Diodes Incorporated to Acquire onsemi’s South Portland, Maine Wafer Fabrication Facility and Operations
Diodes Incorporated (NASDAQ: DIOD) has entered a definitive agreement to acquire onsemi's South Portland wafer fabrication facility in Maine, enhancing its analog product capacity. This addition will bolster Diodes' manufacturing operations in the automotive and industrial markets, supporting growth initiatives amid increasing customer demand. The transaction is anticipated to close in Q2 2022, pending customary conditions. This strategic move aims to improve operational flexibility and strengthen Diodes' competitive advantage in a supply-constrained environment.
- Enhances capacity for analog products, supporting growth in automotive and industrial markets.
- Strengthens global manufacturing operations alongside existing facilities in Asia and Europe.
- Potential for significant revenue and profit growth aligned with strategic objectives.
- Transaction completion is subject to customary closing conditions, which may present risks.
- Integration challenges could arise with the addition of the South Portland Facility and its employees.
- Expected benefits of the acquisition, including cost savings and revenue growth, may not be realized.
The South Portland Facility (SPFAB) offers Diodes additional 200mm wafer fab capacity for analog products to accelerate its growth initiatives in the automotive and industrial end markets. This US-based facility, together with Diodes’ existing wafer fabrication facilities in
“The proposed acquisition of the South Portland Facility aligns well with our strategic objective for significant revenue and profit dollar growth over the next several years,” said Dr.
The closing of the South Portland Facility transaction is subject to customary closing conditions and is expected to be completed in the second quarter of 2022. Following the close, Diodes will integrate the South Portland Facility as well as its operations and employees.
About
Cautions Regarding Forward-Looking Statements: Certain statements contained herein, including, among others, the expected closing of the transactions and the potential effects thereof, are forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Forward-looking statements involve risks and uncertainties that could cause actual results to differ materially from those projected. Forward-looking statements are often characterized by the use of words such as “believes,” “estimates,” “expects,” “projects,” “may,” “will,” “intends,” “plans,” “should,” or “anticipates,” and similar expressions. All forward-looking statements contained herein are made as of the date hereof, and are based on Diodes’ current expectations, forecasts, estimates and assumptions as well as on information available to Diodes as of such date. These forward-looking statements involve risks, uncertainties and other factors that could cause results or events to differ materially from those expressed in the forward-looking statements. Among these, such risks and uncertainties include, but are not limited to, risks relating to the possibility that the transaction may not be consummated, including as a result of any of the conditions precedent (including the failure to obtain any required approvals or consents); the risk of global market downturn conditions and volatilities impacting the completion of the acquisition; the risk that SPFAB will not be integrated successfully into Diodes’ overall business; the risk that the expected benefits of the acquisition may not be realized, including the realization of the accretive effect of the acquisition, the realization of the anticipated cost savings, revenue and profit dollar growth prospects and any other synergies expected from the acquisition and the expected benefits of the new multi-year wafer supply agreement; the risk that SPFAB’s standards, procedures and controls will not be brought into conformance within Diodes’ operation; difficulties in transitioning and retaining SPFAB employees following the acquisition; difficulties in consolidating facilities and transferring processes and know-how; the diversion of our management’s attention from the management of our current business; Diodes may not be able to maintain its current growth strategy or continue to maintain its current performance, costs and loadings in its manufacturing facilities; risks of domestic and foreign operations, including excessive operation costs, labor shortages, changes in tax rates; the impact of competition and other risk factors relating to our industry and business. Additional risk factors are as discussed from time to time in Diodes’ filings with the
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Company Contact:
Director, IR & Corporate Marketing
P: 408-232-9003
E: Gurmeet_Dhaliwal@diodes.com
Investor Relations Contact:
President, Investor Relations
P: 949-224-3874
E: lsievers@sheltongroup.com
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