RENESAS ELECTRON UNSP/ADR - RNECY STOCK NEWS

Renesas Electronics Corporation (TSE: 6723) announced its consolidated financial forecasts for the six months ending June 30, 2023, alongside its cash dividend projections. Expected non-GAAP revenue ranges from 712,166 to 727,166 million yen, with anticipated gross and operating margins of 55.8% and 33.3%, respectively. The company will not issue an interim dividend for this period, preferring to reinvest retained earnings to adapt to rapid market changes. The year-end dividend for 2023 remains undecided, with plans for strategic investments to enhance corporate value and shareholder profit in the long-term. Previous year comparisons indicate revenue of 723,759 million yen with gross and operating margins at 58.5% and 38.8%, respectively.

Renesas Electronics Corporation has launched the RH1NS200 NB-IoT chipset tailored for the Indian smart metering market, predicted to grow to 250 million units in five years. This chipset features low power consumption of just 1µA in sleep mode and includes an integrated EAL5+ Secure Element for enhanced security, particularly important for applications like power and water metering. The RH1NS200 is compatible with major Indian telecom carriers and can support various applications beyond smart metering. Renesas is increasing its focus on India, having established partnerships and innovation centers with Tata Group companies to innovate semiconductor solutions. The RH1NS200 and its development kit are currently available for the Indian market.

Renesas Electronics Corporation (TSE:6723) has launched its first microcontroller (MCU) utilizing advanced 22-nm process technology, providing enhanced performance and lower power consumption. This wireless MCU features Bluetooth® 5.3 Low Energy and integrates a software-defined radio (SDR), ensuring future-proofing for customers. The new chip is an extension of Renesas' RA family of 32-bit Arm® Cortex®-M microcontrollers, allowing for compatibility with previous Bluetooth LE specifications. Renesas, a leader in the MCU market with over 3.5 billion units shipped annually, is set to sample this product to select customers, with a full market launch anticipated in Q4 2023. The company aims to accelerate time-to-market for its clients by offering over 300 'Winning Combinations', which are optimized system architectures.

Renesas Electronics Corporation (TSE:6723) has launched new cellular-to-cloud development kits, CK-RA6M5 and CK-RX65N, designed for seamless integration with Microsoft Azure cloud services. These kits utilize Renesas' advanced 32-bit MCUs, enabling IoT device developers to leverage Azure's functionalities for efficient management of wireless devices. Certified by Microsoft, both kits facilitate secure connections to Azure IoT Hub, ensuring reliable device provisioning. They are equipped with LTE CAT-M1 modules and a range of onboard sensors, supporting applications like asset tracking and industrial control. Furthermore, enhanced security features have been integrated through a partnership with Crypto Quantique, ensuring data safety. The new development kits aim to simplify IoT application development, reduce time-to-market, and facilitate real-time processing through AI/ML tools.

Renesas Electronics Corporation (TSE: 6723) revealed new firmware for its ZMOD digital air quality sensors, enabling compliance with various global air quality standards for commercial and public buildings. This development positions the sensors as industry leaders, facilitating autonomous monitoring of air quality in HVAC systems. The firmware offers enhanced flexibility, allowing configurations via cloud connections. The sensors support critical environmental standards, potentially increasing product value and easing qualification processes for government incentives. The ZMOD4410 and ZMOD4510 sensors are currently available for deployment.

Renesas Electronics Corporation has introduced the R9A06G150, a 32-bit RISC-V MCU designed for voice-controlled human-machine interface (HMI) systems, targeting applications in building automation, home appliances, toys, and healthcare. This ASSP solution, developed in collaboration with RISC-V partners, eliminates the need for upfront software investments and supports multiple languages and user-defined keywords. The R9A06G150 features a 100MHz CPU, low power consumption, and comes pre-programmed with dedicated application code, streamlining the development process for designers. Renesas continues to enhance its RISC-V portfolio, reinforcing its leadership in this emerging market.

Renesas Electronics Corporation has launched the RZ/T2L industrial microprocessor (MPU), supporting the EtherCAT communication protocol for enhanced real-time control in industrial applications. This new MPU, a cost-effective alternative to the RZ/T2M, provides up to 50% reduced chip size while ensuring high-speed processing for systems like industrial robots and AC servo drives. It features an Arm Cortex-R52 CPU and offers functional safety and security functions. Production of self-diagnostic software and other kits is expected in Q4 2023. The RZ/T2L is positioned to accelerate the automation of various sectors.

Renesas Electronics Corporation has announced the acquisition of Panthronics AG, a fabless semiconductor company specializing in high-performance wireless products, in an all-cash transaction. This strategic move will enhance Renesas’ connectivity portfolio, particularly in the high-demand areas of Near-Field Communication (NFC) for fintech, IoT, and automotive applications. Having collaborated since 2018, both companies aim to leverage Panthronics’ innovative NFC technology to deliver advanced system solutions. The acquisition is expected to close by the end of 2023, pending regulatory approvals.

Renesas Electronics Corporation (TSE: 6723) has launched two new microcontroller (MCU) groups in its 32-bit RA family, the RA4E2 and RA6E2, enhancing performance with up to 200 MHz. The RA4E2 operates at 100 MHz, while the RA6E2 reaches 200 MHz, both designed with power efficiency in mind. Featuring integrated flash options of 128K to 256K and extensive connectivity options like CAN FD and USB, these MCUs cater to applications in sensing, gaming, and wearables. Available in compact 4x4 mm packages, the RA4E2 and RA6E2 groups aim to meet cost-sensitive and space-constrained market demands, supporting a greener environment through low power consumption.