VSMC Celebrates Breaking Ground on 300mm Fab in Singapore
VisionPower Semiconductor Manufacturing Company (VSMC), a joint venture between Vanguard International Semiconductor and NXP Semiconductors, celebrated breaking ground on their new 300mm wafer manufacturing facility in Tampines, Singapore. The facility is expected to begin initial production in 2027, reaching an output of 55,000 300mm wafers per month by 2029.
The $7.8 billion project will create approximately 1,500 jobs and feature advanced automation including an Automated Material Handling System and AI-driven quality management. The fab will be built following Singapore Green Mark standards, incorporating energy-efficient systems, water recycling, and eco-friendly materials.
The joint venture, officially established in September 2024, aims to strengthen Singapore's position in the global semiconductor supply chain while providing specialty IC foundry services. The facility's design emphasizes both technological innovation and environmental sustainability, with potential for a second phase pending future business development.
VisionPower Semiconductor Manufacturing Company (VSMC), una joint venture tra Vanguard International Semiconductor e NXP Semiconductors, ha celebrato l'inizio dei lavori per il nuovo impianto di produzione di wafer da 300 mm a Tampines, Singapore. Si prevede che l'impianto inizi la produzione iniziale nel 2027, raggiungendo una produzione di 55.000 wafer da 300 mm al mese entro il 2029.
Il progetto da 7,8 miliardi di dollari creerà circa 1.500 posti di lavoro e presenterà un'automazione avanzata, tra cui un sistema di movimentazione automatica dei materiali e una gestione della qualità basata sull'intelligenza artificiale. La fabbrica sarà costruita seguendo gli standard Singapore Green Mark, incorporando sistemi ad alta efficienza energetica, riciclo dell'acqua e materiali ecocompatibili.
La joint venture, ufficialmente istituita nel settembre 2024, punta a rafforzare la posizione di Singapore nella catena di approvvigionamento globale dei semiconduttori, fornendo al contempo servizi specializzati di fonderia IC. Il design dell'impianto enfatizza sia l'innovazione tecnologica sia la sostenibilità ambientale, con la possibilità di una seconda fase in attesa di futuri sviluppi commerciali.
VisionPower Semiconductor Manufacturing Company (VSMC), una empresa conjunta entre Vanguard International Semiconductor y NXP Semiconductors, celebró el inicio de la construcción de su nueva instalación de fabricación de obleas de 300 mm en Tampines, Singapur. Se espera que la instalación comience la producción inicial en 2027, alcanzando una producción de 55,000 obleas de 300 mm al mes para 2029.
El proyecto de 7.8 mil millones de dólares creará aproximadamente 1,500 empleos y contará con una automatización avanzada, incluyendo un Sistema Automatizado de Manejo de Materiales y gestión de calidad impulsada por inteligencia artificial. La fábrica se construirá siguiendo los estándares Singapore Green Mark, incorporando sistemas energéticamente eficientes, reciclaje de agua y materiales ecológicos.
La empresa conjunta, establecida oficialmente en septiembre de 2024, tiene como objetivo fortalecer la posición de Singapur en la cadena de suministro global de semiconductores, al tiempo que proporciona servicios de fundición de IC especializados. El diseño de la instalación enfatiza tanto la innovación tecnológica como la sostenibilidad medioambiental, con potencial para una segunda fase en función del desarrollo empresarial futuro.
비전파워 반도체 제조 회사 (VSMC), 반도체 전문 기업인 반가드 인터내셔널 세미컨덕터와 NXP 반도체의 합작 투자로, 싱가포르 탐피네스에 새로운 300mm 웨이퍼 제조 시설의 착공식을 가졌습니다. 이 시설은 2027년에 초기 생산을 시작할 것으로 예상되며, 2029년까지 매월 55,000개의 300mm 웨이퍼 생산에 도달할 계획입니다.
78억 달러 규모의 이 프로젝트는 약 1,500개의 일자리를 창출할 것이며, 자동화 물류 시스템 및 인공지능 기반 품질 관리 등의 첨단 자동화를 특징으로 합니다. 이 팹은 싱가포르 그린 마크 기준에 따라 건설되며, 에너지 효율적인 시스템, 물 재활용 및 환경 친화적인 재료를 포함합니다.
