Lattice Expands mVision Solution Stack with New Image Processing and Bridging Capabilities
Lattice Semiconductor (NASDAQ: LSCC) has updated its Lattice mVision™ Solution Stack, enhancing capabilities for flexible interface bridging and improving image signal processing (ISP) for embedded vision applications. The latest mVision Solution Stack (v 3.0) supports new bridging formats, including SLVS-EC to MIPI and MIPI to PCIe. Additionally, new development platforms for Lattice CertusPro™-NX FPGAs, including the CertusPro-NX Versa Board, are set for release in the first half of 2022. These advancements target markets such as robotics, ADAS, and video surveillance.
- Introduction of mVision Solution Stack (v 3.0) improving ISP performance.
- Expanded interface bridging capabilities support for new formats.
- New development platforms will accelerate low-power embedded vision applications.
- None.
The latest release of the Lattice mVision Solution Stack (v 3.0) provides increased interface bridging support for higher precision, better accuracy, and improved flexibility across a broader range of Embedded Vision applications. Highlights of the latest release include:
- SLVS-EC to MIPI bridging
- MIPI CSI-2 to LVDS bridging with expanded support for RAW14
- SubLVDS to MIPI CSI-2 bridging with expanded support for RAW14
- MIPI to PCIe Bridging
The new development platforms supporting Lattice CertusPro™-NX FPGAs for the latest Embedded Vision applications include the CertusPro-NX Versa Board and Trenz TEL003 PCIe board. They are expected to be available in 1H 2022.
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FAQ
What are the new features of the Lattice mVision Solution Stack released by LSCC?
When will the new development platforms for Lattice CertusPro-NX FPGAs be available?
How does the mVision Solution Stack benefit low power embedded vision applications?