gen BiCMOS technologies, scheduled to ramp up from the second half of 2025 for 800Gb/s and 1.6Tb/s optical modules.
At the heart of interconnections in a datacenter are thousands, or even hundreds of thousands, of optical transceivers. These devices convert optical into electrical signals and vice versa to allow data flow between graphics processing unit (GPU) computing resources, switches and storage. Inside these transceivers, ST’s new, proprietary silicon photonics (SiPho) technology will bring customers the ability to integrate multiple complex components into one single chip, while ST’s next-gen, proprietary BiCMOS technology brings ultra high-speed and low power optical connectivity, which are key to sustain the AI growth.
"AI demand is accelerating the adoption of high-speed communication technology within the datacenter ecosystem. This is the right time for ST to introduce new power efficient silicon photonics technology and complementing it with a new generation of BiCMOS for our customers to design the next wave of optical interconnect products, which will enable 800Gbps/1.6Tbps solutions for the hyperscalers,” said Remi El-Ouazzane, President, Microcontrollers, Digital ICs and RF products Group at STMicroelectronics. “Both technologies will be manufactured on 300mm processes in Europe, bringing customers an independent high-volume supply for two key components of their optical module development strategy. Today’s announcement represents the first step for our PIC product-family and, thanks to close collaboration with key partners across the entire value chain, our ambition is to become a key supplier of silicon photonics and BiCMOS wafers for the datacenter and AI cluster market, be it pluggable optics today or optical I/O tomorrow.”
"AWS is pleased to collaborate with STMicroelectronics to develop a new silicon photonics technology (SiPho), PIC100, that will enable interconnection between any workload including Artificial Intelligence (AI). AWS is working with STMicroelectronics based on their demonstrated capability to make PIC100 a leading SiPho technology for the optical and AI market. We are enthusiastic about the potential innovations this will unlock for SiPho," said Nafea Bshara, Vice President and Distinguished Engineer at Amazon Web Services.
“The Pluggable Optics for Data Center Market is experiencing significant growth, valued at
Additional information
ST’s SiPho technology combined with the ST BiCMOS technology are a unique 300mm silicon platform to serve the optical market. Both technologies are being industrialized and will be manufactured in ST’s Crolles (France/Europe) 300mm fab.
Additional technical information is available at ST.com on BiCMOS technology and Silicon Photonics.
You can also read our blogpost at https://blog.st.com/pic100/
About STMicroelectronics
At ST, we are over 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027. Further information can be found at www.st.com.
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jerome.ramel@st.com
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Alexis Breton
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Attachments
- T4672S -- Feb 20 2025 -- Cloud Optical Interconnects__IMAGE 1
- T4672S -- Feb 20 2025 -- Cloud Optical Interconnects__FINAL FOR PUBLICATION
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