2024년 9월에 공식적으로 설립된 이 합작 투자는 싱가포르의 글로벌 반도체 공급망에서의 입지를 강화하고, 특수 IC 파운드리 서비스를 제공하는 것을 목표로 하고 있습니다. 시설의 설계는 기술 혁신과 환경 지속 가능성을 모두 강조하며, 향후 사업 개발에 따라 두 번째 단계의 가능성이 있습니다.
VisionPower Semiconductor Manufacturing Company (VSMC), un partenariat entre Vanguard International Semiconductor et NXP Semiconductors, a célébré le lancement de la construction de sa nouvelle usine de fabrication de wafers de 300 mm à Tampines, Singapour. L'usine devrait commencer une production initiale en 2027, atteignant une production de 55 000 wafers de 300 mm par mois d'ici 2029.
Ce projet de 7,8 milliards de dollars créera environ 1 500 emplois et présentera une automatisation avancée, y compris un système de manutention automatisée et une gestion de la qualité basée sur l'intelligence artificielle. L'usine sera construite selon les normes Singapore Green Mark, intégrant des systèmes écoénergétiques, le recyclage de l'eau et des matériaux respectueux de l'environnement.
Le partenariat, officiellement établi en septembre 2024, vise à renforcer la position de Singapour dans la chaîne d'approvisionnement mondiale des semi-conducteurs, tout en fournissant des services de fonderie IC spécialisés. Le design de l'usine met l'accent sur l'innovation technologique et la durabilité environnementale, avec un potentiel pour une deuxième phase en fonction du développement commercial futur.
VisionPower Semiconductor Manufacturing Company (VSMC), ein Joint Venture zwischen Vanguard International Semiconductor und NXP Semiconductors, feierte den Baustart ihrer neuen 300-mm-Wafer-Fertigungseinrichtung in Tampines, Singapur. Die Einrichtung soll 2027 mit der Erstproduktion beginnen und bis 2029 eine Produktion von 55.000 300-mm-Wafern pro Monat erreichen.
Das 7,8-Milliarden-Dollar-Projekt wird etwa 1.500 Arbeitsplätze schaffen und mit fortschrittlicher Automatisierung, darunter ein automatisiertes Materialhandhabungssystem und eine KI-gestützte Qualitätsmanagement, ausgestattet sein. Die Fabrik wird nach den Singapore Green Mark-Standards gebaut und energieeffiziente Systeme, Wasserrecycling und umweltfreundliche Materialien integrieren.
Das Joint Venture, das offiziell im September 2024 gegründet wurde, zielt darauf ab, Singapurs Position in der globalen Halbleiterversorgungskette zu stärken und gleichzeitig spezialisierte IC-Fab-Dienstleistungen anzubieten. Das Design der Anlage legt sowohl Wert auf technologische Innovation als auch auf Umweltfreundlichkeit, mit der Möglichkeit einer zweiten Phase, die von zukünftigen Geschäftsentwicklungen abhängt.
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Initial production slated for 2027, expected output of 55,000 300mm wafers per month in 2029
SINGAPORE, Dec. 04, 2024 (GLOBE NEWSWIRE) -- VisionPower Semiconductor Manufacturing Company Pte Ltd (VSMC), the joint venture formed in September, 2024 by Vanguard International Semiconductor Corporation (VIS, TPEx 5347) and NXP Semiconductors N.V. (NXP, NASDAQ: NXPI) today celebrated breaking ground at the site of the joint venture’s new 300mm wafer manufacturing facility in Tampines, Singapore.
The groundbreaking ceremony was attended by customers, suppliers, partners, association representatives, residents, and government officials. Executives from VSMC, VIS and NXP were also present to commemorate the start of construction on the new facility, which is anticipated to begin initial production in 2027. VSMC was also honored to have Dr. Tan See Leng, Minister for Manpower and Second Minister for Trade and Industry, participate in the ceremony.
“Singapore is renowned not only as Asia’s economic hub but also as a beacon of technological innovation. We are proud to announce the groundbreaking of our first 12-inch fab in Singapore, which will uphold the company’s core business philosophy, provide specialty IC foundry services, and lay the foundation for our future development. This fab will advance the semiconductor industry and bolster the local high-tech sector,” said VSMC and VIS Chairman Leuh Fang. “Designed with modern technology and guided by green manufacturing principles, the fab reflects our firm commitment to the future. VSMC is dedicated to being a responsible corporate citizen, supporting economic growth while ensuring environmental sustainability.”
