Lam Research Introduces Advanced Dielectric Gapfill Technology to Enable Next-Generation Devices

Rhea-AI Summary

Lam Research Corp. (LRCX) has unveiled its advanced Striker® FE platform, designed for manufacturing high-aspect-ratio chip architectures. This innovative system employs the first-of-its-kind ICEFill™ technology, optimizing the gapfill process in 3D NAND, DRAM, and logic devices, addressing significant limitations in traditional methods. The solution aims to meet industry demands for cost and technology scaling, enhancing productivity through a quad station module architecture. Lam Research is a leading supplier in the semiconductor equipment sector, enabling advanced chip production.

Positive

• Launch of the Striker® FE platform with ICEFill™ technology enhances manufacturing capabilities for high-aspect-ratio chip architectures.
• ICEFill technology offers superior gapfill performance and film quality, essential for 3D NAND, DRAM, and logic devices.
• The product aims to address inefficiencies of traditional gapfill methods, ensuring customer satisfaction and industry relevance.

Negative

• None.

FREMONT, Calif., Sept. 21, 2020 (GLOBE NEWSWIRE) -- Lam Research Corp. (Nasdaq: LRCX) today announced the advanced Striker® FE platform, a new processing solution for manufacturing high-aspect-ratio chip architectures. Striker FE utilizes an innovative, first of its kind ICEFill™ technology for filling extreme structures in 3D NAND, DRAM, and logic devices at emerging nodes. This system delivers the continued cost and technology scaling that is required to meet the semiconductor industry roadmap.

Traditional methods of gapfill for semiconductor manufacturing include legacy chemical vapor deposition, diffusion/furnace, and spin-on processes. These techniques are no longer viable for today’s 3D NAND requirements, as they are limited by the tradeoffs between quality, shrinkage, and gapfill voids. In contrast, Lam’s Striker ICEFill harnesses a proprietary surface modification technique to achieve highly preferential bottom-up and void-free gapfill while retaining the film quality inherent to atomic layer deposition (ALD). The ICEFill technology removes the existing limitations for filling high-aspect-ratio features which are especially prevalent in 3D NAND devices, as well as prevents collapse issues in DRAM and logic devices.

“Our goal is to provide customers with the most enabling ALD technology,” said Sesha Varadarajan, senior vice president and general manager of the Deposition product group at Lam Research. “This technology combines the ability to produce high quality oxide films with superior gapfill performance, in a single processing system with the productivity advantages offered by our industry leading quad station module architecture.”

The Striker FE platform with ICEFill technology is part of the Striker ALD product family. For more information about the Striker product family visit the product page.

About Lam Research
Lam Research Corporation is a global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. As a trusted, collaborative partner to the world’s leading semiconductor companies, we combine superior systems engineering capability, technology leadership, and unwavering commitment to customer success to accelerate innovation through enhanced device performance. In fact, today, nearly every advanced chip is built with Lam technology. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, Calif., with operations around the globe. Learn more at www.lamresearch.com.  (LRCX-P)

Caution Regarding Forward-Looking Statements
Statements made in this press release that are not of historical fact are forward-looking statements and are subject to the safe harbor provisions created by the Private Securities Litigation Reform Act of 1995. Such forward-looking statements relate to, but are not limited to: the performance of the tools we sell or service and the productivity advantages of Lam equipment. These statements are based on current expectations and are subject to risks, uncertainties, and changes in condition, significance, value and effect including those risks and uncertainties that are described in the documents filed or furnished by us with the Securities and Exchange Commission, including specifically the Risk Factors described in our annual report on Form 10-K for the fiscal year ended June 28, 2020. These uncertainties and changes could materially affect the forward-looking statements and cause actual results to vary from expectations in a material way. The Company undertakes no obligation to update the information or statements made in this release.

Company Contacts:
Libra White
Media Relations
(510) 572-7725
publicrelations@lamresearch.com

Ram Ganesh
Investor Relations
(510) 572-1615
investor.relations@lamresearch.com

FAQ

What is Lam Research's latest innovation related to LRCX stock?

Lam Research announced the Striker® FE platform, featuring ICEFill™ technology, designed for advanced semiconductor manufacturing.

How does the Striker FE platform improve semiconductor manufacturing?

The Striker FE platform provides superior gapfill performance and addresses limitations of traditional methods, important for 3D NAND and other devices.

What technology does the Striker FE platform utilize?

The Striker FE platform utilizes ICEFill™ technology, which enhances gapfill processes in high-aspect-ratio chip architectures.

When was the Striker® FE platform launched by Lam Research?

The Striker® FE platform was announced on September 21, 2020.

How does the ICEFill technology impact manufacturing cost for LRCX?

ICEFill technology aims to enhance cost efficiency and scalability in semiconductor manufacturing, essential for maintaining competitive advantage.