RENESAS ELECTRON UNSP/ADR - RNECY STOCK NEWS

Renesas Electronics Corporation (TSE: 6723) has appointed Julie Pope as the company’s first Chief Human Resources Officer (CHRO), effective September 1, 2022. Previously serving as Vice President of HR, Julie brings 30 years of experience in HR across various global organizations. In her new role, she will oversee global HR operations, focusing on talent acquisition, employee engagement, and diversity initiatives. Julie's leadership aims to enhance Renesas' workplace culture and drive sustainable growth in the semiconductor sector.

Renesas Electronics Corporation reported strong financial results for the six months ended June 30, 2022, with revenue of ¥722.9 billion, representing a 71.5% increase year-on-year. Operating profit surged 219.8% to ¥210.0 billion, while profit attributable to owners reached ¥110.4 billion, a growth of 192.9%. The equity ratio improved to 51.2% from 47.4%. The company forecasted a revenue range of ¥1,103.8 billion to ¥1,111.8 billion for the nine months ending September 30, 2022, anticipating a non-GAAP gross margin of 62.3% to 63.5%.

Renesas Electronics Corporation (TSE: 6723) has released its consolidated financial forecasts for the nine months ending September 30, 2022. The company anticipates a revenue range of 1,103,759 to 1,111,759 million yen, reflecting ongoing volatility in the semiconductor market. Forecasts include a non-GAAP gross margin of 57.8% and an operating margin of 37.3%. Renesas emphasizes that these figures are subject to fluctuations in currency rates, particularly between the yen and the USD, and could significantly differ from actual results due to various uncertainties.

Renesas Electronics Corporation (TSE:6723) completed its acquisition of Reality Analytics, Inc. on July 19, 2022, following necessary approvals. This strategic acquisition aims to enhance Renesas' AI and Tiny Machine Learning capabilities, allowing for better non-visual sensing solutions in various industries, including automotive and industrial sectors. Reality AI's technology integrated with Renesas' MCU/MPU product lines is expected to accelerate endpoint intelligence delivery in IIoT, consumer, and automotive applications, providing a competitive edge in the growing AIoT market.

Renesas Electronics Corporation (TSE:6723) has partnered with Cyberon Corporation to enhance voice user interface (VUI) solutions for its RA microcontroller (MCU) line. This collaboration enables customers to integrate voice recognition technology into various applications including home appliances and industrial automation. Renesas will offer complimentary access to Cyberon's DSpotter toolchain, allowing local voice recognition without internet dependency. The solution promotes reduced development costs and quick command customization, supporting over 40 global languages and enhancing IoT capabilities.

Renesas Electronics Corporation (TSE:6723) has announced a strategic partnership with Tata Motors Ltd. and Tejas Networks Ltd. to develop semiconductor solutions for automotive, IoT, and 5G systems. This collaboration aims to enhance innovation for the Indian market and beyond, building on their previous joint projects, including the next-generation EV Innovation Center established in March 2022. The partnership will focus on electric vehicles, advanced driver-assistance systems (ADAS), and next-gen wireless solutions, thereby positioning Renesas and Tata for significant growth in the evolving tech landscape.

Renesas Electronics Corporation (TSE:6723) has launched new sensor and signal conditioning solutions aimed at enhancing the design of sensor-connected IoT applications. The HS4XXX humidity and temperature sensors and ZSSC3281 signal conditioning IC are designed for improved design cycles, accuracy, and cost efficiency. With the IoT sensor market projected to grow to $27.9 billion by 2028, Renesas aims to leverage its 20 years of expertise in the sensor market. The new products are available now and showcased at the Sensors Converge exhibition in San Jose, California from June 27-29.

Renesas Electronics has launched the SmartBond DA1470x Family, the most advanced Bluetooth LE solutions integrating multiple functions into a single chip, including a power management unit and hardware voice activity detector. This technology is tailored for smart IoT devices like wearables, medical devices, and home appliances. The DA1470x family promises significant cost savings on Bill of Materials (BoM) through a high level of integration, leading to smaller designs and enhanced reliability. The DA1470x is currently in mass production and being utilized in products like the Xiaomi Mi Band 7.

Renesas Electronics Corporation has developed advanced circuit technologies for a 22-nm embedded spin-transfer torque magnetoresistive random-access memory (STT-MRAM) test chip. This chip demonstrates 5.9 ns random read access and a 5.8 MB/s write throughput, enhancing performance for microcontroller units (MCUs). The technologies assist in achieving faster read/write operations, vital for IoT and AI applications. These advancements were showcased at the 2022 IEEE Symposium on VLSI in Hawaii, underscoring Renesas’ commitment to improving MCU efficiency and speed.