Marvell Introduces 1.6 Tbps LPO Chipset to Enable Optical Short-reach, Scale-up Compute Fabric Interconnects
Marvell Technology (NASDAQ: MRVL) has announced the general availability of a new 200G per lane optimized transimpedance amplifier (TIA) and laser driver chipset, enabling 800 Gbps and 1.6 Tbps linear-drive pluggable optics (LPO). The chipset addresses next-generation short-reach, scale-up compute fabric connectivity requirements, overcoming the limitations of passive, direct-attached copper (DAC) cable interconnects.
The solution is specifically designed for AI-driven data centers that require higher-bandwidth interconnects, particularly in compute fabric networks connecting XPUs within and across racks. The LPO chipset features adjustable equalization to compensate for channel loss, best-in-class linearity, and improved module performance margin while reducing design complexity, power consumption, and TCO.
Marvell Technology (NASDAQ: MRVL) ha annunciato la disponibilità generale di un nuovo chipset ottimizzato per amplificatori transimpedenza (TIA) da 200G per linea e driver laser, consentendo ottiche pluggable a 800 Gbps e 1.6 Tbps linear-drive (LPO). Questo chipset affronta i requisiti di connettività per tessuti di calcolo a corta distanza di prossima generazione, superando le limitazioni degli interconnessioni in cavo in rame diretto passivo (DAC).
La soluzione è specificamente progettata per i data center guidati da IA che richiedono interconnessioni ad alta larghezza di banda, in particolare nelle reti di tessuti di calcolo che collegano gli XPUs all'interno e tra i rack. Il chipset LPO presenta un'equalizzazione regolabile per compensare la perdita di canale, linearità da primato e un migliore margine di prestazioni del modulo, riducendo al contempo la complessità del design, il consumo energetico e il costo totale di proprietà (TCO).
Marvell Technology (NASDAQ: MRVL) ha anunciado la disponibilidad general de un nuevo chipset optimizado de amplificador de transimpedancia (TIA) de 200G por canal y controlador láser, que permite ópticas enchufables a 800 Gbps y 1.6 Tbps de accionamiento lineal (LPO). Este chipset aborda los requisitos de conectividad para tejidos de computación de corto alcance de próxima generación, superando las limitaciones de las interconexiones de cables de cobre pasivos conectados directamente (DAC).
La solución está diseñada específicamente para centros de datos impulsados por IA que requieren interconexiones de alta capacidad, en particular en redes de tejidos de computación que conectan XPUs dentro y entre racks. El chipset LPO cuenta con equalización ajustable para compensar la pérdida del canal, linealidad de clase mundial y un mejor margen de rendimiento del módulo, al tiempo que reduce la complejidad del diseño, el consumo de energía y el costo total de propiedad (TCO).
Marvell Technology (NASDAQ: MRVL)는 200G 채널 최적화 트랜스임피던스 증폭기(TIA) 및 레이저 드라이버 칩셋의 일반 가용성을 발표했으며, 이를 통해 800 Gbps 및 1.6 Tbps 선형 구동 플러그형 광학(LPO)을 가능하게 했습니다. 이 칩셋은 차세대 단거리 및 규모 확장 컴퓨팅 패브릭 연결 요구 사항을 해결하며, 수동 직접 연결 구리(DAC) 케이블 상호 연결의 한계를 극복합니다.
이 솔루션은 AI 기반 데이터 센터를 위해 특별히 설계되어 높은 대역폭의 상호 연결이 필요한 경우를 고려하며, 특히 랙 내 및 랙 간 XPUs를 연결하는 컴퓨팅 패브릭 네트워크에서 필요로 합니다. LPO 칩셋은 채널 손실을 보전하기 위한 조정 가능한 균형 조정을 특징으로 하며, 세계적인 수준의 선형성과 향상된 모듈 성능 여유를 제공하며, 설계 복잡성, 전력 소비 및 총 소유 비용(TCO)을 줄입니다.
Marvell Technology (NASDAQ: MRVL) a annoncé la disponibilité générale d'un nouveau chipset d'amplificateur de transimpédance (TIA) optimisé pour 200G par voie et d'un pilote laser, permettant des optique plugables à 800 Gbps et 1,6 Tbps au drive linéaire (LPO). Ce chipset répond aux exigences de connectivité pour des tissus de calcul de nouvelle génération à courte portée, surmontant les limitations des connexions en câble cuivre direct passif (DAC).
La solution est spécifiquement conçue pour les centres de données pilotés par l'IA nécessitant des connexions à large bande passante, en particulier dans les réseaux de tissus de calcul reliant les XPUs à l'intérieur et entre les racks. Le chipset LPO présente une égalisation réglable pour compenser les pertes de canal, une linéarité de premier ordre et une marge de performance améliorée du module tout en réduisant la complexité de conception, la consommation d'énergie et le coût total de possession (TCO).
Marvell Technology (NASDAQ: MRVL) hat die allgemeine Verfügbarkeit eines neuen, für 200G pro Kanal optimierten Transimpedanzverstärkers (TIA) und eines Laser-Treiber-Chipsatzes angekündigt, der 800 Gbps und 1,6 Tbps linear drive steckbare Optiken (LPO) ermöglicht. Der Chipsatz adressiert die Anforderungen an die Konnektivität von nächste Generation Kommunikationsfabriken mit kurzen Reichweiten und überwindet die Einschränkungen von passiven, direkt angeschlossenen Kupfer(DAC)-Kabelverbindungen.
