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NXP Semiconductors N.V. (NASDAQ: NXPI) is a global leader in secure connectivity solutions, driving innovation across various industries. With expertise in high-performance mixed-signal electronics, NXP provides solutions for the automotive, industrial, Internet of Things (IoT), mobile, and communication infrastructure markets. The company is recognized for its significant market share in the automotive sector, supplying microcontrollers and analog chips for automotive clusters, powertrains, infotainment systems, and radars.
Founded in 2006 and headquartered in Eindhoven, Netherlands, NXP operates in over 30 countries with approximately 34,200 employees. In 2023, NXP posted impressive revenue of $13.28 billion, demonstrating strong financial performance and resilience in a challenging semiconductor market environment.
In 2015, NXP acquired Freescale Semiconductor, bolstering its market position and expanding its product portfolio. The company focuses on four mega trends driving the electronics industry: energy efficiency, connected devices, security, and health. These trends influence NXP’s development of cutting-edge technologies for connected cars, secure devices, portable and wearable electronics, and IoT applications.
Recent achievements include the unveiling of the first ion-trap-based quantum computer demonstrator made entirely in Germany, through a partnership with eleQtron and ParityQC as part of the DLR Quantum Computing Initiative. This technology aims to tackle complex problems in climate modeling, global logistics, and materials sciences.
NXP also collaborates with ZF Friedrichshafen AG on next-generation SiC-based traction inverter solutions for electric vehicles (EVs), enhancing EV performance and sustainability. These solutions leverage NXP’s advanced GD316x high-voltage isolated gate drivers, designed to extend EV range and reduce charging stops.
Furthermore, NXP announced a joint venture with Vanguard International Semiconductor Corporation to build a new 300mm semiconductor wafer manufacturing facility in Singapore. This facility will support automotive, industrial, consumer, and mobile markets, increasing production capacity and creating approximately 1,500 jobs by 2027.
Beyond financial success, NXP is committed to sustainability, digital sovereignty, and innovation. The company operates with a hybrid manufacturing strategy to ensure competitive cost, supply control, and geographic resilience. NXP’s ongoing investments and collaborations continue to solidify its position as a key player in the global semiconductor industry.
NXP Semiconductors has introduced the industry's first Ultra-Wideband (UWB) wireless battery management system (BMS) solution for electric vehicles. This innovative technology eliminates the need for complex wiring in battery packs, simplifying EV assembly and enabling increased battery energy density. The UWB BMS provides higher resistance to reflections and frequency selective fading compared to narrow-band technologies, ensuring more reliable data transfer within battery packs.
The solution, part of NXP's FlexCom chipset, supports both wired and wireless BMS configurations using common software architecture. Available for OEM evaluation in Q2 2025, it helps decouple mechanical and electrical development, offering manufacturers increased flexibility and faster time to market while reducing development costs.
NXP Semiconductors announced the i.MX 94 family of applications processors, designed for industrial control, PLCs, telematics, and automotive gateways. The processors feature an integrated 2.5 Gbps Ethernet TSN switch, post-quantum cryptography, and eIQ Neutron Neural Processing Unit. The multi-core design includes up to four Arm Cortex-A55 cores, two Cortex-M33 cores, and two Cortex-M7 cores, supporting various industrial protocols and delivering 0.5 TOPS of machine learning performance. The family supports IEC61508 SIL2 and ISO26262 ASIL-B compliance, with sampling expected to begin in Q1 2025.
NXP Semiconductors (NXPI) reported Q3 2024 revenue of $3.25 billion, down 5% year-over-year but in line with guidance. The company achieved a GAAP gross margin of 57.4% and diluted EPS of $2.79. While experiencing strength in Communication Infrastructure, Mobile, and Automotive markets, the company faced weakness in Industrial & IoT. Q4 guidance reflects broader macro weakness, particularly in Europe and Americas. The company generated $779 million in operating cash flow and returned $564 million to shareholders through dividends and share repurchases.
NXP Semiconductors announced that Audi is implementing its Trimension NCJ29Dx Ultra-Wideband (UWB) technology in their new Premium Platform Electric (PPE) vehicles. The technology enables precise, hands-free secure car access functionality through smart mobile devices. Audi Q6 e-tron, featuring NXP's UWB devices, will launch in 2024.
