Media Alert: Rambus Hosting Expert Panel on AI Memory Requirements at the AI Hardware and Edge AI Summit in San Jose, CA
Rambus (Nasdaq: RMBS) is hosting an expert panel at the AI Hardware & Edge AI Summit 2024 in San Jose, CA. The discussion, moderated by Dr. Steven Woo, will address key topics like AI workload complexity, system performance demands, power and thermal concerns, memory bottlenecks, and emerging technologies. Panelists include executives from Intel, Meta, and Samsung Electronics. The event takes place on September 10, 2024, at 5:00 p.m. PT at the Regency Ballroom B, Signia by Hilton, Booth 31. For more details, visit here.
Rambus (Nasdaq: RMBS) ospiterà un panel di esperti presso il AI Hardware & Edge AI Summit 2024 a San Jose, CA. La discussione, moderata dal Dr. Steven Woo, tratterà temi chiave come la complessità dei carichi di lavoro dell'IA, le richieste di prestazioni dei sistemi, le preoccupazioni relative a potenza e termiche, i colli di bottiglia nella memoria e le tecnologie emergenti. I relatori includono dirigenti di Intel, Meta e Samsung Electronics. L'evento si svolgerà il 10 settembre 2024, alle 17:00 PT, presso la Regency Ballroom B, Signia by Hilton, Booth 31. Per ulteriori dettagli, visita qui.
Rambus (Nasdaq: RMBS) está organizando un panel de expertos en el AI Hardware & Edge AI Summit 2024 en San José, CA. La discusión, moderada por el Dr. Steven Woo, abordará temas clave como la complejidad de la carga de trabajo de IA, las demandas de rendimiento del sistema, preocupaciones sobre energía y térmicas, cuellos de botella en la memoria y tecnologías emergentes. Los panelistas incluyen ejecutivos de Intel, Meta y Samsung Electronics. El evento tendrá lugar el 10 de septiembre de 2024, a las 5:00 p.m. PT en el Regency Ballroom B, Signia by Hilton, Booth 31. Para más detalles, visita aquí.
램버스(Nasdaq: RMBS)가 캘리포니아주 산호세에서 열리는 AI Hardware & Edge AI Summit 2024에서 전문가 패널을 주최합니다. 스티븐 우 박사가 진행하는 이번 토론에서는 AI 작업 부하의 복잡성, 시스템 성능 요구 사항, 전력 및 열 문제, 메모리 병목 현상, 신기술 등의 주요 주제를 다룰 것입니다. 패널리스트로는 인텔, 메타, 삼성 전자의 경영진이 참여합니다. 이 행사는 2024년 9월 10일 오후 5시 PT에 Signia by Hilton의 Regency Ballroom B, Booth 31에서 개최됩니다. 자세한 내용은 여기를 방문하세요.
Rambus (Nasdaq: RMBS) organise un panel d'experts lors de l'AI Hardware & Edge AI Summit 2024 à San José, CA. La discussion, animée par Dr. Steven Woo, abordera des sujets clés tels que la complexité des charges de travail en IA, les exigences de performance du système, les préoccupations concernant l'énergie et la thermique, les goulets d'étranglement en mémoire, et les technologies émergentes. Les panélistes incluent des dirigeants de Intel, Meta et Samsung Electronics. L'événement aura lieu le 10 septembre 2024 à 17h00 PT au Regency Ballroom B, Signia by Hilton, Booth 31. Pour plus de détails, visitez ici.
Rambus (Nasdaq: RMBS) veranstaltet ein Expertenpanel beim AI Hardware & Edge AI Summit 2024 in San Jose, CA. Die Diskussion, moderiert von Dr. Steven Woo, wird zentrale Themen wie die Komplexität von KI-Arbeitslasten, Leistungsanforderungen an das System, Energie- und Wärmeprobleme, Engpässe bei der Speicherverarbeitung und aufkommende Technologien behandeln. Zu den Panelteilnehmern gehören Führungskräfte von Intel, Meta und Samsung Electronics. Die Veranstaltung findet am 10. September 2024 um 17:00 Uhr PT im Regency Ballroom B, Signia by Hilton, Booth 31 statt. Weitere Informationen finden Sie hier.
- Rambus is engaging with industry leaders like Intel, Meta, and Samsung Electronics, potentially expanding strategic partnerships.
- Exposure at a high-profile event could enhance Rambus' reputation and visibility in the AI hardware sector.
- None.
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What: |
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Who: |
Rambus Inc. (Nasdaq: RMBS), a premier chip and silicon IP provider |
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Where: |
Signia by Hilton |
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Booth 31 in the Expo |
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170 S Market Street |
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When: |
September 10, 2024 |
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Panel discussion begins at 5:00 p.m. PT. in Regency Ballroom B |
At the AI Hardware & Edge AI Summit this week, come listen to Dr. Steven Woo, fellow and distinguished inventor at Rambus, moderate a panel discussion on “Striking a Balance Between Memory, Storage and Compute Requirements in Systems for Efficient Performance,” along with executives and experts from Intel, Meta, and Samsung Electronics.
The panel will dive into critical topics including:
- The growing complexity of AI workloads
- The evolution of AI systems to address growing performance demands
- Emerging power and thermal concerns impacting AI
- Getting around the AI memory bottleneck
- Emerging technologies that can help solve memory challenges
- How compute could look like in the near future
To learn more about the expert panel discussion hosted by Rambus at AI Hardware & Edge AI Summit, visit https://www.rambus.com/event/ai-hardware-edge-ai-summit or come see us at Booth #31 in the Ecosystem Pavilion. For more details on our latest Rambus memory interface chips, high-performance interface IP, as well as security IP solutions, visit rambus.com.
Follow Rambus:
Company website: rambus.com
Rambus blog: rambus.com/blog
X/Twitter: @rambusinc
LinkedIn: www.linkedin.com/company/rambus
Facebook: www.facebook.com/RambusInc
About Rambus Inc.
Rambus is a provider of industry-leading chips and silicon IP making data faster and safer. With over 30 years of advanced semiconductor experience, we are a pioneer in high-performance memory solutions that solve the bottleneck between memory and processing for data-intensive systems. Whether in the cloud, at the edge or in your hand, real-time and immersive applications depend on data throughput and integrity. Rambus products and innovations deliver the increased bandwidth, capacity and security required to meet the world’s data needs and drive ever-greater end-user experiences. For more information, visit rambus.com.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240909920221/en/
Cori Pasinetti
Rambus Corporate Communications
t: (650) 309-6226
cpasinetti@rambus.com
Source: Rambus Inc.
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