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STMicroelectronics N.V. (STM) is a global leader in the semiconductor industry, designing and manufacturing a broad range of products for a variety of applications. Formed in 1987 through a merger between Italy's SGS Microelettronica and France's Thomson Semiconductors, the company has become a key supplier of analog chips, microcontrollers, sensors, and discrete power semiconductors, especially for industrial and automotive markets.
With more than 50,000 employees and a network of over 200,000 customers, STMicroelectronics has a strong global presence, characterized by state-of-the-art manufacturing facilities. The company is committed to driving innovation in electronics applications—from smarter mobility and efficient power management to cloud-connected autonomous systems.
In recent developments, STMicroelectronics has made significant strides towards sustainability, aiming for carbon neutrality on scopes 1 and 2, and partially on scope 3 by 2027. The company has entered into various partnerships and agreements to support this goal. Notably, STMicroelectronics signed a ten-year Power Purchase Agreement (PPA) with Centrica Energy for renewable energy in Italy, and expanded a silicon carbide (SiC) substrate wafer supply agreement with SiCrystal.
In the automotive sector, STMicroelectronics collaborates with Panasonic and Geely Auto Group on innovative projects. Panasonic has integrated STMicroelectronics' STM32F3 MCU and edge AI tools into their e-assisted bike, while Geely uses ST’s third-generation SiC MOSFETs in their electric vehicles to enhance performance and efficiency.
On the financial front, STMicroelectronics reported $3.47 billion in net revenues for Q1 2024. Despite a year-over-year decrease of 18.4%, the company continues to invest in future growth, as evidenced by their plans for a high-volume 200mm SiC manufacturing facility in Catania, Italy. This new facility, part of a larger Silicon Carbide Campus, is expected to commence production in 2026, supporting the company's leadership in SiC technology for automotive and industrial applications.
With a focus on R&D and substantial investments in sustainable energy and innovative technologies, STMicroelectronics remains a significant player in the semiconductor industry, driving advancements that support a more connected and environmentally friendly world.
STMicroelectronics (NYSE: STM) has signed a 21-year Power Purchase Agreement (PPA) with BKH Solar Sdn Bhd, a joint venture between ENGIE and Conextone Energy, for renewable energy supply in Malaysia. The agreement will provide approximately 50 GWh of renewable energy annually from a new solar farm in Bukit Kayu Hitam, Kedah. This initiative supports ST's goal of achieving carbon neutrality in operations by 2027 and 100% renewable energy sourcing. The renewable energy will power ST's high-volume test and assembly site in Muar, Johor, which employs over 4,700 people.
STMicroelectronics has completed a share repurchase program between Oct 28-Nov 01, 2024, buying back 409,408 ordinary shares (0.04% of issued share capital) at a weighted average price of EUR 25.5039 per share, totaling EUR 10,441,483.15. The buyback was executed on Euronext Paris to meet obligations from share option programs and employee allocations. Following these transactions, STMicroelectronics holds 11,563,022 treasury shares, representing approximately 1.3% of its issued share capital.
STMicroelectronics reported Q3 2024 financial results with net revenues of $3.25 billion, a 26.6% year-over-year decrease. The company posted a gross margin of 37.8%, operating margin of 11.7%, and net income of $351 million. Year-to-date revenues reached $9.95 billion with a 39.9% gross margin.
The company expects Q4 net revenues of $3.32 billion, representing a 22.4% year-over-year decline. ST anticipates a revenue decline between Q4 2024 and Q1 2025 above normal seasonality. The company announced a new program to reshape manufacturing footprint, focusing on 300mm Silicon and 200mm Silicon Carbide capacity, targeting high triple-digit million-dollar annual cost savings by 2027.
STMicroelectronics has unveiled the ST1VAFE3BX, a new bio-sensing chip designed for next-generation healthcare wearables. The chip combines biopotential input for cardio and neurological sensing with motion tracking and embedded AI capabilities.
