DuPont™ Pyralux® ML Wins New Product Introduction (NPI) Award from Circuits Assembly
DuPont has announced that its Pyralux® ML Series of double-sided metal-clad laminates has won the 2025 NPI Award in the Laminates category from Circuits Assembly. The award, presented by the Printed Circuit Engineering Association (PCEA), recognizes innovative products in electronics assembly.
Launched in April 2024, Pyralux® ML laminates are designed for flexible and rigid-flex printed circuit boards (PCBs), specifically targeting high-reliability markets including aerospace, defense, electric vehicles, and AI-related networking. The laminates feature metal alloy components like copper-nickel (CuNi) and Kapton® all-polyimide dielectric technology, offering optimized resistivity and thermal management capabilities.
The evaluation criteria included innovation, compatibility, cost-effectiveness, design, reliability, flexibility, performance, and speed. According to Global Business Director Thean Ming Tan, the product is proving to be premier for optimizing thermal management in high-performance applications.
DuPont ha annunciato che la sua serie di laminati metal-clad a doppio lato, Pyralux® ML Series, ha vinto il premio NPI 2025 nella categoria Laminati da Circuits Assembly. Il premio, presentato dall'Associazione di Ingegneria dei Circuiti Stampati (PCEA), riconosce prodotti innovativi nell'assemblaggio elettronico.
Lanciati nell'aprile 2024, i laminati Pyralux® ML sono progettati per schede di circuiti stampati (PCB) flessibili e rigidi-flessibili, mirando specificamente a mercati ad alta affidabilità, tra cui aerospazio, difesa, veicoli elettrici e networking legato all'IA. I laminati presentano componenti in lega metallica come rame-nichel (CuNi) e tecnologia dielettrica all-polyimide Kapton®, offrendo una resistenza ottimizzata e capacità di gestione termica.
I criteri di valutazione includevano innovazione, compatibilità, costo-efficacia, design, affidabilità, flessibilità, prestazioni e velocità. Secondo il Direttore Globale delle Attività Thean Ming Tan, il prodotto si sta dimostrando eccellente per ottimizzare la gestione termica in applicazioni ad alte prestazioni.
DuPont ha anunciado que su serie de laminados metálicos de doble cara, Pyralux® ML Series, ha ganado el premio NPI 2025 en la categoría de Laminados de Circuits Assembly. El premio, presentado por la Asociación de Ingeniería de Circuitos Impresos (PCEA), reconoce productos innovadores en el ensamblaje de electrónica.
Lanzados en abril de 2024, los laminados Pyralux® ML están diseñados para placas de circuitos impresos (PCB) flexibles y rígidos-flexibles, enfocándose específicamente en mercados de alta fiabilidad, incluyendo aeroespacial, defensa, vehículos eléctricos y redes relacionadas con la IA. Los laminados cuentan con componentes de aleación metálica como cobre-níquel (CuNi) y tecnología dieléctrica de poliamida completa Kapton®, ofreciendo resistividad optimizada y capacidades de gestión térmica.
Los criterios de evaluación incluían innovación, compatibilidad, rentabilidad, diseño, fiabilidad, flexibilidad, rendimiento y velocidad. Según el Director Global de Negocios Thean Ming Tan, el producto está demostrando ser excelente para optimizar la gestión térmica en aplicaciones de alto rendimiento.
듀폰은 자사의 Pyralux® ML 시리즈 이중면 금속 클랩 라미네이트가 Circuits Assembly의 라미네이트 부문에서 2025 NPI 상을 수상했다고 발표했습니다. 이 상은 인쇄 회로 공학 협회(PCEA)에서 수여하며, 전자 조립 분야의 혁신적인 제품을 인정합니다.
2024년 4월에 출시된 Pyralux® ML 라미네이트는 유연하고 경량의 인쇄 회로 기판(PCB)을 위해 설계되었으며, 항공 우주, 방위, 전기차 및 AI 관련 네트워킹을 포함한 고신뢰성 시장을 목표로 하고 있습니다. 이 라미네이트는 구리-니켈(CuNi)과 Kapton® 전량 폴리이미드 유전체 기술과 같은 금속 합금 구성 요소를 특징으로 하여 최적화된 저항성과 열 관리 기능을 제공합니다.
평가 기준에는 혁신성, 호환성, 비용 효율성, 디자인, 신뢰성, 유연성, 성능 및 속도가 포함되었습니다. 글로벌 비즈니스 이사인 Thean Ming Tan에 따르면, 이 제품은 고성능 애플리케이션에서 열 관리를 최적화하는 데 뛰어난 성능을 보이고 있습니다.
DuPont a annoncé que sa série de laminés métalliques à double face, Pyralux® ML Series, a remporté le prix NPI 2025 dans la catégorie Laminés de Circuits Assembly. Le prix, remis par l'Association d'Ingénierie des Circuits Imprimés (PCEA), reconnaît les produits innovants dans l'assemblage électronique.
