GBT’s 3D, Multiplanar IC Continuation Patent Application Received an Issue Notification, expected to be Granted on August 9, 2022
GBT Technologies Inc. (GTCH) announced the receipt of an issue notification from the USPTO for its 3D, Multi-Planar IC design patent application, expected to be issued on August 9, 2022. This marks GBT's second patent application in this innovative microchip architecture, aimed at reducing silicon usage while enhancing performance and lowering costs. The company's first patent was granted in December 2020. While the new patent seeks to broaden IP protection, success in research, development, and commercialization remains uncertain, contingent on adequate capital and strategic partnerships.
- Second patent application for 3D, Multi-Planar IC design enhances IP protection.
- Potential for cost reduction and improved performance in microchip technology.
- First patent granted in December 2020 demonstrates prior advancement.
- No guarantee of successful technology development or implementation.
- Need for significant capital to support ongoing research.
- Lack of certainty in establishing partnerships for product commercialization.
This second 3D, MP microchip Application Seeks to Further Strengthen GBT’s Multi-Dimensional Integrated Circuits Design and Manufacturing Concept
SAN DIEGO, Aug. 09, 2022 (GLOBE NEWSWIRE) -- GBT Technologies Inc. (OTC PINK: GTCH) ("GBT” or the “Company”), received an issue notification from the United States Patent and Trademark Office (“USPTO”) for its 3D, Multi-Planar IC design and manufacturing technology continuation patent application. The continuation patent is expected to be issued as a patent on August 9, 2022. This would be GBT’s second patent application for its 3D, MP microchip architecture. The original invention presents a new way to design and manufacture integrated circuits to fit advanced analog, digital, and mixed type ICs on a silicon wafer. These methods seek to enable advanced microchip’s design and manufacturing using less silicon space with the goal of cost reduction, lower power consumption and better performance. The Company’s first 3D microchip patent was filed on March 5, 2019, and was granted as of December 1, 2020, by the USPTO; U.S. Patent No. 10,854,763. The continuation application, assigned number 17102928, was filed on January 14, 2022, and is targeted to broaden the protection of the main IP concepts. The 3D, multidimensional design seeks to enable more space on the silicon wafer, which, if successful, would allow for packing more circuitries within microchips. The goal of the new architecture is to develop a new generation of microchips. GBT is now conducting further research to file an additional continuation patent application in this domain.
“This would be GBT’s second patent in the 3D, multi-planar microchip design and manufacturing domain. We believe the intellectual property we are seeking to protect with our existing patent and additional continuation applications has the capability to alleviate the disadvantages of traditional ICs design and manufacturing methodologies by providing new, multi-dimensional approach. We believe this intellectual property, if fully developed, has the capability to offer design and manufacturing capabilities of ICs within a smaller space, with higher performance and lower cost. Due to the multi-planar connectivity configuration, we believe that the integrated circuits will consume less power and perform in higher speeds. The continuation application seeks to strengthen the technology’s concepts and IP protection. As microchips are continuously getting more advanced there is a need for a breakthrough technology to enable much larger silicon utilization with higher performance and lower cost. We strongly believe that this patent has the potential to revolutionize IC design and manufacturing with the goal of becoming the future industry’s standard” stated Danny Rittman, GBT’s CTO.
There is no guarantee that the Company will be successful in researching, developing or implementing this technology. In order to successfully implement this concept, the Company will need to raise adequate capital to support its research and, if successfully researched, developed and granted regulatory approval, the Company would need to enter into a strategic relationship with a third party that has experience in manufacturing, selling and distributing this product. There is no guarantee that the Company will be successful in any or all of these critical steps.
About Us
GBT Technologies, Inc. (OTC PINK: GTCH) (“GBT”) (http://gbtti.com) is a development stage company which considers itself a native of Internet of Things (IoT), Artificial Intelligence (AI) and Enabled Mobile Technology Platforms used to increase IC performance. GBT has assembled a team with extensive technology expertise and is building an intellectual property portfolio consisting of many patents. GBT’s mission is to license the technology and IP to synergetic partners in the areas of hardware and software. Once commercialized, it is GBT’s goal to have a suite of products including smart microchips, AI, encryption, Blockchain, IC design, mobile security applications, database management protocols, with tracking and supporting cloud software (without the need for GPS). GBT envisions this system as a creation of a global mesh network using advanced nodes and super performing new generation IC technology. The core of the system will be its advanced microchip technology; technology that can be installed in any mobile or fixed device worldwide. GBT’s vision is to produce this system as a low cost, secure, private-mesh-network between all enabled devices. Thus, providing shared processing, advanced mobile database management and sharing while using these enhanced mobile features as an alternative to traditional carrier services.
Forward-Looking Statements
Certain statements contained in this press release may constitute "forward-looking statements". Forward-looking statements provide current expectations of future events based on certain assumptions and include any statement that does not directly relate to any historical or current fact. Actual results may differ materially from those indicated by such forward-looking statements because of various important factors as disclosed in our filings with the Securities and Exchange Commission located at their website (http://www.sec.gov). In addition to these factors, actual future performance, outcomes, and results may differ materially because of more general factors including (without limitation) general industry and market conditions and growth rates, economic conditions, governmental and public policy changes, the Company’s ability to raise capital on acceptable terms, if at all, the Company’s successful development of its products and the integration into its existing products and the commercial acceptance of the Company’s products. The forward-looking statements included in this press release represent the Company's views as of the date of this press release and these views could change. However, while the Company may elect to update these forward-looking statements at some point in the future, the Company specifically disclaims any obligation to do so. These forward-looking statements should not be relied upon as representing the Company's views as of any date subsequent to the date of the press release.
Contact:
Dr. Danny Rittman, CTO
press@gopherprotocol.com
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