The system uses fine-ranging capabilities to accurately identify driver location relative to the vehicle, enabling secure door unlocking only when the driver is nearby. Drivers can unlock and start their cars hands-free using a digital key on UWB-enabled mobile phones or wearables. The technology complies with IEEE 802.15.4, CCC, and FiRa standards, offering enhanced protection against relay attacks and supporting various cryptographic operations.
NXP Semiconductors has unveiled the S32J family of high-performance Ethernet switches and network controllers, designed to address the complex networking challenges of software-defined vehicles (SDVs). These devices, part of the NXP CoreRide platform, share a common switch core (NETC) with NXP's S32 microcontrollers and processors, enabling seamless integration and software reuse.
Key features of the S32J family include:
- 80Gbps bandwidth with ports ranging from 10Mb to 10Gb
- Dual Arm® Cortex®-R52 cores
- Time-sensitive networking (TSN) compliance
- ASIL-D safety and hardware security engine (HSE)
- MACsec ports for mixed-critical data traffic
The S32J family, combined with the CoreRide platform, offers production-grade networking solutions with pre-integrated software and tooling. A virtual development kit will be available by the end of 2024, with the solution becoming available to OEMs and Tier-1 suppliers in 2025.
NXP Semiconductors (NASDAQ: NXPI) has announced its schedule for releasing third quarter 2024 financial results. The company will disclose these results after the NASDAQ Global Select Market closes on Monday, November 4, 2024. Following this, NXP will host a conference call with the financial community on Tuesday, November 5, 2024, at 8:00 a.m. EST. Interested parties can pre-register for the webcast or obtain an access code to join the live conference call. Additionally, a replay of the call will be made available via webcast for on-demand listening shortly after the call concludes.
NXP Semiconductors has unveiled the Trimension SR250, the industry's first single-chip solution integrating on-chip processing with short-range UWB radar and secure ranging. This innovative product enables new user experiences in autonomous homes and Industrial IoT applications, focusing on location, presence, and motion detection. The SR250 combines low-power short-range UWB radar (6-8.5 GHz), secure ranging, and angle-of-arrival calculations to support various use cases in smart homes and industrial environments.
Key features include 3D AoA, TDOA, and ToF readings accurate to within ±5 cm. The chip can be paired with the EdgeLock SE051W secure element for enhanced security. Developed based on FiRa Consortium 3.0 specifications, it ensures interoperability and simplifies certification. The SR250 is supported by firmware, middleware, and sample applications to streamline development and deployment.
VIS and NXP have officially established the VisionPower Semiconductor Manufacturing Company (VSMC) joint venture in Singapore, following regulatory approvals. The venture will construct a 300mm wafer manufacturing facility with a total investment of $7.8 billion. Construction is set to begin in the second half of 2024, with initial production starting in 2027.
The fab will support 130nm to 40nm mixed-signal, power management, and analog products for automotive, industrial, consumer, and mobile markets. TSMC will provide technology licensing and transfer. By 2029, the facility aims to produce 55,000 300mm wafers per month and create 1,500 jobs, contributing to Singapore's and the global semiconductor ecosystem.
NXP Semiconductors (NASDAQ: NXPI) has announced two significant capital return initiatives. Firstly, the board approved an interim dividend of $1.014 per ordinary share for Q3 2024, payable on October 9, 2024, to shareholders of record as of September 12, 2024. Secondly, the board authorized an additional $2 billion for share repurchases, supplementing the existing $726 million remaining from the previous authorization.
These actions reflect NXP's strong capital structure and the board's confidence in the company's long-term growth and cash flow generation. The dividend will be subject to a 15% Dutch withholding tax, with potential reductions or refunds available for certain shareholders. NXP, a leader in innovative solutions for automotive, industrial & IoT, mobile, and communications infrastructure markets, reported revenue of $13.28 billion in 2023.
NXP Semiconductors (NASDAQ: NXPI) has announced its upcoming 2024 Investor Day, scheduled for November 7, 2024, from 8:00am to 12:30pm EST. The event will be held at the Four Seasons Hotel in Boston and will also be available virtually. It will feature presentations and Q&A sessions with NXP's senior leadership team, followed by a buffet lunch.
Institutional investors and equity analysts can attend in-person by pre-registering on the event website. Virtual attendees can also pre-register through a separate link. The event will be simulcast with audio and video broadcast, and a replay will be accessible on NXP's Investor Relations website for 12 months after the event.
NXP Semiconductors, a leader in innovative solutions for automotive, industrial & IoT, mobile, and communications infrastructure markets, posted revenue of $13.28 billion in 2023.
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