Mitsubishi Electric to Launch “SLIMDIP-Z” Power Semiconductor Module
High rated current of 30A will help to simplify and downsize inverter systems in appliances
The demand is growing for power semiconductors capable of efficiently converting electric power to help realize a low-carbon world. In 1997,
Product Features
1) Extra-high 30A rated current will enable simpler, smaller inverter systems for appliances
- Optimized frame shape expands Reverse Conducting IGBT (RC-IGBT) chip’s mounting area.
-
Insulation sheet reduces thermal resistance between chip junction and case by about
40% compared to existing SLIMDIP-L, which allowed the rated current to be increased to 30A. - RC-IGBT temperature suppression will help to simplify and downsize the thermal designs of inverter systems.
For the full text, please visit: www.MitsubishiElectric.com/news/
View source version on businesswire.com: https://www.businesswire.com/news/home/20221212005269/en/
Customer Inquiries
www.MitsubishiElectric.com/semiconductors/
Media Inquiries
Public Relations Division
Tel: +81-3-3218-2346
prd.gnews@nk.MitsubishiElectric.co.jp
www.MitsubishiElectric.com/news/
Source: