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SK hynix Inc., a global semiconductor giant, is a leading producer of High-Bandwidth Memory (HBM) chips, making significant investments in the US to build an advanced packaging facility for AI products. With cutting-edge technology in memory chips for AI, SK hynix continues to drive innovation and establish itself as a key player in the semiconductor industry.
SK hynix reported its Q1 2023 financial results, registering revenues of 5.088 trillion won, an operating loss of 3.402 trillion won (67% operating margin), and a net loss of 2.586 trillion won (51% net margin). The unfavorable results were attributed to weakened demand and falling prices of memory chips, leading to a 34% decline in revenue compared to Q4 2022 and a 58% decrease year-over-year. Despite these challenges, the company anticipates revenue growth in Q2 as market conditions improve and sales volume increases. SK hynix aims to enhance its position in the premium memory market with products like DDR5, LPDDR5, and HBM3, and will maintain investment in high-performance memory technology while preparing for the production of cutting-edge 1b nanometer DRAM and 238-layer NAND.
SK hynix has developed the industry's first 12-layer HBM3 product with a remarkable 24GB memory capacity, marking a 50% increase from its previous 16GB model. Currently, customer performance evaluations are ongoing, with plans for mass production preparation to be finalized by the first half of 2023. The new product aims to meet rising demand for high-performance memory driven by the AI sector. Utilizing advanced MR-MUF and TSV technologies, this innovation enhances processing speeds up to 819GB per second. The adoption of HBM3 is expected to increase among major global tech companies, solidifying SK hynix's leadership in the cutting-edge DRAM market.
SK hynix reported FY2022 revenues of 44.648 trillion won and an operating profit of 7.007 trillion won, with a net income of 2.439 trillion won. Despite a 4% revenue increase year-over-year, the company faced its first quarterly operating loss in a decade during Q4 due to low demand and falling memory chip prices. The operating loss for Q4 2022 was 1.701 trillion won, marking a 30% decrease from the previous quarter. Management anticipates a market recovery in the latter part of 2023, driven by demand for new AI technologies and strategic investments in high-capacity DRAM.
SK hynix has unveiled its latest product, the LPDDR5T, touted as the world's fastest mobile DRAM, achieving a data rate of 9.6 Gbps, a 13% increase over its predecessor, LPDDR5X. This new DRAM operates at an ultra-low voltage range of 1.01 to 1.12V, enhancing energy efficiency while boosting performance. Sample products have been sent to customers, and mass production is set for the second half of 2023. The integration of the HKMG process further improves speed and reduces power consumption. The company anticipates expanding the LPDDR5T's application in sectors including AI and AR/VR.
On January 11, 2023, SK hynix announced the industry's first validation of its 1anm DDR5 server memory on the 4th Gen Intel® Xeon® Scalable processor. This milestone, occurring shortly after the processor's launch on January 10, 2023, signifies a pivotal development in server technology. The 1anm DDR5 offers a 20% reduction in power consumption and over 70% better performance compared to DDR4. SK hynix aims to leverage this validation to strengthen its market leadership and cater to the expected surge in demand for high-performance memory chips.
On January 4th, 2023, SK hynix Vice Chairman Park Jung-ho met with Qualcomm CEO Cristiano Amon at CES 2023 in Las Vegas. The meeting focused on enhancing collaboration in the semiconductor industry as Qualcomm expands into automotive and IoT markets. The executives discussed future industry trends and emphasized the importance of cooperation beyond borders and industries. SK hynix aims to explore various business opportunities through partnerships with global tech companies.
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