“I’m humbled and excited to see construction of VSMC’s 300mm fab moving forward very swiftly,” said NXP President and CEO Kurt Sievers. “NXP has enjoyed decades of successful semiconductor manufacturing operations in Singapore, and the new VSMC fab is entirely aligned with our differentiated hybrid manufacturing strategy. This new fab will support NXP’s growth plans with supply control and geographic resilience at competitive cost.”
“We welcome the decision by VIS and NXP to jointly establish VSMC and its greenfield 12-inch wafer fab in Singapore. This is testament to Singapore’s attractiveness to global companies to site advanced manufacturing activities, and reinforces Singapore’s position as a critical global node in the semiconductor supply chain. The new fab will not only create about 1,500 good jobs, it will also facilitate business and partnership opportunities for local enterprises,” said Ms Cindy Koh, Executive Vice President, Singapore Economic Development Board. “Singapore will continue to invest in talent development, R&D, and decarbonization solutions to enhance our competitiveness and strengthen Singapore’s semiconductor ecosystem.”
Construction of the VSMC fab is on-track, with initial production slated to begin in 2027. Upon the successful ramp of the initial phase, a second phase will be considered and developed pending future business development by VIS and NXP. With an expected output of 55,000 300mm wafers per month in 2029, the joint venture will create approximately 1,500 jobs while contributing to the development of the upstream and downstream supply chains, contributing to Singapore and the global semiconductor ecosystem.
The fab will adopt a fully automated production model, integrating an Automated Material Handling System (AMHS) and comprehensive quality management through Artificial Intelligence applications. This will achieve fast, precise, high-yield, and high-quality manufacturing excellence, providing customers with competitive services and creating a smart fab in Singapore.
Addressing the company’s commitment to sustainability stewardship, the fab will be constructed in accordance with Singapore Green Mark standards and will incorporate rigorous green manufacturing measures. To help minimize environmental impact, the site will feature energy-efficient cooling and lighting systems, high degree of process water recycling, and the use of eco-friendly materials. In addition, several green office design principles will be integrated, such as ample natural light, abundant communal spaces, and lush greenery to foster and contribute to a culture of wellness.
On June 5, VIS and NXP announced plans to establish the VSMC joint venture in Singapore to build a 300mm wafer fab with a total investment of approximately
About VIS
Vanguard International Semiconductor Corporation (VIS) is a leading specialty IC foundry service provider. Since its inception in 1994 in Hsinchu Science Park, Taiwan, VIS has been achieving continuous success in its technology development and production efficiency improvement. VIS has also been consistently offering its customers cost-effective solutions and high value-added services. VIS has five 8-inch fabs in Taiwan and Singapore with a monthly capacity of about 282,000 wafers in 2024. VIS has a total of over 6,000 employees. We are committed to adhering to our customer-oriented business philosophy to provide customers continuously improved and enhanced specialty IC foundry services. To better serve our worldwide customers, VIS has established sales offices in Taiwan and sales representatives in main IC clusters around the world.
About NXP Semiconductors
NXP Semiconductors N.V. is the trusted partner for innovative solutions in the automotive, industrial & IoT, mobile, and communications infrastructure markets. NXP's "Brighter Together" approach combines leading-edge technology with pioneering people to develop system solutions that make the connected world better, safer, and more secure. The company has operations in more than 30 countries and posted revenue of
For further information, please contact:
| VIS Spokesperson: | VIS Public Relations: |
| Amanda Huang | Hui-Chung Su |
| Vice President & CFO | hcsuc@vis.com.tw |
| pr@vis.com.tw | 886-3-5770355 #1901 |
| 886-3-5770355 | |
| NXP Investor Relations: | NXP Public Relations: |
| Jeff Palmer - Global | Paige Iven – Americas and EU |
| jeff.palmer@nxp.com | paige.iven@nxp.com |
| +1 408 205 0687 | +1 817 975 0602 |
| Jenny YC Chen – Asia Pacific | |
| jenny.yc.chen@nxp.com | |
NXP-CORP
A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/cc4291a3-022b-4f09-8e09-e15357e5b15b
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