indie Semiconductor Extends In-cabin User Experience Portfolio With Addition of Qi2 MPP-compliant Wireless Charging Solution
indie Semiconductor (Nasdaq: INDI) has unveiled the iND87204, a next-generation automotive wireless charging system-on-chip (SoC) compliant with the Qi 2.0 standard and supporting the new Magnetic Power Profile (MPP) feature. This Qi2-compliant solution delivers up to 15 watts of power and integrates multiple Arm® Cortex® processors for enhanced functionality.
The iND87204 aims to meet the growing demand for in-vehicle wireless charging, with the global market estimated at $1.9 billion in 2024 and projected to reach $13.6 billion by 2034, representing a 21.9% CAGR. The SoC offers significant bill of materials savings and simplifies implementation, potentially reducing the footprint and external components by up to 50% compared to existing solutions.
indie Semiconductor (Nasdaq: INDI) ha presentato l'iND87204, un sistema di ricarica wireless per auto di nuova generazione integrato in un chip (SoC) conforme allo standard Qi 2.0 e che supporta la nuova funzione Magnetic Power Profile (MPP). Questa soluzione conforme a Qi2 fornisce fino a 15 watt di potenza e integra più processori Arm® Cortex® per funzionalità avanzate.
L'iND87204 mira a soddisfare la crescente domanda di ricarica wireless in auto, con il mercato globale stimato a 1,9 miliardi di dollari nel 2024 e previsto raggiungere 13,6 miliardi di dollari entro il 2034, rappresentando un 21,9% CAGR. Il SoC offre notevoli risparmi sui costi dei materiali e semplifica l'implementazione, potenzialmente riducendo l'ingombro e i componenti esterni fino al 50% rispetto alle soluzioni esistenti.
indie Semiconductor (Nasdaq: INDI) ha dado a conocer el iND87204, un sistema de carga inalámbrica para automóviles de nueva generación integrado en un chip (SoC) que cumple con el estándar Qi 2.0 y admite la nueva función de Magnetic Power Profile (MPP). Esta solución conforme a Qi2 proporciona hasta 15 vatios de potencia e integra múltiples procesadores Arm® Cortex® para una funcionalidad mejorada.
El iND87204 tiene como objetivo satisfacer la creciente demanda de carga inalámbrica en vehículos, con un mercado global estimado en 1.9 mil millones de dólares en 2024 y proyectado alcanzar 13.6 mil millones de dólares para 2034, lo que representa una CAGR del 21.9%. El SoC ofrece importantes ahorros en la factura de materiales y simplifica la implementación, lo que podría reducir el espacio ocupado y los componentes externos hasta en un 50% en comparación con soluciones existentes.
인디 반도체 (Nasdaq: INDI)가 iND87204를 발표했습니다. 이는 Qi 2.0 표준을 준수하며 새로운 자기 전력 프로필(MPP) 기능을 지원하는 차세대 자동차 무선 충전 시스템 온 칩(SoC)입니다. 이 Qi2-호환 솔루션은 최대 15와트의 전력을 제공하며 기능 향상을 위해 여러 Arm® Cortex® 프로세서를 통합합니다.
iND87204는 차량 내 무선 충전의 증가하는 수요를 충족시키기 위해 설계되었으며, 전 세계 시장은 2024년에 19억 달러로 예상되며 2034년까지 136억 달러에 이를 것으로 추정되고 있습니다. 이는 21.9%의 연평균 성장률(CAGR)을 나타냅니다. 이 SoC는 상당한 자재 비용 절감을 제공하고 구현을 간소화하여 기존 솔루션에 비해 최대 50%의 공간과 외부 부품을 줄일 수 있습니다.
indie Semiconductor (Nasdaq: INDI) a dévoilé le iND87204, un système de charge sans fil automobile de nouvelle génération intégré dans une puce (SoC), conforme à la norme Qi 2.0 et prenant en charge la nouvelle fonctionnalité Magnetic Power Profile (MPP). Cette solution conforme à Qi2 délivre jusqu'à 15 watts de puissance et intègre plusieurs processeurs Arm® Cortex® pour une fonctionnalité améliorée.