Die Lösung ist speziell für KI-gesteuerte Datenzentren konzipiert, die Hochgeschwindigkeitsverbindungen benötigen, insbesondere in Computing-Netzwerken, die XPUs innerhalb und über Racks hinweg verbinden. Der LPO-Chipsatz bietet einstellbare Entzerrung zur Kompensation von Kanalverlusten, erstklassige Linearität und verbesserte Modul-Leistungsreserven, während er die Designkomplexität, den Energieverbrauch und die Gesamtbetriebskosten (TCO) senkt.
- Introduces new high-performance 1.6 Tbps LPO chipset addressing growing AI infrastructure demands
- Offers superior performance compared to traditional copper interconnects
- Reduces overall transceiver module design complexity and power consumption
- Improves total cost of ownership (TCO) for data center operations
- None.
Insights
The introduction of Marvell's 1.6 Tbps LPO chipset represents a significant technological leap in data center interconnect solutions. The chipset's ability to enable 800 Gbps and 1.6 Tbps linear-drive pluggable optics addresses a critical bottleneck in AI infrastructure. By overcoming the limitations of traditional DAC cables, this solution enables longer reach and higher bandwidth essential for scaling AI compute clusters.
The technology's optimization for short-reach, inside-the-rack connections is particularly noteworthy. The 200G per lane data rate and improved performance characteristics make it especially valuable for XPU interconnects in AI applications. The chipset's design focuses on reducing power consumption and total cost of ownership while maintaining high performance - important metrics for data center operators.
This product launch strengthens Marvell's competitive position in the rapidly growing AI infrastructure market. With AI driving unprecedented demand for high-bandwidth interconnects, the timing is strategic. The expansion of their interconnect portfolio demonstrates Marvell's commitment to capturing market share in the evolving data center landscape.
The endorsement from 650 Group's co-founder validates the market need and Marvell's approach. By focusing on specific use cases and optimizing for AI cluster TCO, Marvell is well-positioned to capitalize on the growing demand for advanced interconnect solutions in cloud data centers. This could potentially drive significant revenue growth as AI infrastructure deployment accelerates.
Addresses the Speed and Reach Limitations of Passive, Direct-attached Copper (DAC) Cables
As artificial intelligence (AI) technologies advance, the demand for higher-bandwidth interconnects in data center networks is accelerating rapidly. This is particularly evident in compute fabric networks, which connect XPUs within and across racks. The next generation of XPU compute fabric networks will transition to data rates of 200 Gbps per lane, where passive DACs fall short of meeting speed and distance requirements.
To address this, cloud data centers will transition to a new type of interconnect that meets their specific requirements. Marvell introduced Alaska A for customers looking to extend copper capabilities using AECs, while others can leverage specialized LPO modules featuring the Marvell TIA and driver chipset. Designed for short and predictable host channels, these LPO modules enable longer reach, higher bandwidth and improved performance compared to copper interconnects.
"Marvell 1.6 Tbps LPO TIA and laser driver chipset is designed to address the growing demand for short-reach, high-bandwidth interconnect solutions, where passive copper cables are hitting a wall," said Xi Wang, vice president of product marketing for Optical Connectivity at Marvell. "As AI-driven data centers continue to scale, optimizing interconnect solutions across each layer of the network is becoming increasingly critical. The new LPO chipset complements and expands our industry-leading 1.6 Tbps connectivity portfolio, to address the growing spectrum of interconnects that cloud operators are seeking to optimize."
"LPO has been a technology in search of the right solution. By optimizing chipsets for short, inside-the-rack connections, Marvell brings clarity and focus to LPO, delivering it in a more compelling and scalable manner," said Alan Weckel, co-founder of 650 Group. "Marvell's innovative approach to achieving performance gains helps drive better AI cluster TCO and highlights the industry's direction in optimizing networking links."
The 1.6 Tbps LPO chipset, one of the latest additions to the Marvell interconnect portfolio, is optimized for specific use cases to help data centers maximize infrastructure utilization and performance while reducing overall cost and power per bit. This extensive portfolio spanning optical and copper interconnects includes Ara, the industry's first 3nm PAM4 interconnect platform; Aquila, the industry's first O-band-optimized coherent-lite DSP platform; Nova family of PAM4 DSPs featuring 200 Gbps electrical and optical interfaces; and Alaska A PAM4 DSP for active electrical cables.
LPO Chipset Key Features
- TIA provides best-in-class linearity, power and BER for AI applications.
- Laser driver to improve module performance margin while reducing overall transceiver module design complexity, power consumption, and TCO.
- TIA and laser driver chipset provide adjustable equalization to compensate for channel loss.
About Marvell
To deliver the data infrastructure technology that connects the world, we're building solutions on the most powerful foundation: our partnerships with our customers. Trusted by the world's leading technology companies for over 25 years, we move, store, process and secure the world's data with semiconductor solutions designed for our customers' current needs and future ambitions. Through a process of deep collaboration and transparency, we're ultimately changing the way tomorrow's enterprise, cloud, automotive, and carrier architectures transform—for the better.
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This press release contains forward-looking statements within the meaning of the federal securities laws that involve risks and uncertainties. Forward-looking statements include, without limitation, any statement that may predict, forecast, indicate or imply future events, results or achievements. Actual events, results or achievements may differ materially from those contemplated in this press release. Forward-looking statements are only predictions and are subject to risks, uncertainties and assumptions that are difficult to predict, including those described in the "Risk Factors" section of our Annual Reports on Form 10-K, Quarterly Reports on Form 10-Q and other documents filed by us from time to time with the SEC. Forward-looking statements speak only as of the date they are made. Readers are cautioned not to put undue reliance on forward-looking statements, and no person assumes any obligation to update or revise any such forward-looking statements, whether as a result of new information, future events or otherwise.
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Kim Markle
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