Lumentum Showcases Next-Generation InP Chip Solutions Enabling Scalable AI Data Centers at OFC 2025
Lumentum unveiled new advancements in indium phosphide (InP) photonic chip technologies at OFC 2025, targeting higher bandwidth and power-efficient connectivity for AI-driven data centers. The company showcased innovations enabling 400 Gbps-per-lane optical links and more efficient 200 Gbps-per-lane optical links.
Key demonstrations include:
- 448G EML technology demonstrating 448 Gbps data transmission using 224 GBaud PAM4
- 450G PAM4 DFB-MZI showing 450 Gbps transmission with superior chirp control
- 200 Gbps-per-lane differential drive EML operating at lower drive voltage
- Ultra-high power 1310 nm DFB lasers for co-packaged optics
Notably, Lumentum was selected as an NVIDIA silicon photonics ecosystem partner, with their ultra-high-power lasers integrated into NVIDIA's Spectrum-X Photonics and Quantum-X Photonics networking switches.
Lumentum ha svelato nuove innovazioni nelle tecnologie dei chip fotonici in fosfuro d'indio (InP) all'OFC 2025, mirando a una connettività ad alta larghezza di banda e a basso consumo energetico per i data center alimentati dall'AI. L'azienda ha presentato innovazioni che consentono collegamenti ottici da 400 Gbps per corsia e collegamenti ottici più efficienti da 200 Gbps per corsia.
Le dimostrazioni chiave includono:
- tecnologia EML da 448G che dimostra la trasmissione di dati a 448 Gbps utilizzando 224 GBaud PAM4
- 450G PAM4 DFB-MZI che mostra la trasmissione a 450 Gbps con un controllo del chirp superiore
- EML a guida differenziale da 200 Gbps per corsia che opera a una tensione di guida più bassa
- laser DFB ultra-alta potenza a 1310 nm per ottiche co-pacchettizzate
È importante notare che Lumentum è stata selezionata come partner dell'ecosistema di fotonica al silicio di NVIDIA, con i loro laser ultra-alta potenza integrati negli switch di rete Spectrum-X Photonics e Quantum-X Photonics di NVIDIA.
Lumentum presentó nuevos avances en tecnologías de chips fotónicos de fosfuro de indio (InP) en el OFC 2025, enfocándose en una conectividad de alta capacidad y eficiente en energía para centros de datos impulsados por IA. La compañía mostró innovaciones que permiten enlaces ópticos de 400 Gbps por carril y enlaces ópticos más eficientes de 200 Gbps por carril.
Las demostraciones clave incluyen:
- tecnología EML de 448G que demuestra la transmisión de datos a 448 Gbps utilizando 224 GBaud PAM4
- 450G PAM4 DFB-MZI mostrando transmisión de 450 Gbps con un control de chirp superior
- EML de conducción diferencial de 200 Gbps por carril operando a un voltaje de conducción más bajo
- láseres DFB de ultra alta potencia a 1310 nm para óptica empaquetada
Notablemente, Lumentum fue seleccionada como socio del ecosistema de fotónica de silicio de NVIDIA, con sus láseres de ultra alta potencia integrados en los switches de red Spectrum-X Photonics y Quantum-X Photonics de NVIDIA.
Lumentum는 OFC 2025에서 인듐 인화물(InP) 광자 칩 기술의 새로운 발전을 공개하며 AI 기반 데이터 센터를 위한 더 높은 대역폭과 에너지 효율적인 연결을 목표로 하고 있습니다. 이 회사는 레인당 400 Gbps 광 링크와 더 효율적인 레인당 200 Gbps 광 링크를 가능하게 하는 혁신을 선보였습니다.
주요 시연 내용은 다음과 같습니다:
- 224 GBaud PAM4를 사용하여 448 Gbps 데이터 전송을 시연하는 448G EML 기술
- 우수한 칩 제어로 450 Gbps 전송을 보여주는 450G PAM4 DFB-MZI
- 더 낮은 구동 전압에서 작동하는 레인당 200 Gbps 차동 구동 EML
- 공동 패키징된 광학을 위한 초고출력 1310 nm DFB 레이저
특히, Lumentum은 NVIDIA 실리콘 포토닉스 생태계 파트너로 선정되었으며, 그들의 초고출력 레이저는 NVIDIA의 Spectrum-X Photonics 및 Quantum-X Photonics 네트워킹 스위치에 통합되었습니다.
Lumentum a dévoilé de nouvelles avancées dans les technologies de puces photoniques en phosphure d'indium (InP) lors de l'OFC 2025, visant une connectivité à large bande et économe en énergie pour les centres de données alimentés par l'IA. L'entreprise a présenté des innovations permettant des liens optiques de 400 Gbps par voie et des liens optiques plus efficaces de 200 Gbps par voie.