Lancée en avril 2024, la série de laminés Pyralux® ML est conçue pour des cartes de circuits imprimés (PCB) flexibles et rigides-flexibles, ciblant spécifiquement les marchés à haute fiabilité, y compris l'aérospatiale, la défense, les véhicules électriques et les réseaux liés à l'IA. Les laminés présentent des composants en alliage métallique tels que le cuivre-nickel (CuNi) et la technologie diélectrique polyimide Kapton®, offrant une résistivité optimisée et des capacités de gestion thermique.
Les critères d'évaluation comprenaient l'innovation, la compatibilité, le rapport coût-efficacité, le design, la fiabilité, la flexibilité, la performance et la rapidité. Selon le directeur commercial mondial Thean Ming Tan, le produit s'avère être excellent pour optimiser la gestion thermique dans des applications de haute performance.
DuPont hat angekündigt, dass seine Pyralux® ML Series von doppelseitigen metallbeschichteten Laminaten den NPI Award 2025 in der Kategorie Laminaten von Circuits Assembly gewonnen hat. Der Preis, der von der Printed Circuit Engineering Association (PCEA) verliehen wird, erkennt innovative Produkte im Bereich der Elektronikmontage an.
Die im April 2024 eingeführten Pyralux® ML Laminaten sind für flexible und starr-flexible Leiterplatten (PCBs) konzipiert und richten sich speziell an Märkte mit hoher Zuverlässigkeit, darunter Luft- und Raumfahrt, Verteidigung, Elektrofahrzeuge und KI-bezogene Netzwerke. Die Laminaten verfügen über Metalllegierungskomponenten wie Kupfer-Nickel (CuNi) und Kapton® All-Polyimid-Dielektrik-Technologie, die optimierte Widerstandsfähigkeit und thermische Managementfähigkeiten bieten.
Die Bewertungskriterien umfassten Innovation, Kompatibilität, Kosteneffizienz, Design, Zuverlässigkeit, Flexibilität, Leistung und Geschwindigkeit. Laut dem Global Business Director Thean Ming Tan erweist sich das Produkt als hervorragend zur Optimierung des thermischen Managements in Hochleistungsanwendungen.
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Award Recognizes the Leading New Products for Electronics Assembly
Launched in April 2024, Pyralux® ML laminates are a unique addition to the extensive family of Pyralux® laminates for flexible and rigid-flex printed circuit boards (PCBs). Developed for optimal thermal management, these laminates are an ideal solution for high-reliability markets such as aerospace, defense, electric vehicles (EVs), artificial intelligence (AI)-related networking and other electronic devices. The Pyralux® ML laminate series provides exceptional performance in challenging environments, making it a versatile and innovative solution for many different applications.
Evaluations were based on a variety of criteria including creativity and innovation, compatibility with existing technology, cost-effectiveness, design, expected reliability, flexibility, performance, user-friendliness, and speed/throughput. DuPont's trailblazing Pyralux® ML laminates contain metal alloy, such as copper-nickel (CuNi), featuring Kapton® all-polyimide dielectric technology. The alloys provide optimized resistivity for higher heat output, reduced thermal conductivity for better control of heat transfer, and thermoelectric properties as needed for the application.
"I'm thrilled that our Pyralux® team has been recognized for their tremendous work on this innovative technology," said Thean Ming Tan, Global Business Director, Advanced Flex Technologies, DuPont Interconnect Solutions. "Pyralux® ML is proving to be the premiere product for optimizing thermal management, a key performance factor for industries with high-performance, high-reliability requirements including aerospace, defense and critical industrial applications. Receiving this honor from a panel of industry experts underscores the value our products provide for our customers."
To learn more about DuPont's Pyralux® ML laminates and other offerings, visit DuPont Interconnect Solutions at IPC APEX Expo. The company will exhibit and present PowerChats in the Insulectro Technology Village, Booth 4138, and will share Booth 3916 with Tritek Circuit Products.
To learn more about the award, please visit the Circuits Assembly website.
About DuPont Electronics & Industrial
DuPont Electronics & Industrial is a global supplier of new technologies and performance materials serving the semiconductor, circuit board, display, digital and flexographic printing, healthcare, aerospace, industrial, and transportation industries. From advanced technology centers worldwide, teams of talented research scientists and application experts work closely with customers, providing solutions, products and technical service to enable next-generation technologies. http://electronics.dupont.com
About DuPont
DuPont (NYSE: DD) is a global innovation leader with technology-based materials and solutions that help transform industries and everyday life. Our employees apply diverse science and expertise to help customers advance their best ideas and deliver essential innovations in key markets including electronics, transportation, construction, water, healthcare and worker safety. More information about the company, its businesses and solutions can be found at www.dupont.com. Investors can access information included on the Investor Relations section of the website at investors.dupont.com.
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SOURCE DuPont
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