The device integrates a high-accuracy vertical analog front end (vAFE) for vital signs detection, an accelerometer for inertial sensing, and ST's machine-learning core for autonomous activity detection. Priced at $1.50 for orders of 1000 units, it operates with low power consumption of 50µA typical current and features a 12-bit ADC resolution with 3200Hz maximum output data rate.
STMicroelectronics has announced the completion of share repurchases between Oct 21-25, 2024, acquiring 317,000 ordinary shares (0.03% of issued share capital) at a weighted average price of EUR 25.8060 per share, totaling EUR 8,180,516.60. The buyback program, approved by shareholders on May 22, 2024, aims to meet obligations from share option programs and employee allocations. Following these transactions, STMicroelectronics holds 11,153,614 treasury shares, representing approximately 1.2% of its issued share capital.
STMicroelectronics N.V. (STM) has announced the status of its common share repurchase program for the period from October 14 to 18, 2024. The company repurchased 369,000 ordinary shares, representing 0.04% of its issued share capital, at a weighted average price of €25.5055 per share for a total of €9,411,525.00. The purpose of these transactions is to meet obligations arising from share option programmes or other share allocations to employees or company bodies. Following these buybacks, STMicroelectronics holds 10,836,614 treasury shares, approximately 1.2% of its issued share capital.
STMicroelectronics N.V. (STM) has announced the status of its common share repurchase program for the period from October 7 to October 11, 2024. The company repurchased 364,100 ordinary shares, representing 0.04% of its issued share capital, at a weighted average purchase price of €25.4908 per share. The total cost of the buyback was €9,281,194.62.
The purpose of these transactions is to meet obligations arising from share option programmes or other share allocations to employees or company bodies. The shares may be held in treasury before being used for this purpose or for any other lawful purpose under the Market Abuse Regulation. Following these buybacks, STMicroelectronics now holds 10,467,614 treasury shares, approximately 1.1% of its issued share capital.
STMicroelectronics N.V. (STM) has announced the status of its common share repurchase program for the period from September 30, 2024, to October 4, 2024. The company repurchased 368,300 ordinary shares, equivalent to 0.04% of its issued share capital, at a weighted average purchase price of €26.1864 per share, for a total of €9,644,462.01.
The purpose of these transactions is to meet obligations arising from share option programs or other share allocations to employees or company bodies. The shares may be held in treasury before being used for this purpose or for any other lawful purpose. Following these buybacks, STMicroelectronics now holds 10,103,514 treasury shares, representing approximately 1.1% of its issued share capital.
STMicroelectronics has announced the timing for its Third Quarter 2024 Earnings Release and Conference Call, as well as its Capital Markets Day Webcast. The company will release Q3 2024 earnings before European stock markets open on October 31, 2024. A conference call to discuss the financial results and current business outlook will be held on the same day at 9:30 a.m. CET / 3:30 a.m. ET.
Additionally, STMicroelectronics will host its 2024 Capital Markets Day meeting via webcast from Paris, France, on November 20, 2024, from 9:00 a.m. to 1:15 p.m. CET / 3:00 a.m. to 7:15 a.m. ET. Both events will be accessible through live webcasts on the company's investor relations website, with recordings and presentation materials available for later viewing.
STMicroelectronics (NYSE: STM) and Qualcomm Technologies International, have announced a strategic collaboration for the next generation of industrial and consumer IoT solutions augmented by edge AI. The partnership will integrate Qualcomm's AI-powered wireless connectivity technologies with ST's STM32 microcontroller ecosystem.
Key points:
- Initial focus on Wi-Fi/Bluetooth/Thread combo system-on-a-chip (SoC)
- Seamless connectivity software integration into STM32 general-purpose MCUs
- ST plans to introduce self-contained modules using Qualcomm's combo SoC portfolio
- Initial product offerings expected in Q1 2025
- Future plans include extending into cellular connectivity for industrial IoT applications
This collaboration aims to accelerate the development of feature-rich IoT applications and reduce time-to-market for developers.
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