Les démonstrations clés incluent:
- technologie EML 448G démontrant une transmission de données de 448 Gbps utilisant 224 GBaud PAM4
- 450G PAM4 DFB-MZI montrant une transmission de 450 Gbps avec un contrôle de chirp supérieur
- EML à entraînement différentiel de 200 Gbps par voie fonctionnant à une tension d'entraînement plus basse
- lasers DFB ultra-haute puissance à 1310 nm pour optiques co-emballées
Notamment, Lumentum a été sélectionné comme partenaire de l'écosystème de photonique au silicium de NVIDIA, avec leurs lasers ultra-haute puissance intégrés dans les commutateurs réseau Spectrum-X Photonics et Quantum-X Photonics de NVIDIA.
Lumentum hat auf der OFC 2025 neue Fortschritte in der Technologie von Indiumphosphid (InP) photonischen Chips vorgestellt, die auf höhere Bandbreite und energieeffiziente Konnektivität für KI-gesteuerte Rechenzentren abzielen. Das Unternehmen präsentierte Innovationen, die 400 Gbps pro Lane optische Verbindungen und effizientere 200 Gbps pro Lane optische Verbindungen ermöglichen.
Wichtige Demonstrationen umfassen:
- 448G EML-Technologie, die eine Datenübertragung von 448 Gbps mit 224 GBaud PAM4 demonstriert
- 450G PAM4 DFB-MZI, der eine Übertragung von 450 Gbps mit überlegener Chirp-Kontrolle zeigt
- 200 Gbps pro Lane differenzielle Antrieb EML, die bei niedrigerer Antriebsspannung arbeitet
- Ultra-hochleistungsfähige 1310 nm DFB-Laser für ko-paketierte Optik
Bemerkenswert ist, dass Lumentum als Partner des NVIDIA Silizium-Photonik-Ökosystems ausgewählt wurde, wobei ihre ultra-hochleistungsfähigen Laser in die Spectrum-X Photonics und Quantum-X Photonics Netzwerk-Switches von NVIDIA integriert sind.
- Selected as NVIDIA's silicon photonics ecosystem partner
- Successfully demonstrated 448 Gbps data transmission capability
- Achieved 450 Gbps PAM4 transmission with superior performance
- 200 Gbps-per-lane products already available for immediate delivery
- None.
Insights
Lumentum's latest InP photonic technology advancements represent a strategic positioning in the rapidly expanding AI data center market where optical link speeds are
The partnership with NVIDIA is particularly significant, with Lumentum's ultra-high-power lasers integrated into NVIDIA's new Spectrum-X Photonics and Quantum-X Photonics networking switches. This integration validates Lumentum's technology in the co-packaged optics (CPO) space, which addresses the critical power consumption bottleneck in AI data centers.
The company's dual focus on both 400 Gbps-per-lane future technology and immediate 200 Gbps-per-lane solutions shows a comprehensive approach to bandwidth scaling challenges. Their differential drive electro-absorption modulated laser (DD EML) technology specifically targets power efficiency—the primary constraint for AI compute growth.
This technological positioning aligns perfectly with AI infrastructure demands as data centers increasingly transition from electrical to optical interconnects to support larger compute clusters. Lumentum's InP portfolio developments directly address the two critical constraints in AI infrastructure scaling: bandwidth density and power efficiency.
Lumentum's advancements in InP chip technology represent a significant competitive advantage in the optical components space for AI infrastructure. The critical innovation here lies in addressing both bandwidth scaling (with 400G per lane technology) and power efficiency improvements (with differential drive technology and co-packaged optics solutions).
The NVIDIA partnership for their ultra-high power laser integration into Spectrum-X and Quantum-X networking switches positions Lumentum in the highest-growth segment of data center connectivity. As AI workloads drive exponential bandwidth requirements, NVIDIA's networking products face intense scrutiny on both performance and efficiency metrics—suggesting Lumentum's selection resulted from rigorous competitive evaluation.
The focus on co-packaged optics (CPO) is strategically important as this represents the industry's direction for overcoming electrical I/O limitations. By demonstrating proven high reliability from their experience in Raman amplification applications, Lumentum addresses a key concern for CPO adoption.
What separates Lumentum's approach from competitors is their comprehensive solution set spanning immediate needs (200G per lane) while showcasing tangible progress on future standards (400G per lane). The company appears to be establishing technology leadership at precisely the moment when optical connectivity becomes the critical enabler for AI infrastructure scaling, with a coherent product strategy targeting both current deployment cycles and future architecture evolution.