Le iND87204 vise à répondre à la demande croissante de charge sans fil dans les véhicules, le marché mondial étant estimé à 1,9 milliard de dollars en 2024 et projeté d'atteindre 13,6 milliards de dollars d'ici 2034, représentant un TAF de 21,9%. Le SoC offre des économies substantielles sur la facture des matériaux et simplifie l'implémentation, pouvant réduire l'encombrement et les composants externes jusqu'à 50% par rapport aux solutions existantes.
indie Semiconductor (Nasdaq: INDI) hat das iND87204 vorgestellt, ein drahtloses Ladesystem der nächsten Generation für Automobile, das als System-on-Chip (SoC) dem Qi 2.0-Standard entspricht und die neue Funktion Magnetic Power Profile (MPP) unterstützt. Diese Qi2-konforme Lösung liefert bis zu 15 Watt Leistung und integriert mehrere Arm® Cortex®-Prozessoren für erweiterte Funktionen.
Das iND87204 zielt darauf ab, der wachsenden Nachfrage nach kabellosem Laden im Fahrzeug gerecht zu werden, wobei der globale Markt für 2024 auf 1,9 Milliarden US-Dollar geschätzt wird und voraussichtlich bis 2034 13,6 Milliarden US-Dollar erreichen wird, was einem CAGR von 21,9% entspricht. Das SoC bietet erhebliche Einsparungen bei den Materialkosten und vereinfacht die Umsetzung, wobei der Platzbedarf und die externen Komponenten im Vergleich zu bestehenden Lösungen um bis zu 50% reduziert werden können.
- Introduction of iND87204, a Qi2 MPP-compliant wireless charging SoC for automotive applications
- Potential 50% reduction in implementation footprint and external bill-of-materials compared to existing solutions
- Global in-car automotive wireless charger market projected to grow from $1.9 billion in 2024 to $13.6 billion by 2034 (21.9% CAGR)
- None.
Insights
The introduction of indie Semiconductor's iND87204 SoC represents a significant leap in automotive wireless charging technology. By integrating Qi2 Magnetic Power Profile (MPP) capability, this chip addresses a important pain point in in-vehicle charging: maintaining optimal alignment during motion. This feature could drastically improve charging efficiency and user experience, potentially driving wider adoption of wireless charging in vehicles.
The chip's high level of integration, including multiple Arm® Cortex® processors and various interfaces, suggests a
With the automotive wireless charger market projected to grow at a
The iND87204 SoC launch aligns perfectly with the growing consumer demand for seamless in-vehicle device charging. The projected market growth from
The chip's compliance with the latest Qi2 standard, including MPP support, gives indie a competitive edge. This could lead to increased adoption by automotive OEMs looking to differentiate their offerings. The 50% reduction in implementation footprint and external bill-of-materials is a significant selling point, potentially allowing indie to capture a larger market share.
The Q4 2024 production release timeline is strategic, allowing indie to capitalize on the early stages of Qi2 adoption in the automotive sector. However, the company's success will depend on its ability to secure partnerships with major automotive manufacturers and maintain its technological lead in this fast-paced market.
- Enables the Qi2 Magnetic Power Profile capability for convenient in-cabin wireless charging
- Compliant with the latest Qi standards, and qualified to automotive AEC-Q100 Grade 2
- Delivers significant bill of materials savings, simplifying implementation complexity and costs
With the growing ubiquity of wireless charging capability within portable devices such as smartphones, tablets and laptops, drivers and passengers now expect the convenience of wireless device charging in their vehicles on the move. WPC’s latest standard featuring the MPP capability will accelerate the demand for automotive wireless charging due to its much-improved charging reliability enabled by maintaining portable devices in the optimal position irrespective of a vehicle’s motion. Enabled by semiconductor technology, the global in-car automotive wireless charger market is estimated1 at
“Drivers and passengers are demanding seamless, rapid and more reliable portable device charging experiences in-vehicle. Building upon the success of our first-generation wireless charging solution iND87200, the iND87204 delivers on this vision, featuring the industry’s highest component integration for a Qi2 MPP-compliant SoC design, while simultaneously reducing the implementation footprint and external bill-of-materials by up to
iND87204 is sampling with lead customers now and will be production released in the fourth quarter of 2024, fully qualified to AEC-Q100 Grade 2.
[1] https://www.factmr.com/report/automotive-wireless-charger-market
About indie
indie is empowering the automotive revolution with next generation semiconductors and software platforms. We focus on developing innovative, high-performance and energy-efficient technology for ADAS, in-cabin user experience and electrification applications. Our mixed-signal SoCs enable edge sensors spanning Radar, LiDAR, Ultrasound, and Computer Vision, while our embedded system control, power management and interfacing solutions transform the in-cabin experience and accelerate increasingly automated and electrified vehicles. We are an approved vendor to Tier 1 partners and our solutions can be found in marquee automotive OEMs worldwide. Headquartered in
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FAQ
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