Mitsubishi Electric to Launch “SLIMDIP-Z” Power Semiconductor Module

Rhea-AI Summary

Mitsubishi Electric Corporation (Tokyo:6503) has announced the release of its new SLIMDIP-Z power semiconductor module, featuring a high-rated current of 30A, set for February 2023. This compact module aims to simplify and downsize inverter systems in home appliances, thereby enhancing energy efficiency and addressing the growing demand for power semiconductors. Key features of the module include an optimized frame design and reduced thermal resistance, improving thermal management and performance for applications in air conditioners and refrigerators.

Positive

• Launch of SLIMDIP-Z, enhancing product offerings.
• 30A rated current allows for smaller, simpler inverter systems.
• Improved thermal management potentially boosts energy efficiency.

Negative

• None.

High rated current of 30A will help to simplify and downsize inverter systems in appliances

TOKYO--(BUSINESS WIRE)-- Mitsubishi Electric Corporation (TOKYO:6503) announced today that its new SLIMDIP-Z power semiconductor module, featuring an extra-high 30A rated current for use in inverter systems of home appliances, will be released in February 2023. The compact module will enable the SLIMDIP^TM series to meet a wider range of power and size needs for inverter units, specifically by simplifying and downsizing systems for multifunctional and sophisticated products such as air conditioners, washing machines and refrigerators.

The demand is growing for power semiconductors capable of efficiently converting electric power to help realize a low-carbon world. In 1997, Mitsubishi Electric commercialized its first DIPIPM^TM as a high-performance intelligent power module with a transfer-mold structure incorporating a switching device and a control IC to drive and protect the switching element. Since then, DIPIPMs have been widely adapted for use in large appliances and inverters for industrial motors, contributing to the downsizing and energy-efficiency of inverter boards.

Product Features

1) Extra-high 30A rated current will enable simpler, smaller inverter systems for appliances

• Optimized frame shape expands Reverse Conducting IGBT (RC-IGBT) chip’s mounting area.
• Insulation sheet reduces thermal resistance between chip junction and case by about 40% compared to existing SLIMDIP-L, which allowed the rated current to be increased to 30A.
• RC-IGBT temperature suppression will help to simplify and downsize the thermal designs of inverter systems.

For the full text, please visit: www.MitsubishiElectric.com/news/

View source version on businesswire.com: https://www.businesswire.com/news/home/20221212005269/en/

Customer Inquiries

Power Device Overseas Marketing Dept.A and Dept.B

Mitsubishi Electric Corporation

www.MitsubishiElectric.com/semiconductors/

Media Inquiries

Takeyoshi Komatsu

Public Relations Division

Mitsubishi Electric Corporation

Tel: +81-3-3218-2346

prd.gnews@nk.MitsubishiElectric.co.jp

www.MitsubishiElectric.com/news/

Source: Mitsubishi Electric Corporation

FAQ

What is the significance of Mitsubishi Electric's new SLIMDIP-Z module release in February 2023?

The SLIMDIP-Z module enhances inverter systems in home appliances with a high-rated current of 30A, allowing for smaller and more efficient designs.

How does the new SLIMDIP-Z module impact energy efficiency in appliances?

The module's design improves thermal resistance and simplifies inverter systems, potentially leading to greater energy efficiency in appliances.

What applications will benefit from the SLIMDIP-Z power semiconductor module?

Applications like air conditioners, washing machines, and refrigerators will benefit from the SLIMDIP-Z module's enhanced performance.

What features make the SLIMDIP-Z module unique compared to previous models?

The SLIMDIP-Z features an optimized frame design and improved thermal resistance, allowing it to support a higher rated current of 30A.