As AI workloads grow exponentially, optical link speeds in AI back-end networks are doubling approximately every two years — driving a critical need for innovation in leading-edge photonic technologies. At the same time, power availability and cooling requirements are placing increasing constraints on data centers, making energy efficiency more important than ever. Lumentum’s InP component technologies directly address both challenges by enabling power-efficient bandwidth scaling in photonic interconnects.
“Building on decades of InP expertise, Lumentum is driving industry technology leadership and volume production readiness for the future 400G per lane generation of optical interconnects, along with more efficient 200G per lane optical interconnects, to enable data center compute capacity scaling,” said Matt Sysak, Lumentum CTO of Cloud and Networking. “Lumentum InP technology is also enabling new co-packaged optics solutions to significantly reduce power consumption in AI data center networks, supporting larger AI installations and accelerating the transition from copper to photonic interconnects.”
Advancing 400 Gbps-per-Lane Laser Technology
Lumentum is demonstrating 400 Gbps-per-lane photonic technologies poised to enable the 3.2T generation of optical transceivers at OFC 2025 in live demonstrations and partner announcements, including:
- 448G EML: Lumentum will demonstrate 448 Gbps data transmission using a 224 GBaud PAM4 externally modulated laser (EML) technology in collaboration with Keysight Technologies and NTT Innovative Devices at booth #1301. Lumentum’s high-bandwidth InP EML will enable next generation power-efficient, high-speed optical interconnects for AI and cloud infrastructure.
- 450G PAM4 DFB-MZI: A live demonstration of Lumentum’s 450 Gbps PAM4 distributed feedback (DFB) laser with an integrated Mach-Zehnder (MZI) modulator will highlight another of Lumentum’s 400 Gbps-per-lane technologies. Also based on Lumentum’s high-speed InP photonic technology platform, the DFB-MZI provides superior chirp control, power efficiency, and reduced signal distortion, which are critical advantages for longer reach applications and complements Lumentum’s 400 Gbps-per-lane EML technology. See the demonstration at booth #2119.
High-Efficiency 200 Gbps-per-Lane Transmitter Technology
Lumentum today delivers best-in-class transmit and receive components designed to meet the demands of next-generation AI data centers. Transitioning from 100 Gbps to 200 Gbps lane speed enables data center bandwidth scaling to support accelerated AI workloads. Lumentum’s 200 Gbps-per-lane InP EMLs are available now.
To address power challenges in bandwidth scaling, Lumentum engineers presented a technical paper at OFC 2025 detailing results from Lumentum’s new 200 Gbps-per-lane differential drive electro-absorption modulated laser (DD EML). These lasers operate at a lower drive voltage, reducing power dissipation while offering excellent signal integrity and cross-talk immunity.
Complementing the 200G EMLs is Lumentum’s 200G Lens Integrated Photodiode (LIPD) which features high responsivity and wide bandwidth. The 200G LIPD integrates seamlessly with flip-chip bonding techniques.
Ultra-High-Power Lasers for Co-Packaged Optics
Lumentum’s breakthrough ultra-high power (UHP) 1310 nm DFB lasers are engineered for the demanding requirements of co-packaged optics (CPO) to support higher-density optical interconnects with enhanced power efficiency, reliability, and density. The UHP platform’s proven high reliability is rooted in Lumentum’s long-standing leadership in InP pump lasers for demanding Raman amplification applications.
Lumentum was recently selected as an NVIDIA silicon photonics ecosystem partner and Lumentum’s ultra-high-power, high-efficiency lasers are integrated into NVIDIA’s newly announced Spectrum-X Photonics and Quantum-X Photonics networking switches.
InP photonic technology is a critical enabler of AI data center compute capacity growth. Lumentum continues to innovate and be at the forefront of InP photonic technology and is collaborating closely with industry leaders to shape long-term technology roadmaps. By advancing next-generation InP photonic solutions, the company is enabling power-efficient bandwidth scaling in optical interconnects.
About Lumentum
Lumentum (NASDAQ: LITE) is a market-leading designer and manufacturer of innovative optical and photonic products enabling optical networking and laser applications worldwide. Lumentum optical components and subsystems are part of virtually every type of telecom, enterprise, and data center network. Lumentum lasers enable advanced manufacturing techniques and diverse applications, including next-generation 3D sensing capabilities. Lumentum is headquartered in
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Lumentum Contact Information:
Investors: Kathy Ta, 408-750-3853; investor.relations@lumentum.com
Media: Noël Bilodeau, 408-439-2140, media@lumentum.com
Source: Lumentum
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